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公开(公告)号：US06303878B1
公开(公告)日：2001-10-16
申请号：US09121303
申请日：1998-07-23
申请人： Kenji Kondo , Masayuki Aoyama , Koji Kondo , Masanori Takemoto , Hidehiro Mikura , Tetuhiro Nakano
发明人： Kenji Kondo , Masayuki Aoyama , Koji Kondo , Masanori Takemoto , Hidehiro Mikura , Tetuhiro Nakano
IPC分类号： H05K109
CPC分类号： H05K3/244 , H01L23/49816 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48227 , H01L2224/48464 , H01L2224/73265 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H05K1/112 , H05K2201/09227 , H05K2201/10734 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A BGA package is mounted on a multi-layer printed wiring board having a plurality of electrodes arranged in a matrix form through a plurality of solder bumps. In the most externally-located electrodes, a lead wire is formed to extend from a portion of the most-externally-located electrode located inside of a polygon formed by connecting each of the centers of adjacent most-externally-located electrodes. Therefore, the solder bumps are prevented from coming off the most-externally-located electrodes because a portion of the most-externally-located electrode to which stress caused by an external shock is intensively applied is located in an outside of the polygon. Thus, a contact failure between the BGA package and the multi-layer printed wiring board is prevented.
摘要翻译： BGA封装安装在具有通过多个焊料凸块以矩阵形式布置的多个电极的多层印刷布线板上。 在最外部定位的电极中，形成引线，其从位于通过连接相邻的最外部定位的电极的每个中心形成的多边形内部的最外部定位的电极的一部分延伸。 因此，由于由外部冲击引起的应力的最外部位置的电极的一部分被集中地施加，所以防止了焊料凸块脱离最外部定位的电极，位于多边形的外侧。 因此，防止了BGA封装和多层印刷电路板之间的接触故障。
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公开(公告)号：US07400511B2
公开(公告)日：2008-07-15
申请号：US11707958
申请日：2007-02-20
IPC分类号： H05K7/00
CPC分类号： H05K3/3421 , H05K1/111 , H05K3/3426 , H05K2201/09036 , H05K2201/09472 , H05K2201/09509 , H05K2201/09709 , H05K2201/10189 , H05K2201/10787 , Y02P70/611 , Y02P70/613
摘要： An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.
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公开(公告)号：US07733664B2
公开(公告)日：2010-06-08
申请号：US12155947
申请日：2008-06-12
IPC分类号： H05K1/11
CPC分类号： H05K3/3421 , H05K1/111 , H05K3/3426 , H05K2201/09036 , H05K2201/09472 , H05K2201/09509 , H05K2201/09709 , H05K2201/10189 , H05K2201/10787 , Y02P70/611 , Y02P70/613
摘要： An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.
摘要翻译： 电子部件安装结构包括安装在板的表面上的板和电子部件。 董事会包括土地。 电子部件包括主体和从主体延伸的端子。 每个端子电连接到板的对应的一个焊盘。 端子具有沿着板的表面延伸的第一端子部分和朝向板的表面延伸的第二端子部分。 每个焊盘包括电焊接到第一端子部分的焊盘部分和用于接收第二端子部分的盲孔。 在第二端子部分插入盲孔的条件下，第一端子部分在回流工艺中焊接到焊盘部分。
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公开(公告)号：US20070193774A1
公开(公告)日：2007-08-23
申请号：US11707958
申请日：2007-02-20
CPC分类号： H05K3/3421 , H05K1/111 , H05K3/3426 , H05K2201/09036 , H05K2201/09472 , H05K2201/09509 , H05K2201/09709 , H05K2201/10189 , H05K2201/10787 , Y02P70/611 , Y02P70/613
摘要： An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.
摘要翻译： 电子部件安装结构包括安装在板的表面上的板和电子部件。 董事会包括土地。 电子部件包括主体和从主体延伸的端子。 每个端子电连接到板的对应的一个焊盘。 端子具有沿着板的表面延伸的第一端子部分和朝向板的表面延伸的第二端子部分。 每个焊盘包括电焊接到第一端子部分的焊盘部分和用于接收第二端子部分的盲孔。 在第二端子部分插入盲孔的条件下，第一端子部分在回流工艺中焊接到焊盘部分。
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公开(公告)号：US20080253096A1
公开(公告)日：2008-10-16
申请号：US12155947
申请日：2008-06-12
IPC分类号： H05K7/00
CPC分类号： H05K3/3421 , H05K1/111 , H05K3/3426 , H05K2201/09036 , H05K2201/09472 , H05K2201/09509 , H05K2201/09709 , H05K2201/10189 , H05K2201/10787 , Y02P70/611 , Y02P70/613
摘要： An electronic component mounting structure includes a board and an electronic component mounted on a surface of the board. The board includes lands. The electronic component includes a body and terminals extending from the body. Each terminal is electrically connected to a corresponding one of the lands of the board. The terminal has a first terminal portion extending along the surface of the board and a second terminal portion extending toward the surface of the board. Each land includes a land portion electrically soldered to the first terminal portion and a blind hole for receiving the second terminal portion. The first terminal portion is soldered to the land portion in a reflow process under the condition that the second terminal portion is inserted in the blind hole.
摘要翻译： 电子部件安装结构包括安装在板的表面上的板和电子部件。 董事会包括土地。 电子部件包括主体和从主体延伸的端子。 每个端子电连接到板的对应的一个焊盘。 端子具有沿着板的表面延伸的第一端子部分和朝向板的表面延伸的第二端子部分。 每个焊盘包括电焊接到第一端子部分的焊盘部分和用于接收第二端子部分的盲孔。 在第二端子部分插入盲孔的条件下，第一端子部分在回流工艺中焊接到焊盘部分。
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6.发明授权公开(公告)号：US07419385B2
公开(公告)日：2008-09-02
申请号：US11711147
申请日：2007-02-27
申请人： Dai Itou , Hidehiro Mikura , Atsushi Ito , Takayoshi Honda , Tadashi Tsuruzawa
发明人： Dai Itou , Hidehiro Mikura , Atsushi Ito , Takayoshi Honda , Tadashi Tsuruzawa
IPC分类号： H01R12/00
CPC分类号： H01R12/724 , H01R12/707 , H01R13/6616 , H01R13/6625
摘要： A connector mounting structure includes a circuit board, a surface mount connector mounted to the circuit board, and an electronic component. The connector includes a connector body and a plurality of conductive terminals. The connector body has a base portion placed on a front surface of the circuit board and a tube portion. The terminals are disposed in the base portion of the connector body. The tube portion has a first opening portion for partially receiving the circuit board and a second opening portion for communicating with an external device. The electronic component is mounted to a back surface of the circuit board. A space for the electronic component is provided approximately beneath the base portion, between the back surface of the circuit board and the first opening portion of the tube portion.
摘要翻译： 连接器安装结构包括电路板，安装到电路板的表面安装连接器和电子部件。 连接器包括连接器主体和多个导电端子。 连接器主体具有放置在电路板的前表面上的基部和管部。 端子设置在连接器主体的基部中。 管部分具有用于部分地接收电路板的第一开口部分和用于与外部装置通信的第二开口部分。 电子部件安装到电路板的背面。 在电路基板的后表面和管部的第一开口部分之间的基部的大致下方设置有用于电子部件的空间。
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7.发明申请公开(公告)号：US20070218715A1
公开(公告)日：2007-09-20
申请号：US11711147
申请日：2007-02-27
申请人： Dai Itou , Hidehiro Mikura , Atsushi Ito , Takayoshi Honda , Tadashi Tsuruzawa
发明人： Dai Itou , Hidehiro Mikura , Atsushi Ito , Takayoshi Honda , Tadashi Tsuruzawa
IPC分类号： H01R12/00
CPC分类号： H01R12/724 , H01R12/707 , H01R13/6616 , H01R13/6625
摘要： A connector mounting structure includes a circuit board, a surface mount connector mounted to the circuit board, and an electronic component. The connector includes a connector body and a plurality of conductive terminals. The connector body has a base portion placed on a front surface of the circuit board and a tube portion. The terminals are disposed in the base portion of the connector body. The tube portion has a first opening portion for partially receiving the circuit board and a second opening portion for communicating with an external device. The electronic component is mounted to a back surface of the circuit board. A space for the electronic component is provided approximately beneath the base portion, between the back surface of the circuit board and the first opening portion of the tube portion.
摘要翻译： 连接器安装结构包括电路板，安装到电路板的表面安装连接器和电子部件。 连接器包括连接器主体和多个导电端子。 连接器主体具有放置在电路板的前表面上的基部和管部。 端子设置在连接器主体的基部中。 管部分具有用于部分地接收电路板的第一开口部分和用于与外部装置连通的第二开口部分。 电子部件安装到电路板的背面。 在电路基板的后表面和管部分的第一开口部分之间的基部的大致下方设置有用于电子部件的空间。
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