公开(公告)号：US09275938B1

公开(公告)日：2016-03-01

申请号：US14016728

申请日：2013-09-03

Applicant: Arkansas Power Electronics International, Inc.

Inventor： Brice McPherson ,  Brandon Passmore ,  Adam Barkley ,  Robert Shaw

IPC: H01L23/48 ,  H01L23/495

CPC classification number: H01L23/3735 ,  H01L23/051 ,  H01L23/4006 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/2732 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/33505 ,  H01L2224/83065 ,  H01L2224/83192 ,  H01L2224/83815 ,  H01L2224/97 ,  H01L2924/13091 ,  H01L2924/30101 ,  H01L2924/30107 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2924/00

Abstract: A wire bondless, double flip chipped discrete power package including a base plate for structural support, heat spreading, and thermal connection, power substrate for electrical interconnection and isolation, lead frames for external connections, an upper substrate for topside electrical interconnection, and injection molded housing for mounting, isolation, and protection.

Abstract translation: 一种无引线接合的双倒装芯片分立功率封装，包括用于结构支撑的基板，热扩散和热连接，用于电互连和隔离的电源基板，用于外部连接的引线框架，用于顶部电互连的上基板和注塑成型 外壳用于安装，隔离和保护。

公开(公告)号：US09407251B1

公开(公告)日：2016-08-02

申请号：US14100288

申请日：2013-12-09

Applicant: Arkansas Power Electronics International, Inc.

Inventor： Brandon Passmore ,  Zach Cole ,  Bret Whitaker ,  Adam Barkley ,  Ty McNutt ,  Alexander Lostetter

IPC: H03K17/04 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K1/144 ,  H01L25/00 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49175 ,  H05K1/0243 ,  H05K1/0265

Abstract: A multichip power module directly connecting the busboard to a printed-circuit board that is attached to the power substrate enabling extremely low loop inductance for extreme environments such as high temperature operation. Wire bond interconnections are taught from the power die directly to the busboard further enabling enable low parasitic interconnections. Integration of on-board high frequency bus capacitors provide extremely low loop inductance. An extreme environment gate driver board allows close physical proximity of gate driver and power stage to reduce overall volume and reduce impedance in the control circuit. Parallel spring-loaded pin gate driver PCB connections allows a reliable and reworkable power module to gate driver interconnections.

Abstract translation: 多芯片电源模块将总线板直接连接到连接到电源基板上的印刷电路板，从而能够在诸如高温操作等极端环境下实现极低的环路电感。 引线键互连从功率管芯直接传递到总线板，进一步使得能够实现低寄生互连。 板载高频总线电容的集成提供极低的环路电感。 极端环境栅极驱动器板允许栅极驱动器和功率级的物理接近，以减少总体积并降低控制电路中的阻抗。 平行弹簧加载的引脚栅极驱动器PCB连接允许可靠和可重新加工的电源模块来栅极驱动器互连。

公开(公告)号：US20150216067A1

公开(公告)日：2015-07-30

申请号：US14609629

申请日：2015-01-30

Applicant: Arkansas Power Electronics International, Inc.

Inventor： Brice McPherson ,  Peter D. Killeen ,  Alex Lostetter ,  Robert Shaw ,  Brandon Passmore ,  Jared Hornberger ,  Tony M. Berry

IPC: H05K7/02 ,  H05K1/11 ,  H05K1/02 ,  H05K7/10

CPC classification number: H05K5/0069 ,  H01L21/4817 ,  H01L23/049 ,  H01L23/15 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/49838 ,  H01L23/49861 ,  H01L25/07 ,  H01L25/072 ,  H01L2924/0002 ,  H05K1/0296 ,  H05K5/0013 ,  H05K5/0091 ,  H05K5/0247 ,  H05K7/20509 ,  H01L2924/00

Abstract: A power module with multiple equalized parallel power paths supporting multiple parallel bare die power devices constructed with low inductance equalized current paths for even current sharing and clean switching events. Wide low profile power contacts provide low inductance, short current paths, and large conductor cross section area provides for massive current carrying. An internal gate & source kelvin interconnection substrate is provided with individual ballast resistors and simple bolted construction. Gate drive connectors are provided on either left or right size of the module. The module is configurable as half bridge, full bridge, common source, and common drain topologies.

Abstract translation: 具有多个均衡并联电源路径的电源模块，支持多个并联裸芯片功率器件，该器件由低电感均衡电流路径构成，用于均匀的电流共享和清洁的开关事件。 宽薄型电源触点提供低电感，短电流通路，大导体横截面积提供大量电流承载。 内部栅极和源开关互连基板设有单独的镇流电阻器和简单的螺栓结构。 栅极驱动器连接器以模块的左侧或右侧尺寸提供。 该模块可配置为半桥，全桥，公共源和公共漏极拓扑。

公开(公告)号：US20150131236A1

公开(公告)日：2015-05-14

申请号：US14516700

申请日：2014-10-17

Applicant: Arkansas Power Electronics International, Inc.

Inventor： Brandon Passmore ,  Zachary Cole ,  Brice McPherson

IPC: H05K7/02

CPC classification number: H05K7/02 ,  H01L25/00 ,  H01L2924/0002 ,  H05K7/1432 ,  H01L2924/00

Abstract: A power die module using a compression connection to a power die in a small package with corona extenders positioned around short efficient path exterior electrical connections. The module is built from a baseplate with connected sidewalls forming an interior compartment holding a power substrate with attached threaded inserts. A printed circuit board bolted to the power substrate with high voltage power die compressively held between the board and the substrate. The compressive hold enhances the electrical connections between the contacts on the top and bottom of the power die and either the power substrate or the printed circuit board. Exterior blade connectors extend upward from the printed circuit board through blade apertures in a lid that covers the interior compartment. The lid includes corona extenders positioned around the blade apertures to allow for high voltage applications while maintaining a small size lightweight package. The sidewall has a perimeter that also includes one or more corona extenders.

Abstract translation: 一种功率模块模块，其使用位于短的有效路径外部电连接处的电晕延伸器的小封装中的功率管芯的压缩连接。 该模块由具有连接的侧壁的底板构成，形成具有附接的螺纹插入件的电源基板的内部隔室。 螺栓连接到具有高电压功率的电源基板的印刷电路板压缩地保持在板和基板之间。 压缩保持增强了功率管芯和电源基板或印刷电路板的顶部和底部上的触点之间的电连接。 外部刀片连接器从印刷电路板向上延伸穿过覆盖内部隔间的盖子中的刀片孔。 盖子包括位于叶片孔周围的电晕延伸器，以允许高压应用，同时保持小尺寸的轻量级包装。 侧壁具有还包括一个或多个电晕扩展器的周边。

公开(公告)号：US09426883B2

公开(公告)日：2016-08-23

申请号：US14609629

申请日：2015-01-30

Applicant: Arkansas Power Electronics International, Inc.

Inventor： Brice McPherson ,  Peter D. Killeen ,  Alex Lostetter ,  Robert Shaw ,  Brandon Passmore ,  Jared Hornberger ,  Tony M. Berry

IPC: H05K7/00 ,  H05K1/02 ,  H01L23/373 ,  H01L25/07 ,  H01L23/049 ,  H01L23/15 ,  H01L23/498

CPC classification number: H05K5/0069 ,  H01L21/4817 ,  H01L23/049 ,  H01L23/15 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/49838 ,  H01L23/49861 ,  H01L25/07 ,  H01L25/072 ,  H01L2924/0002 ,  H05K1/0296 ,  H05K5/0013 ,  H05K5/0091 ,  H05K5/0247 ,  H05K7/20509 ,  H01L2924/00

Abstract: A power module with multiple equalized parallel power paths supporting multiple parallel bare die power devices constructed with low inductance equalized current paths for even current sharing and clean switching events. Wide low profile power contacts provide low inductance, short current paths, and large conductor cross section area provides for massive current carrying. An internal gate & source kelvin interconnection substrate is provided with individual ballast resistors and simple bolted construction. Gate drive connectors are provided on either left or right size of the module. The module is configurable as half bridge, full bridge, common source, and common drain topologies.

Abstract translation: 具有多个均衡并联电源路径的电源模块，支持多个并联裸芯片功率器件，该器件由低电感均衡电流路径构成，用于均匀的电流共享和清洁的开关事件。 宽薄型电源触点提供低电感，短电流通路，大导体横截面积提供大量电流承载。 内部栅极和源开关互连基板设有单独的镇流电阻器和简单的螺栓结构。 栅极驱动器连接器以模块的左侧或右侧尺寸提供。 该模块可配置为半桥，全桥，公共源和公共漏极拓扑。