公开(公告)号：US07838409B2

公开(公告)日：2010-11-23

申请号：US12686285

申请日：2010-01-12

申请人： Arthur R. Zingher ,  Bruce M. Guenin ,  Ronald Ho ,  Robert J. Drost

发明人： Arthur R. Zingher ,  Bruce M. Guenin ,  Ronald Ho ,  Robert J. Drost

IPC分类号： H01L21/44

CPC分类号： H01L23/5387 ,  H01L23/48 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2225/06562 ,  H01L2924/01067 ,  H01L2924/15311 ,  H01R12/62 ,  H05K3/222 ,  H05K2201/1053 ,  H05K2201/10674

摘要： One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. This flexible bridge provides a flexible connection that allows the chip to be moved with six degrees of freedom relative to the second component without affecting communication between the chip and the second component. Hence, the flexible bridge allows the chip and the second component to communicate without requiring precise alignment between the chip and the second component.

公开(公告)号：US07671449B2

公开(公告)日：2010-03-02

申请号：US11418986

申请日：2006-05-04

申请人： Arthur R. Zingher ,  Bruce M. Guenin ,  Ronald Ho ,  Robert J. Drost

发明人： Arthur R. Zingher ,  Bruce M. Guenin ,  Ronald Ho ,  Robert J. Drost

IPC分类号： H01L39/00 ,  H01L21/00

CPC分类号： H01L23/5387 ,  H01L23/48 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2225/06562 ,  H01L2924/01067 ,  H01L2924/15311 ,  H01R12/62 ,  H05K3/222 ,  H05K2201/1053 ,  H05K2201/10674

摘要： One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. This flexible bridge provides a flexible connection that allows the chip to be moved with six degrees of freedom relative to the second component without affecting communication between the chip and the second component. Hence, the flexible bridge allows the chip and the second component to communicate without requiring precise alignment between the chip and the second component.

摘要翻译： 本发明的一个实施例提供一种促进使用柔性桥的高带宽通信的系统。 该系统包括具有有源电路和信号焊盘所在的有源面的芯片，以及具有有源电路和/或信号焊盘所在的表面的第二部件。 柔性桥提供芯片的有源面与第二部件的表面之间的高带宽通信。 该柔性桥提供柔性连接，允许芯片相对于第二部件以六个自由度移动，而不影响芯片和第二部件之间的通信。 因此，柔性桥允许芯片和第二部件通信，而不需要芯片和第二部件之间的精确对准。

公开(公告)号：US20100129999A1

公开(公告)日：2010-05-27

申请号：US12686285

申请日：2010-01-12

申请人： Arthur R. Zingher ,  Bruce M. Guenin ,  Ronald Ho ,  Robert J. Drost

发明人： Arthur R. Zingher ,  Bruce M. Guenin ,  Ronald Ho ,  Robert J. Drost

IPC分类号： H01L21/60

CPC分类号： H01L23/5387 ,  H01L23/48 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2225/06562 ,  H01L2924/01067 ,  H01L2924/15311 ,  H01R12/62 ,  H05K3/222 ,  H05K2201/1053 ,  H05K2201/10674

摘要： One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. This flexible bridge provides a flexible connection that allows the chip to be moved with six degrees of freedom relative to the second component without affecting communication between the chip and the second component. Hence, the flexible bridge allows the chip and the second component to communicate without requiring precise alignment between the chip and the second component.

摘要翻译： 本发明的一个实施例提供一种促进使用柔性桥的高带宽通信的系统。 该系统包括具有有源电路和信号焊盘所在的有源面的芯片，以及具有有源电路和/或信号焊盘所在的表面的第二部件。 柔性桥提供芯片的有源面与第二部件的表面之间的高带宽通信。 该柔性桥提供柔性连接，允许芯片相对于第二部件以六个自由度移动，而不影响芯片和第二部件之间的通信。 因此，柔性桥允许芯片和第二部件通信，而不需要芯片和第二部件之间的精确对准。

公开(公告)号：US07649245B2

公开(公告)日：2010-01-19

申请号：US11418985

申请日：2006-05-04

申请人： Arthur R. Zingher ,  Bruce M. Guenin ,  Ronald Ho ,  Robert J. Drost

发明人： Arthur R. Zingher ,  Bruce M. Guenin ,  Ronald Ho ,  Robert J. Drost

IPC分类号： H01L39/00 ,  H01L21/00

CPC分类号： H01L25/065 ,  H01L23/48 ,  H01L23/50 ,  H01L23/5383 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/5387 ,  H01L24/01 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/147 ,  H05K3/222 ,  H01L2924/00

摘要： One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. By matching the wire line size in the flexible bridge to the size of circuits and/or signal pads on the chip and on the second component, the system allows signals to be sent between the circuits on the chip and the second component without having to change the scale of the interconnect, thereby alleviating wireability and bandwidth limitations of conventional chip packaging technologies.

摘要翻译： 本发明的一个实施例提供一种促进使用柔性桥的高带宽通信的系统。 该系统包括具有有源电路和信号焊盘所在的有源面的芯片，以及具有有源电路和/或信号焊盘所在的表面的第二部件。 柔性桥提供芯片的有源面与第二部件的表面之间的高带宽通信。 通过将柔性电桥中的有线线路尺寸与芯片和第二组件上的电路和/或信号焊盘的尺寸相匹配，系统允许在芯片和第二部件之间的电路之间发送信号，而无需更改 互连的规模，从而减轻传统芯片封装技术的可线性和带宽限制。

公开(公告)号：US07332919B1

公开(公告)日：2008-02-19

申请号：US11232843

申请日：2005-09-21

申请人： Ronald Ho ,  Robert J. Drost ,  Arthur R. Zingher

发明人： Ronald Ho ,  Robert J. Drost ,  Arthur R. Zingher

IPC分类号： G01R31/02

CPC分类号： H01L23/538 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/183 ,  H05K2201/09254 ,  H05K2201/10674 ,  H01L2924/00

摘要： One embodiment of the present invention provides a system for distributing signals through a jig-plate in a computer system. The jig-plate contains alignment features that assist in positioning semiconductor chips in relation to the jig-plate. In addition, the jig-plate contains one or more embedded signal routing layers. These metal routing layers provide one or more signal routes for the distribution of signals through the jig-plate to semiconductor chips which have been aligned with the jig-plate. Note that routing the signals through the jig-plate facilitates the distribution of the signals without requiring that the signals be routed through the semiconductor chips in the jig-plate.

摘要翻译： 本发明的一个实施例提供一种用于通过计算机系统中的夹具板来分配信号的系统。 夹具板包含有助于相对于夹具板定位半导体芯片的对准特征。 另外，夹具板包含一个或多个嵌入式信号路由层。 这些金属布线层提供了一个或多个用于将通过夹具板的信号分配到已经与夹具板对准的半导体芯片的信号路线。 注意，通过夹具板布置信号有助于信号的分配，而不需要信号通过夹具板中的半导体芯片布线。

公开(公告)号：US07483248B1

公开(公告)日：2009-01-27

申请号：US11134799

申请日：2005-05-19

申请人： Ronald Ho ,  Robert J. Drost ,  Arthur R. Zingher

发明人： Ronald Ho ,  Robert J. Drost ,  Arthur R. Zingher

IPC分类号： H02H3/00 ,  H02H3/08 ,  H02H9/02 ,  H02H1/00 ,  H02H1/04 ,  H02H3/22 ,  H02H9/06 ,  H01C7/12 ,  G01R15/18

CPC分类号： G01R19/16552

摘要： One embodiment of the present invention provides a system that detects changes in power-supply current within an integrated circuit (IC) chip. During operation, the system monitors an induced current through a detection loop. This detection loop is situated at least partially within the IC chip in close proximity to a power-supply current for the IC chip, so that a change in the power-supply current changes a magnetic field passing through the detection loop, thereby inducing a corresponding current through the detection loop. The system then generates a control signal based on the induced current, so that changes in the power-supply current cause the control signal to change. In addition, the system uses the control signal to control circuits within the IC chip.

摘要翻译： 本发明的一个实施例提供一种检测集成电路（IC）芯片内的电源电流的变化的系统。 在运行期间，系统通过检测回路监测感应电流。 该检测环路至少部分地位于IC芯片内，与IC芯片的电源电流接近，使得电源电流的变化改变通过检测环路的磁场，从而引起对应的 电流通过检测回路。 然后，该系统基于感应电流产生控制信号，使得电源电流的变化导致控制信号改变。 此外，该系统使用控制信号来控制IC芯片内的电路。

公开(公告)号：US07067910B2

公开(公告)日：2006-06-27

申请号：US10966510

申请日：2004-10-14

申请人： Robert J. Drost ,  Ronald Ho ,  Arthur R. Zingher

发明人： Robert J. Drost ,  Ronald Ho ,  Arthur R. Zingher

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L23/48 ,  H01L25/0652 ,  H01L2225/06527 ,  H01L2924/0002 ,  H01L2924/00

摘要： One embodiment of the present invention provides a technique for assembling semiconductor chips. First, multiple semiconductor chips are permanently laminated together into a plurality of laminated chip assemblies, wherein the semiconductor chips within the laminated chip assembly communicate with each other through electrically conductive connections. Next, laminated chip assemblies are stacked together to form a stack of semiconductor chips without permanently bonding the laminated chip assemblies together, wherein the laminated chip assemblies communicate with each other using capacitive coupling.

公开(公告)号：US07915699B2

公开(公告)日：2011-03-29

申请号：US11165809

申请日：2005-06-24

申请人： Ashok V. Krishnamoorthy ,  Arthur R. Zingher ,  Robert J. Drost

发明人： Ashok V. Krishnamoorthy ,  Arthur R. Zingher ,  Robert J. Drost

IPC分类号： H01L27/14

CPC分类号： G02B6/43 ,  H01L23/48 ,  H01L25/0652 ,  H01L25/0657 ,  H01L31/12 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： One embodiment of the present invention provides an integrated circuit chip, including an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The integrated circuit chip additionally comprises an electromagnetic via that facilitates communication between signal pads on the integrated circuit chip and signal pads on a second integrated circuit chip. The electromagnetic via couples a signal pad on the active face of the integrated circuit chip to the back face of the integrated circuit chip so that the integrated circuit chip can communicate with the second integrated circuit chip while the back face of the integrated circuit chip is adjacent to the active face of the second integrated circuit chip. Moreover, the electromagnetic via operates by facilitating non-conductive signaling through the integrated circuit chip.

摘要翻译： 本发明的一个实施例提供一种集成电路芯片，其包括有源电路和信号焊盘所在的有源面以及与有源面相对的背面。 集成电路芯片还包括电磁通孔，其有助于集成电路芯片上的信号焊盘与第二集成电路芯片上的信号焊盘之间的通信。 电磁通孔将集成电路芯片的有源面上的信号焊盘连接到集成电路芯片的背面，使得集成电路芯片可以与集成电路芯片的背面相邻的第二集成电路芯片连通 到第二集成电路芯片的主动面。 此外，电磁通孔通过促进通过集成电路芯片的非导电信号来操作。

公开(公告)号：US08148202B2

公开(公告)日：2012-04-03

申请号：US13026479

申请日：2011-02-14

申请人： Ashok V. Krishnamoorthy ,  Arthur R. Zingher ,  Robert J. Drost

发明人： Ashok V. Krishnamoorthy ,  Arthur R. Zingher ,  Robert J. Drost

IPC分类号： H01L21/50

CPC分类号： G02B6/43 ,  H01L23/48 ,  H01L25/0652 ,  H01L25/0657 ,  H01L31/12 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： One embodiment of the present invention provides an integrated circuit chip, including an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The integrated circuit chip additionally comprises an electromagnetic via that facilitates communication between signal pads on the integrated circuit chip and signal pads on a second integrated circuit chip. The electromagnetic via couples a signal pad on the active face of the integrated circuit chip to the back face of the integrated circuit chip so that the integrated circuit chip can communicate with the second integrated circuit chip while the back face of the integrated circuit chip is adjacent to the active face of the second integrated circuit chip. Moreover, the electromagnetic via operates by facilitating non-conductive signaling through the integrated circuit chip.

摘要翻译： 本发明的一个实施例提供一种集成电路芯片，其包括有源电路和信号焊盘所在的有源面以及与有源面相对的背面。 集成电路芯片还包括电磁通孔，其有助于集成电路芯片上的信号焊盘与第二集成电路芯片上的信号焊盘之间的通信。 电磁通孔将集成电路芯片的有源面上的信号焊盘连接到集成电路芯片的背面，使得集成电路芯片可以与集成电路芯片的背面相邻的第二集成电路芯片连通 到第二集成电路芯片的主动面。 此外，电磁通孔通过促进通过集成电路芯片的非导电信号来操作。

公开(公告)号：US20110136297A1

公开(公告)日：2011-06-09

申请号：US13026479

申请日：2011-02-14

申请人： Ashok V. Krishnamoorthy ,  Arthur R. Zingher ,  Robert J. Drost

发明人： Ashok V. Krishnamoorthy ,  Arthur R. Zingher ,  Robert J. Drost

IPC分类号： H01L21/50

CPC分类号： G02B6/43 ,  H01L23/48 ,  H01L25/0652 ,  H01L25/0657 ,  H01L31/12 ,  H01L2225/06513 ,  H01L2225/06531 ,  H01L2225/06534 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： One embodiment of the present invention provides an integrated circuit chip, including an active face upon which active circuitry and signal pads reside, and a back face opposite the active face. The integrated circuit chip additionally comprises an electromagnetic via that facilitates communication between signal pads on the integrated circuit chip and signal pads on a second integrated circuit chip. The electromagnetic via couples a signal pad on the active face of the integrated circuit chip to the back face of the integrated circuit chip so that the integrated circuit chip can communicate with the second integrated circuit chip while the back face of the integrated circuit chip is adjacent to the active face of the second integrated circuit chip. Moreover, the electromagnetic via operates by facilitating non-conductive signaling through the integrated circuit chip.

摘要翻译： 本发明的一个实施例提供一种集成电路芯片，其包括有源电路和信号焊盘所在的有源面以及与有源面相对的背面。 集成电路芯片还包括电磁通孔，其有助于集成电路芯片上的信号焊盘与第二集成电路芯片上的信号焊盘之间的通信。 电磁通孔将集成电路芯片的有源面上的信号焊盘连接到集成电路芯片的背面，使得集成电路芯片可以与集成电路芯片的背面相邻的第二集成电路芯片通信 到第二集成电路芯片的主动面。 此外，电磁通孔通过促进通过集成电路芯片的非导电信号来操作。