公开(公告)号：US07475803B2

公开(公告)日：2009-01-13

申请号：US11371083

申请日：2006-03-09

申请人： Atsunori Sumita ,  Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Isao Tsuchiya ,  Yoshiyuki Mabuchi ,  Osamu Kimura

发明人： Atsunori Sumita ,  Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Isao Tsuchiya ,  Yoshiyuki Mabuchi ,  Osamu Kimura

IPC分类号： B23K31/02 ,  H01L21/44

CPC分类号： B23K3/0623 ,  B23K2101/42 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2224/742 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/3478 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/082 ,  Y10T29/53209 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Provides a solder ball loading unit capable of loading fine solder balls on electrodes. Solder balls 78s are gathered by sucking air from a loading cylinder 24 located above a ball arranging mask 16. The gathered solder balls 78s are rolled on the ball arranging mask 16 by moving the loading cylinder 24 in a horizontal direction and the solder balls 78s are dropped onto the electrodes 75 on a multilayer printed wiring board 10 through an openings 16a in the ball arranging mask 16.

摘要翻译： 提供能够在电极上加载精细焊球的焊球加载单元。 通过从位于球排列掩模16上方的装载筒24吸入空气来收集焊球78s。通过使装载筒24沿水平方向移动，聚集的焊球78s滚动在球排列掩模16上，并且焊球78s 通过球排列掩模16中的开口16a落在多层印刷线路板10上的电极75上。

公开(公告)号：US07866529B2

公开(公告)日：2011-01-11

申请号：US12328347

申请日：2008-12-04

申请人： Atsunori Sumita ,  Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Isao Tsuchiya ,  Yoshiyuki Mabuchi ,  Osamu Kimura

发明人： Atsunori Sumita ,  Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Isao Tsuchiya ,  Yoshiyuki Mabuchi ,  Osamu Kimura

IPC分类号： B23K37/00 ,  B23P19/00

CPC分类号： B23K3/0623 ,  B23K2101/42 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2224/742 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/3478 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/082 ,  Y10T29/53209 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A solder ball loading unit for loading a solder balls to be turned to a solder bumps on a connection pad of a printed wiring board, including a ball arranging mask having a plurality of openings corresponding to the connection pad of the printed wiring board, a cylinder member located above the ball arranging mask for gathering the solder balls just below the opening portion by sucking air from the opening portion, and a moving mechanism for moving the cylinder member in the horizontal direction, the moving mechanism moving the solder balls gathered on the ball arranging mask by moving the cylinder member and dropping the solder balls onto the connection pads of the printed wiring board through the opening in the ball arranging mask.

摘要翻译： 一种焊球加载单元，用于将焊球转动到印刷线路板的连接焊盘上的焊料凸块上，该焊球包括具有对应于印刷线路板的连接焊盘的多个开口的球排列掩模， 位于球排列面罩上方的构件，用于通过从开口部分吸入空气来收集刚好在开口部分下方的焊球;以及移动机构，用于沿水平方向移动气缸构件，移动机构移动聚集在球上的焊球 通过移动圆筒构件并通过球排列掩模中的开口将焊球落到印刷线路板的连接焊盘上来布置掩模。

公开(公告)号：US20090084827A1

公开(公告)日：2009-04-02

申请号：US12328347

申请日：2008-12-04

申请人： Atsunori SUMITA ,  Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Isao Tsuchiya ,  Yoshiyuki Mabuchi ,  Osamu Kimura

发明人： Atsunori SUMITA ,  Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Isao Tsuchiya ,  Yoshiyuki Mabuchi ,  Osamu Kimura

IPC分类号： B23K3/06

CPC分类号： B23K3/0623 ,  B23K2101/42 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2224/742 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/3478 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/082 ,  Y10T29/53209 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A solder ball loading unit for loading a solder balls to be turned to a solder bumps on a connection pad of a printed wiring board, including a ball arranging mask having a plurality of openings corresponding to the connection pad of the printed wiring board, a cylinder member located above the ball arranging mask for gathering the solder balls just below the opening portion by sucking air from the opening portion, and a moving mechanism for moving the cylinder member in the horizontal direction, the moving mechanism moving the solder balls gathered on the ball arranging mask by moving the cylinder member and dropping the solder balls onto the connection pads of the printed wiring board through the opening in the ball arranging mask.

摘要翻译： 一种焊球加载单元，用于将焊球转动到印刷线路板的连接焊盘上的焊料凸块上，该焊球包括具有对应于印刷线路板的连接焊盘的多个开口的球排列掩模， 位于球排列罩上方的构件，用于通过从开口部分吸入空气来收集刚好在开口部分下方的焊球;以及移动机构，用于使水平构件沿水平方向移动，移动机构移动聚集在球上的焊球 通过移动圆筒构件并通过球排列掩模中的开口将焊球落到印刷线路板的连接焊盘上来布置掩模。

公开(公告)号：US20060157540A1

公开(公告)日：2006-07-20

申请号：US11371083

申请日：2006-03-09

申请人： Atsunori Sumita ,  Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Isao Tsuchiya ,  Yoshiyuki Mabuchi ,  Osamu Kimura

发明人： Atsunori Sumita ,  Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Isao Tsuchiya ,  Yoshiyuki Mabuchi ,  Osamu Kimura

IPC分类号： B23K31/02 ,  B23K31/00

CPC分类号： B23K3/0623 ,  B23K2101/42 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/16 ,  H01L2224/742 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/3478 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/082 ,  Y10T29/53209 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Provides a solder ball loading unit capable of loading fine solder balls on electrodes. Solder balls 78s are gathered by sucking air from a loading cylinder 24 located above a ball arranging mask 16. The gathered solder balls 78s are rolled on the ball arranging mask 16 by moving the loading cylinder 24 in a horizontal direction and the solder balls 78s are dropped onto the electrodes 75 on a multilayer printed wiring board 10 through an openings 16a in the ball arranging mask 16.

摘要翻译： 提供能够在电极上加载精细焊球的焊球加载单元。 通过从位于球排列掩模16上方的装载筒24吸入空气来收集焊球78s。 聚集的焊球78通过沿着水平方向移动装载筒24而滚动在球排列掩模16上，并且焊球78通过开口16a落在多层印刷线路板10上的电极75上。 球排列面具16。

公开(公告)号：US5336321A

公开(公告)日：1994-08-09

申请号：US009918

申请日：1993-01-27

申请人： Akihiko Sugata ,  Kenji Tamura ,  Yoshiyuki Mabuchi

发明人： Akihiko Sugata ,  Kenji Tamura ,  Yoshiyuki Mabuchi

IPC分类号： B05B12/00 ,  B05B13/04 ,  B25J5/02 ,  B25J9/00 ,  B05D1/02

CPC分类号： B25J5/02 ,  B05B13/0431 ,  B25J9/0084

摘要： A paint apparatus includes a framework having a beam, a carriage constrained to move reciprocally along the beam, a first robot mounted to the carriage and movable relative to the carriage except in a direction parallel to the beam, and a second robot mounted to the carriage and movable relative to the carriage except in the direction parallel to the beam. The first and second robots and are spaced from each other in the direction parallel to the beam and in a direction perpendicular to the beam. As a result, interference between the first and second robots and is prevented and paint sprayed onto each other is prevented.

摘要翻译： 油漆装置包括具有梁的框架，被限制为沿着梁往复移动的滑架;第一机器人，其安装到滑架并且可相对于滑架移动，除了平行于梁的方向外，还有第二机器人安装到滑架 并且除了平行于梁的方向之外可相对于托架移动。 第一和第二机器人并且在平行于梁的方向上并且在垂直于梁的方向上彼此间隔开。 结果，防止第一和第二机器人之间的干扰并且防止彼此喷涂。