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公开(公告)号：US20140144169A1
公开(公告)日：2014-05-29
申请号：US14131230
申请日：2012-07-05
IPC分类号： H05K7/20
CPC分类号： H05K7/20309 , F28D15/0266 , G06F1/20 , G06F2200/201 , H05K7/20318 , H05K7/20727 , H05K7/20818
摘要： A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrigerant flowing; an upper part evaporator, arranged between the upper part header and the middle header, including an upper part steam generating tube having a first flow path for leading a refrigerant of the middle header to the upper part header while making the refrigerant of the middle header perform heat exchange with outside air and having a second flow path for leading a refrigerant of the lower part header to the upper part header while making the refrigerant of the lower part header perform heat exchange with outside air; and a lower part evaporator, arranged between the lower part header and the middle header, including a lower part steam generating tube having a third flow path inserted into the middle header while making a refrigerant of the lower part header perform heat exchange with outside air, the lower part steam generating tube communicated with the second flow path of the upper part steam generating tube.
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公开(公告)号：US20130188314A1
公开(公告)日：2013-07-25
申请号：US13824908
申请日：2011-08-31
CPC分类号： H05K7/20363 , F28D15/0233 , F28D15/025 , F28D15/0275 , F28F3/02 , F28F13/06 , F28F13/18 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A vapor phase cooling apparatus (10) includes: a housing (11) including a heat receiver (14a) configured to receive heat generated by an electronic component (50) that is a heat generating source, the electronic component (50) being connected to a vertical outer surface on the +Z side of the housing, the housing including an internal space for enclosing refrigerant; and a first heat sink (21) and a second heat sink (22) that are disposed on the +Y side and the −Y side from the electronic component (50) and that dissipate heat to the outside. Both ends of the first heat sink (21) and the second heat sink (22) in X direction extend further along the surface on the +Z side than both ends of the heat receiver (14a) in X direction.
摘要翻译： 气相冷却装置（10）包括：壳体（11），其包括被配置为接收由作为发热源的电子部件（50）产生的热量的热接收器（14a），所述电子部件（50）连接到 壳体的+ Z侧的垂直外表面，壳体包括用于封闭制冷剂的内部空间; 以及设置在电子部件（50）的+ Y侧和-Y侧的第一散热器（21）和第二散热器（22），并且向外部散热。 X方向上的第一散热器21和第二散热器22的两端沿X方向沿着热接收器14a的两端向+ Z侧的面延伸。
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公开(公告)号：US20130056178A1
公开(公告)日：2013-03-07
申请号：US13698149
申请日：2011-05-17
IPC分类号： F28D15/02
CPC分类号： H01L23/427 , F28D15/0233 , F28D15/0283 , F28F13/187 , H01L2924/0002 , H01L2924/00
摘要： An ebullient cooling device includes a chamber, a heat sink, a heat receiving member, and a heat dissipating member. The chamber includes a heat conducting plate with a heat generating body on an outer side surface thereof, and an airtight space filled with coolant that undergoes a phase change between liquid and gas, on an inner side of the heat conducting plate. The heat sink is provided on the outer side surface of the heat conducting plate. The heat receiving member is provided on an inner side surface of the heat conducting plate so as to oppose the heat generating body with the heat conducting plate sandwiched therebetween, and transfers heat generated at the heat generating body to the coolant. The heat dissipating member is provided on the inner side surface of the heat conducting plate, receives heat transferred by the coolant, and dissipates the heat to the heat sink.
摘要翻译： 沸腾冷却装置包括室，散热器，受热构件和散热构件。 该室包括在其外侧表面上具有发热体的导热板和在导热板的内侧上填充有在液体和气体之间发生相变的冷却剂的气密空间。 散热器设置在导热板的外侧面上。 热传导部件设置在导热板的内侧表面上，以与发热体相对的导热板夹在其间，将发热体产生的热量传递给冷却剂。 散热构件设置在导热板的内侧表面上，接收由冷却剂传递的热量，并将热量散发到散热器。
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公开(公告)号：US09288931B2
公开(公告)日：2016-03-15
申请号：US14131230
申请日：2012-07-05
CPC分类号： H05K7/20309 , F28D15/0266 , G06F1/20 , G06F2200/201 , H05K7/20318 , H05K7/20727 , H05K7/20818
摘要： A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrigerant flowing; an upper part evaporator, arranged between the upper part header and the middle header, including an upper part steam generating tube having a first flow path for leading a refrigerant of the middle header to the upper part header while making the refrigerant of the middle header perform heat exchange with outside air and having a second flow path for leading a refrigerant of the lower part header to the upper part header while making the refrigerant of the lower part header perform heat exchange with outside air; and a lower part evaporator, arranged between the lower part header and the middle header, including a lower part steam generating tube having a third flow path inserted into the middle header while making a refrigerant of the lower part header perform heat exchange with outside air, the lower part steam generating tube communicated with the second flow path of the upper part steam generating tube.
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公开(公告)号：US20130206368A1
公开(公告)日：2013-08-15
申请号：US13880252
申请日：2011-10-14
CPC分类号： F28D15/02 , B23P15/26 , F28D15/0266 , F28F13/187 , H01L23/427 , H01L2924/0002 , Y10T29/49359 , H01L2924/00
摘要： In a cooling device using an ebullient cooling system, the cooling performance adversely decreases if the evaporator includes projections activating the convection heat transfer and the bubble nuclei are formed on the inner wall surface, therefore, a cooling device according to an exemplary aspect of the invention includes an evaporator storing a refrigerant; a condenser condensing and liquefying a vapor-state refrigerant vaporized in the evaporator and radiating heat; and a connection connecting the evaporator and the condenser; wherein the evaporator includes a base thermally contacting with an object to be cooled, and a container; the base includes a plurality of projections on a boiling surface of a surface at an inner wall side contacting with the refrigerant; and a bubble nucleus forming surface is included only on a part of a refrigerant contacting surface including the boiling surface and the surface of the projections.
摘要翻译： 在使用沸腾冷却系统的冷却装置中，如果蒸发器包括启动对流热传递的凸起并且在内壁表面上形成气泡核，则冷却性能不利地降低，因此，根据本发明的示例性方面的冷却装置 包括存储制冷剂的蒸发器; 冷凝和液化在蒸发器中蒸发并蒸发热的蒸气状制冷剂的冷凝器; 以及连接蒸发器和冷凝器的连接件; 其中所述蒸发器包括与要冷却的物体热接触的基座和容器; 基部包括在与制冷剂接触的内壁侧的表面的沸腾面上的多个突起部; 并且气泡核形成表面仅包括在包括沸腾表面和突起的表面的制冷剂接触表面的一部分上。
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公开(公告)号：US09386724B2
公开(公告)日：2016-07-05
申请号：US13824908
申请日：2011-08-31
CPC分类号： H05K7/20363 , F28D15/0233 , F28D15/025 , F28D15/0275 , F28F3/02 , F28F13/06 , F28F13/18 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A vapor phase cooling apparatus (10) includes: a housing (11) including a heat receiver (14a) configured to receive heat generated by an electronic component (50) that is a heat generating source, the electronic component (50) being connected to a vertical outer surface on the +Z side of the housing, the housing including an internal space for enclosing refrigerant; and a first heat sink (21) and a second heat sink (22) that are disposed on the +Y side and the −Y side from the electronic component (50) and that dissipate heat to the outside. Both ends of the first heat sink (21) and the second heat sink (22) in X direction extend further along the surface on the +Z side than both ends of the heat receiver (14a) in X direction.
摘要翻译： 气相冷却装置（10）包括：壳体（11），其包括被配置为接收由作为发热源的电子部件（50）产生的热量的热接收器（14a），所述电子部件（50）连接到 壳体的+ Z侧的垂直外表面，壳体包括用于封闭制冷剂的内部空间; 以及设置在电子部件（50）的+ Y侧和-Y侧的第一散热器（21）和第二散热器（22），并且向外部散热。 X方向上的第一散热器21和第二散热器22的两端沿X方向沿着热接收器14a的两端向+ Z侧的面延伸。
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公开(公告)号：US20150034288A1
公开(公告)日：2015-02-05
申请号：US14349034
申请日：2012-09-26
IPC分类号： F28F3/12
CPC分类号： F28F3/12 , F28D15/0233 , F28D2015/0216 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： In a cooling device using an ebullient cooling system, a cooling device becomes larger when a degree of freedom of the arrangement in installing it in electronic equipment is increased, and that it is impossible to obtain a sufficient degree of freedom of the arrangement, therefore, a flat plate cooling device according to an exemplary aspect of the invention includes a plate-like container including a first flat plate and a second flat plate opposite to the first flat plate; a refrigerant enclosed in the plate-like container; and a guiding wall unit connecting the first flat plate to the second flat plate and controlling a flow of the refrigerant in the plate-like container; wherein the plate-like container includes a heat receiving area which is thermally connected to a heating element disposed on at least one of the first flat plate and the second flat plate; and the guiding wall unit includes a pair of guiding walls, and the guiding walls are disposed on opposite sides of the heat receiving area.
摘要翻译： 在使用沸腾冷却系统的冷却装置中，当安装在电子设备中的布置的自由度增加时，冷却装置变大，并且不可能获得足够的布置自由度， 根据本发明的示例性方面的平板冷却装置包括：板状容器，包括第一平板和与第一平板相对的第二平板; 封闭在板状容器中的制冷剂; 以及引导壁单元，其将所述第一平板连接到所述第二平板并控制所述板状容器中的制冷剂的流动; 其特征在于，所述板状容器具有与设置在所述第一平板和所述第二平板中的至少一个上的加热元件热连接的热接收区域， 并且导向壁单元包括一对导向壁，并且引导壁设置在受热区域的相对侧上。
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公开(公告)号：US20140165638A1
公开(公告)日：2014-06-19
申请号：US14235951
申请日：2012-07-20
IPC分类号： H05K7/20
CPC分类号： H05K7/20309 , F28D15/0266 , F28D2021/0028 , H01L23/427 , H01L2224/16 , H05K7/20318
摘要： A cooling device employing a boiling cooling method cannot exhibit sufficient cooling performance when it is installed in a low-profile electronic device.A cooling device of the present invention comprises an evaporation unit which contains a refrigerant, a condensation unit which performs heat radiation by condensing and liquefying vapor-phase refrigerant which was vaporized at the evaporation unit, and piping which connects the evaporation unit with the condensation unit; wherein the evaporation unit comprises an evaporation container and a partition wall section which is arranged within the evaporation container and constitutes a flow path of the refrigerant, and the height of the partition wall section is equal to or larger than the height of the vapor-liquid interface of the refrigerant and is smaller than the height of the evaporation container.
摘要翻译： 采用沸腾冷却方法的冷却装置安装在薄型电子装置中时不能表现出足够的冷却性能。 本发明的冷却装置包括：蒸发单元，其包含制冷剂;冷凝单元，其通过冷凝和液化在所述蒸发单元处蒸发的气相制冷剂进行散热;以及管道，其将所述蒸发单元与所述冷凝单元连接 ; 其中所述蒸发单元包括蒸发容器和分隔壁部分，所述分隔壁部分布置在所述蒸发容器内并构成所述制冷剂的流动路径，并且所述分隔壁部分的高度等于或大于所述气液体的高度 制冷剂的界面小于蒸发容器的高度。
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公开(公告)号：US20130319639A1
公开(公告)日：2013-12-05
申请号：US14000681
申请日：2012-02-17
CPC分类号： F28D15/00 , B23P15/26 , F28D15/0266 , F28D15/0275 , F28F3/02 , H01L23/427 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： In a cooling device using an ebullient cooling system, it is difficult to improve the cooling performance without increasing manufacturing costs, therefore, a cooling device according to an exemplary aspect of the invention includes a heat receiving unit storing a refrigerant and receiving the heat from an object to be cooled; a heat radiating unit radiating heat by condensing and liquefying a vapor-state refrigerant arising from a refrigerant vaporizing in the heat receiving unit; and a connection connecting the heat receiving unit to the heat radiating unit; wherein the heat receiving unit includes a base thermally contacting with the object to be cooled, and a container connected to the connection; the base includes a heat receiving unit outer wall composing a part of an outer wall of the heat receiving unit, and a plurality of projections disposed on a heat receiving unit undersurface of an undersurface at an inner wall side contacting with the refrigerant; the base includes a bubble nucleus forming surface on a refrigerant contacting surface composed of the heat receiving unit undersurface and the surface of the projection; and the heat receiving unit includes a vapor-state refrigerant region containing a vapor-state refrigerant between the top edge of the projection and one of inner wall surfaces of the container facing the heat receiving unit undersurface.
摘要翻译： 在使用沸腾冷却系统的冷却装置中，难以提高冷却性能而不增加制造成本，因此，根据本发明的示例性方面的冷却装置包括：储存制冷剂的热量接收单元， 待冷却物体; 散热单元，其通过冷凝和液化在所述受热单元中蒸发的制冷剂产生的蒸气状制冷剂来散热; 以及将热接收单元连接到散热单元的连接; 其中所述热接收单元包括与待冷却物体热接触的基座和连接到所述连接件的容器; 所述基座包括构成所述受热单元的外壁的一部分的受热单元外壁和在与所述制冷剂接触的内壁侧的下表面的受热单元下表面上的多个突起; 底座包括由热接收单元下表面和突起的表面构成的制冷剂接触表面上的气泡核形成表面; 并且所述受热单元包括在所述突起的顶部边缘和所述容器的面对所述受热单元下表面的内壁表面之一中包含蒸气状态的制冷剂的蒸汽状态的制冷剂区域。
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公开(公告)号：US09363886B2
公开(公告)日：2016-06-07
申请号：US14240348
申请日：2012-08-15
CPC分类号： H05K1/021 , F28D15/0266 , G06F1/20 , H05K7/2029
摘要： An electronic substrate has a tabular base material which can install a heater element and a cooling structure that cools the heater element. The electronic substrate can be plugged in/out in a case in the direction which is almost parallel to the face of the base material. The cooling structure has a first heat radiation part with a hollow shape and a heat transfer part. The first heat radiation part radiates the generated heat of a heater element installed in the base material. A heat transfer part transfers the generated heat to the first heat radiation part. The first heat radiation part has a first joint surface formed along a face which is almost vertical to the insert and removal direction of the base material. The first heat radiation part is connected to a second radiation part set up in the case thermally through the first joint surface.
摘要翻译： 电子基板具有片状基材，其可以安装加热元件和冷却加热器元件的冷却结构。 电子基板可以在几乎平行于基材的表面的方向上被插入/插出。 冷却结构具有中空形状的第一散热部和传热部。 第一散热部照射安装在基材中的加热元件的发热。 传热部将所产生的热量传递到第一散热部。 第一散热部具有沿着与基材的插入和移除方向几乎垂直的面形成的第一接合面。 第一散热部分连接到第二辐射部分，该第二辐射部分在热穿过第一接合表面的情况下设置。
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