公开(公告)号：US10546732B2

公开(公告)日：2020-01-28

申请号：US15033868

申请日：2013-11-05

Applicant: Applied Materials, Inc.

Inventor： Stefan Keller ,  Uwe Schüβler ,  Dieter Haas ,  Stefan Bangert

IPC: H01J37/34 ,  C23C14/35 ,  H01J37/32

Abstract: A sputter deposition source for sputter deposition in a vacuum chamber is described. The source includes a wall portion of the vacuum chamber; a target providing a material to be deposited during the sputter deposition; an RF power supply for providing RF power to the target; a power connector for connecting the target with the RF power supply; and a conductor rod extending through the wall portion from inside of the vacuum chamber to outside of the vacuum chamber, wherein the conductor rod is connected to one or more components inside of the vacuum chamber and wherein the conductor rod is connected to the RF power supply outside of the vacuum chamber to generate a defined RF return path through the conductor rod.

公开(公告)号：US09899635B2

公开(公告)日：2018-02-20

申请号：US15113752

申请日：2014-02-04

Applicant: Applied Materials, Inc.

Inventor： Stefan Bangert ,  Uwe Schüβler ,  Jose Manuel Dieguez-Campo ,  Dieter Haas

IPC: H01L51/40 ,  H01L51/56 ,  C23C14/04 ,  C23C14/12 ,  C23C14/24 ,  C23C14/50 ,  C23C14/56 ,  H01L51/00

CPC classification number: H01L51/56 ,  B05D1/60 ,  C23C14/042 ,  C23C14/12 ,  C23C14/243 ,  C23C14/246 ,  C23C14/505 ,  C23C14/56 ,  C23C14/562 ,  C23C14/564 ,  C23C14/566 ,  C23C14/568 ,  H01L21/67173 ,  H01L21/67196 ,  H01L21/67271 ,  H01L21/67712 ,  H01L21/67718 ,  H01L21/67727 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/6776 ,  H01L51/001 ,  H01L51/0011

Abstract: A system for depositing one or more layers, particularly layers including organic materials therein, is described. The system includes a load lock chamber for loading a substrate to be processed, a transfer chamber for transporting the substrate, a vacuum swing module provided between the load lock chamber and the transfer chamber, at least one deposition apparatus for depositing material in a vacuum chamber of the at least one deposition chamber, wherein the at least one deposition apparatus is connected to the transfer chamber; a further load lock chamber for unloading the substrate that has been processed, a further transfer chamber for transporting the substrate, a further vacuum swing module provided between the further load lock chamber and the further transfer chamber, and a carrier return track from the further vacuum swing module to the vacuum swing module, wherein the carrier return track is configured to transport the carrier under vacuum conditions and/or under a controlled inert atmosphere.