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公开(公告)号:US20130147348A1
公开(公告)日:2013-06-13
申请号:US13818315
申请日:2011-06-24
申请人: Atsushi Motoya , Kazuyuki Okano , Toru Okazaki , Naoki Tagami , Koji Omura , Nobuyoshi Takeuchi , Tsugihiro Matsuda , Makoto Horiuchi
发明人: Atsushi Motoya , Kazuyuki Okano , Toru Okazaki , Naoki Tagami , Koji Omura , Nobuyoshi Takeuchi , Tsugihiro Matsuda , Makoto Horiuchi
IPC分类号: H05B33/12
CPC分类号: H05B33/12 , F21K9/232 , F21V3/02 , F21V3/061 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/505 , H01L2224/45144 , H01L2224/48091 , H01L2224/8592 , H01L2924/09701 , H01L2924/181 , H01L2924/3025 , H05K1/0306 , H05K2201/10106 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A mounting board is provided which is translucent and has a surface on which an LED is mounted. The mounting board includes a sintered body film having a wavelength shifter which converts a wavelength of light and a sintering binder made of an inorganic material. The wavelength shifter converts a wavelength of light proceeding toward the surface on which the LED is mounted among light emitted by the LED and radiates wavelength-converted light. The sintering binder transmits the light emitted by the LED and the wavelength-converted light.
摘要翻译: 提供了一种半透明的安装板,并具有安装有LED的表面。 安装板包括具有转换光波长的波长移位器和由无机材料制成的烧结粘合剂的烧结体膜。 波长移位器在LED发出的光中转换朝向安装有LED的表面的光的波长,并且发射波长转换的光。 烧结粘合剂透射由LED发射的光和波长转换的光。
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公开(公告)号:USD664682S1
公开(公告)日:2012-07-31
申请号:US29396490
申请日:2011-06-30
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公开(公告)号:US08587011B2
公开(公告)日:2013-11-19
申请号:US13502662
申请日:2011-09-06
申请人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
发明人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
IPC分类号: H01L33/00
CPC分类号: H01L33/486 , F21K9/232 , F21V3/00 , F21Y2105/10 , F21Y2115/10 , H01L33/507 , H01L2924/0002 , H01L2933/0033 , H01L2924/00
摘要: A light-emitting device which emits light omnidirectionally is provided. A light-emitting device according to the present invention includes: a package which is translucent; an LED provided in a recess in the package; and a sealing member for sealing the LED and packaging the recess; and the recess includes a bottom surface on which the LED is mounted and a side surface surrounding a bottom surface, and light emitted by the LED is transmitted inside the package through the bottom surface and the side surface of the recess and is emitted to outside of the package from the back surface and the side surface of the package.
摘要翻译: 提供了全向发光的发光装置。 根据本发明的发光器件包括:半透明的封装; 设置在所述封装中的凹部中的LED; 以及用于密封LED并封装凹部的密封构件; 并且所述凹部包括其上安装有LED的底表面和围绕底表面的侧表面,并且由所述LED发射的光通过所述凹部的底表面和侧表面在所述封装内部传输并且被发射到 包装从包装的后表面和侧表面。
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公开(公告)号:US08421111B2
公开(公告)日:2013-04-16
申请号:US13503242
申请日:2011-08-23
申请人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
发明人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
IPC分类号: H01L33/00
CPC分类号: H01L33/507 , F21K9/232 , F21V3/00 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/486 , H01L33/505 , H01L33/508 , H01L2924/0002 , H01L2924/00012 , H01L2924/00
摘要: A light-emitting device including: a base which is translucent; a semiconductor light-emitting element provided on the base; a sealing member for sealing the semiconductor light-emitting element and including a first wavelength conversion material for converting a wavelength of light emitted by the semiconductor light-emitting element to a predetermined wavelength; and a groove provided on a side of the semiconductor light-emitting element, recessed from a top surface of the base on which the semiconductor light-emitting element is provided or a back surface of the base which is a surface opposite to the top surface, and for holding a second wavelength conversion material for converting the wavelength of the light emitted by the semiconductor light-emitting element to the predetermined wavelength.
摘要翻译: 一种发光器件,包括:半透明的基底; 设置在基座上的半导体发光元件; 用于密封半导体发光元件并且包括用于将由半导体发光元件发射的光的波长转换为预定波长的第一波长转换材料的密封构件; 以及设置在半导体发光元件的从设置有半导体发光元件的基座的顶面凹下的槽或与该顶面相反的表面的基座的后表面的槽, 并且用于保持用于将由半导体发光元件发射的光的波长转换为预定波长的第二波长转换材料。
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公开(公告)号:US20120235181A1
公开(公告)日:2012-09-20
申请号:US13503242
申请日:2011-08-23
申请人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
发明人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
IPC分类号: H01L33/08
CPC分类号: H01L33/507 , F21K9/232 , F21V3/00 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/486 , H01L33/505 , H01L33/508 , H01L2924/0002 , H01L2924/00012 , H01L2924/00
摘要: A light-emitting device including: a base which is translucent; a semiconductor light-emitting element provided on the base; a sealing member for sealing the semiconductor light-emitting element and including a first wavelength conversion material for converting a wavelength of light emitted by the semiconductor light-emitting element to a predetermined wavelength; and a groove provided on a side of the semiconductor light-emitting element, recessed from a top surface of the base on which the semiconductor light-emitting element is provided or a back surface of the base which is a surface opposite to the top surface, and for holding a second wavelength conversion material for converting the wavelength of the light emitted by the semiconductor light-emitting element to the predetermined wavelength.
摘要翻译: 一种发光器件,包括:半透明的基底; 设置在基座上的半导体发光元件; 用于密封半导体发光元件并且包括用于将由半导体发光元件发射的光的波长转换为预定波长的第一波长转换材料的密封构件; 以及设置在半导体发光元件的从设置有半导体发光元件的基座的顶面凹下的槽或与该顶面相反的表面的基座的后表面的槽, 并且用于保持用于将由半导体发光元件发射的光的波长转换为预定波长的第二波长转换材料。
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公开(公告)号:US20130049031A1
公开(公告)日:2013-02-28
申请号:US13502662
申请日:2011-09-06
申请人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
发明人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
CPC分类号: H01L33/486 , F21K9/232 , F21V3/00 , F21Y2105/10 , F21Y2115/10 , H01L33/507 , H01L2924/0002 , H01L2933/0033 , H01L2924/00
摘要: A light-emitting device which emits light omnidirectionally is provided. A light-emitting device according to the present invention includes: a package which is translucent; an LED provided in a recess in the package; and a sealing member for sealing the LED and packaging the recess; and the recess includes a bottom surface on which the LED is mounted and a side surface surrounding a bottom surface, and light emitted by the LED is transmitted inside the package through the bottom surface and the side surface of the recess and is emitted to outside of the package from the back surface and the side surface of the package.
摘要翻译: 提供了全向发光的发光装置。 根据本发明的发光器件包括:半透明的封装; 设置在所述封装中的凹部中的LED; 以及用于密封LED并封装凹部的密封构件; 并且所述凹部包括其上安装有LED的底表面和围绕底表面的侧表面,并且由所述LED发射的光通过所述凹部的底表面和侧表面在所述封装内部传输并且被发射到 包装从包装的后表面和侧表面。
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公开(公告)号:USD664683S1
公开(公告)日:2012-07-31
申请号:US29396492
申请日:2011-06-30
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公开(公告)号:US09016900B2
公开(公告)日:2015-04-28
申请号:US13882204
申请日:2011-11-04
IPC分类号: F21V29/00 , F21V23/00 , F21K99/00 , F21V19/00 , F21Y101/02 , F21V3/04 , F21Y103/00 , F21Y105/00
CPC分类号: F21V23/002 , F21K9/232 , F21V3/061 , F21V19/003 , F21V23/001 , F21V29/85 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/4903 , H01L2224/49107 , H01L2224/73265 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A light bulb shaped lamp according to the present invention includes: a hollow globe; an LED module including a base platform and an LED chip mounted on the base platform, the LED module being provided in the globe; a lead wire for supplying power to the LED module; and a stem extending toward the interior of the globe, in which the base platform is directly fixed to the stem.
摘要翻译: 根据本发明的灯泡形灯包括:中空球体; LED模块,其包括基座平台和安装在所述基台上的LED芯片,所述LED模块设置在所述球体中; 用于向LED模块供电的引线; 以及朝向球体内部延伸的杆,其中基座平台直接固定到杆上。
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公开(公告)号:US08911108B2
公开(公告)日:2014-12-16
申请号:US13818440
申请日:2011-10-14
IPC分类号: F21S4/00 , F21V15/01 , F21K99/00 , F21V25/02 , F21V3/00 , F21Y101/02 , F21Y103/00 , F21Y105/00 , H01L25/075
CPC分类号: F21V15/01 , F21K9/232 , F21V3/00 , F21V25/02 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L2224/45144 , H01L2224/48137 , H01L2224/48463 , H01L2224/49107 , H01L2224/73265 , H01L2924/00
摘要: A light bulb shaped lamp includes: a hollow globe having an opening; an LED module having a base platform and an LED chip mounted on the base platform, the LED module being housed in the globe; a stem extending from the opening of the globe to the vicinity of the LED module; and a regulating component which regulates movement of the LED module with respect to the stem.
摘要翻译: 灯泡状灯包括:具有开口的中空球体; LED模块,其具有基座和安装在基座上的LED芯片,所述LED模块容纳在所述球体中; 从所述球体的开口延伸到所述LED模块附近的杆; 以及调节组件,其调节LED模块相对于杆的移动。
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公开(公告)号:USD646810S1
公开(公告)日:2011-10-11
申请号:US29389739
申请日:2011-04-15
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