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公开(公告)号：US07400511B2
公开(公告)日：2008-07-15
申请号：US11707958
申请日：2007-02-20
IPC分类号： H05K7/00
CPC分类号： H05K3/3421 , H05K1/111 , H05K3/3426 , H05K2201/09036 , H05K2201/09472 , H05K2201/09509 , H05K2201/09709 , H05K2201/10189 , H05K2201/10787 , Y02P70/611 , Y02P70/613
摘要： An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.
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公开(公告)号：US20080253096A1
公开(公告)日：2008-10-16
申请号：US12155947
申请日：2008-06-12
IPC分类号： H05K7/00
CPC分类号： H05K3/3421 , H05K1/111 , H05K3/3426 , H05K2201/09036 , H05K2201/09472 , H05K2201/09509 , H05K2201/09709 , H05K2201/10189 , H05K2201/10787 , Y02P70/611 , Y02P70/613
摘要： An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.
摘要翻译： 电子部件安装结构包括安装在板的表面上的板和电子部件。 董事会包括土地。 电子部件包括主体和从主体延伸的端子。 每个端子电连接到板的对应的一个焊盘。 端子具有沿着板的表面延伸的第一端子部分和朝向板的表面延伸的第二端子部分。 每个焊盘包括电焊接到第一端子部分的焊盘部分和用于接收第二端子部分的盲孔。 在第二端子部分插入盲孔的条件下，第一端子部分在回流工艺中焊接到焊盘部分。
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公开(公告)号：US07733664B2
公开(公告)日：2010-06-08
申请号：US12155947
申请日：2008-06-12
IPC分类号： H05K1/11
CPC分类号： H05K3/3421 , H05K1/111 , H05K3/3426 , H05K2201/09036 , H05K2201/09472 , H05K2201/09509 , H05K2201/09709 , H05K2201/10189 , H05K2201/10787 , Y02P70/611 , Y02P70/613
摘要： An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.
摘要翻译： 电子部件安装结构包括安装在板的表面上的板和电子部件。 董事会包括土地。 电子部件包括主体和从主体延伸的端子。 每个端子电连接到板的对应的一个焊盘。 端子具有沿着板的表面延伸的第一端子部分和朝向板的表面延伸的第二端子部分。 每个焊盘包括电焊接到第一端子部分的焊盘部分和用于接收第二端子部分的盲孔。 在第二端子部分插入盲孔的条件下，第一端子部分在回流工艺中焊接到焊盘部分。
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公开(公告)号：US20070193774A1
公开(公告)日：2007-08-23
申请号：US11707958
申请日：2007-02-20
CPC分类号： H05K3/3421 , H05K1/111 , H05K3/3426 , H05K2201/09036 , H05K2201/09472 , H05K2201/09509 , H05K2201/09709 , H05K2201/10189 , H05K2201/10787 , Y02P70/611 , Y02P70/613
摘要： An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.
摘要翻译： 电子部件安装结构包括安装在板的表面上的板和电子部件。 董事会包括土地。 电子部件包括主体和从主体延伸的端子。 每个端子电连接到板的对应的一个焊盘。 端子具有沿着板的表面延伸的第一端子部分和朝向板的表面延伸的第二端子部分。 每个焊盘包括电焊接到第一端子部分的焊盘部分和用于接收第二端子部分的盲孔。 在第二端子部分插入盲孔的条件下，第一端子部分在回流工艺中焊接到焊盘部分。
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