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公开(公告)号:USD664682S1
公开(公告)日:2012-07-31
申请号:US29396490
申请日:2011-06-30
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公开(公告)号:US20130147348A1
公开(公告)日:2013-06-13
申请号:US13818315
申请日:2011-06-24
申请人: Atsushi Motoya , Kazuyuki Okano , Toru Okazaki , Naoki Tagami , Koji Omura , Nobuyoshi Takeuchi , Tsugihiro Matsuda , Makoto Horiuchi
发明人: Atsushi Motoya , Kazuyuki Okano , Toru Okazaki , Naoki Tagami , Koji Omura , Nobuyoshi Takeuchi , Tsugihiro Matsuda , Makoto Horiuchi
IPC分类号: H05B33/12
CPC分类号: H05B33/12 , F21K9/232 , F21V3/02 , F21V3/061 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/505 , H01L2224/45144 , H01L2224/48091 , H01L2224/8592 , H01L2924/09701 , H01L2924/181 , H01L2924/3025 , H05K1/0306 , H05K2201/10106 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A mounting board is provided which is translucent and has a surface on which an LED is mounted. The mounting board includes a sintered body film having a wavelength shifter which converts a wavelength of light and a sintering binder made of an inorganic material. The wavelength shifter converts a wavelength of light proceeding toward the surface on which the LED is mounted among light emitted by the LED and radiates wavelength-converted light. The sintering binder transmits the light emitted by the LED and the wavelength-converted light.
摘要翻译: 提供了一种半透明的安装板,并具有安装有LED的表面。 安装板包括具有转换光波长的波长移位器和由无机材料制成的烧结粘合剂的烧结体膜。 波长移位器在LED发出的光中转换朝向安装有LED的表面的光的波长,并且发射波长转换的光。 烧结粘合剂透射由LED发射的光和波长转换的光。
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公开(公告)号:US20140152177A1
公开(公告)日:2014-06-05
申请号:US14234187
申请日:2012-02-03
申请人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Yoshinori Kakuno , Masahiro Miki , Hideo Nagai , Takaari Uemoto
发明人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Yoshinori Kakuno , Masahiro Miki , Hideo Nagai , Takaari Uemoto
IPC分类号: F21K99/00
CPC分类号: F21K9/1355 , F21K9/23 , F21K9/232 , F21K9/238 , F21K9/90 , F21V19/003 , F21V23/006 , F21V29/15 , F21V29/507 , F21Y2115/10
摘要: In a lamp: an LED module and a circuit unit for lighting are housed within an envelope composed of a globe and a case; the LED module is attached to an end of an extension member that extends from a mount, which closes an opening at one end of the case, into the globe; the circuit unit is mounted inside the case; an insulation member disposed inside the case ensures insulation between the mount, which is made of metal, and the circuit unit; the insulation member has a bottomed cylinder portion inserted into the mount, and a protrusion portion formed on an outer circumference of the based cylinder portion that protrudes toward an inner surface of the mount; and the insulation member is attached to the mount by the protrusion portion pressing against the inner surface of the mount.
摘要翻译: 在灯中:用于照明的LED模块和电路单元容纳在由球体和壳体组成的信封内; LED模块附接到延伸构件的端部,该延伸构件从将壳体的一端封闭开口的安装件延伸到球体中; 电路单元安装在壳体内; 设置在壳体内的绝缘构件确保由金属制成的安装座与电路单元之间的绝缘; 所述绝缘构件具有插入所述安装件中的有底圆筒部分,以及形成在所述基座筒部的外周上朝向所述安装件的内表面突出的突出部分; 并且所述绝缘构件通过所述突出部分抵靠所述安装件的内表面附接到所述安装件。
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公开(公告)号:US20130249381A1
公开(公告)日:2013-09-26
申请号:US13818314
申请日:2011-10-18
申请人: Nobuyoshi Takeuchi , Tsugihiro Matsuda , Hideo Nagai , Masahiro Miki , Takaari Uemoto , Yoshinori Kakuno
发明人: Nobuyoshi Takeuchi , Tsugihiro Matsuda , Hideo Nagai , Masahiro Miki , Takaari Uemoto , Yoshinori Kakuno
IPC分类号: H05B33/02
CPC分类号: H05B33/02 , F21K9/232 , F21V3/00 , F21V19/004 , F21Y2115/10 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/49107 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要: A light bulb shaped lamp includes: an LED module including: a base mount; and a semiconductor light-emitting device mounted on the base mount; and lead wires for supplying power to the LED module. The base mount is supported by the lead wires.
摘要翻译: 一种灯泡状灯,包括:LED模块,包括:基座; 以及安装在所述基座上的半导体发光装置; 以及用于向LED模块供电的导线。 底座由导线支撑。
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公开(公告)号:US08981636B2
公开(公告)日:2015-03-17
申请号:US14234187
申请日:2012-02-03
申请人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Yoshinori Kakuno , Masahiro Miki , Hideo Nagai , Takaari Uemoto
发明人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Yoshinori Kakuno , Masahiro Miki , Hideo Nagai , Takaari Uemoto
CPC分类号: F21K9/1355 , F21K9/23 , F21K9/232 , F21K9/238 , F21K9/90 , F21V19/003 , F21V23/006 , F21V29/15 , F21V29/507 , F21Y2115/10
摘要: In a lamp: an LED module and a circuit unit for lighting are housed within an envelope composed of a globe and a case; the LED module is attached to an end of an extension member that extends from a mount, which closes an opening at one end of the case, into the globe; the circuit unit is mounted inside the case; an insulation member disposed inside the case ensures insulation between the mount, which is made of metal, and the circuit unit; the insulation member has a bottomed cylinder portion inserted into the mount, and a protrusion portion formed on an outer circumference of the based cylinder portion that protrudes toward an inner surface of the mount; and the insulation member is attached to the mount by the protrusion portion pressing against the inner surface of the mount.
摘要翻译: 在灯中:用于照明的LED模块和电路单元容纳在由球体和壳体组成的信封内; LED模块附接到延伸构件的端部,该延伸构件从将壳体的一端封闭开口的安装件延伸到球体中; 电路单元安装在壳体内; 设置在壳体内的绝缘构件确保由金属制成的安装座与电路单元之间的绝缘; 所述绝缘构件具有插入所述安装件中的有底圆筒部,以及形成在所述基座筒部的外周上朝向所述安装件的内表面突出的突出部; 并且所述绝缘构件通过所述突出部分抵靠所述安装件的内表面附接到所述安装件。
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公开(公告)号:US08587011B2
公开(公告)日:2013-11-19
申请号:US13502662
申请日:2011-09-06
申请人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
发明人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
IPC分类号: H01L33/00
CPC分类号: H01L33/486 , F21K9/232 , F21V3/00 , F21Y2105/10 , F21Y2115/10 , H01L33/507 , H01L2924/0002 , H01L2933/0033 , H01L2924/00
摘要: A light-emitting device which emits light omnidirectionally is provided. A light-emitting device according to the present invention includes: a package which is translucent; an LED provided in a recess in the package; and a sealing member for sealing the LED and packaging the recess; and the recess includes a bottom surface on which the LED is mounted and a side surface surrounding a bottom surface, and light emitted by the LED is transmitted inside the package through the bottom surface and the side surface of the recess and is emitted to outside of the package from the back surface and the side surface of the package.
摘要翻译: 提供了全向发光的发光装置。 根据本发明的发光器件包括:半透明的封装; 设置在所述封装中的凹部中的LED; 以及用于密封LED并封装凹部的密封构件; 并且所述凹部包括其上安装有LED的底表面和围绕底表面的侧表面,并且由所述LED发射的光通过所述凹部的底表面和侧表面在所述封装内部传输并且被发射到 包装从包装的后表面和侧表面。
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公开(公告)号:US08421111B2
公开(公告)日:2013-04-16
申请号:US13503242
申请日:2011-08-23
申请人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
发明人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
IPC分类号: H01L33/00
CPC分类号: H01L33/507 , F21K9/232 , F21V3/00 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/486 , H01L33/505 , H01L33/508 , H01L2924/0002 , H01L2924/00012 , H01L2924/00
摘要: A light-emitting device including: a base which is translucent; a semiconductor light-emitting element provided on the base; a sealing member for sealing the semiconductor light-emitting element and including a first wavelength conversion material for converting a wavelength of light emitted by the semiconductor light-emitting element to a predetermined wavelength; and a groove provided on a side of the semiconductor light-emitting element, recessed from a top surface of the base on which the semiconductor light-emitting element is provided or a back surface of the base which is a surface opposite to the top surface, and for holding a second wavelength conversion material for converting the wavelength of the light emitted by the semiconductor light-emitting element to the predetermined wavelength.
摘要翻译: 一种发光器件,包括:半透明的基底; 设置在基座上的半导体发光元件; 用于密封半导体发光元件并且包括用于将由半导体发光元件发射的光的波长转换为预定波长的第一波长转换材料的密封构件; 以及设置在半导体发光元件的从设置有半导体发光元件的基座的顶面凹下的槽或与该顶面相反的表面的基座的后表面的槽, 并且用于保持用于将由半导体发光元件发射的光的波长转换为预定波长的第二波长转换材料。
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公开(公告)号:US20120235181A1
公开(公告)日:2012-09-20
申请号:US13503242
申请日:2011-08-23
申请人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
发明人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
IPC分类号: H01L33/08
CPC分类号: H01L33/507 , F21K9/232 , F21V3/00 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/486 , H01L33/505 , H01L33/508 , H01L2924/0002 , H01L2924/00012 , H01L2924/00
摘要: A light-emitting device including: a base which is translucent; a semiconductor light-emitting element provided on the base; a sealing member for sealing the semiconductor light-emitting element and including a first wavelength conversion material for converting a wavelength of light emitted by the semiconductor light-emitting element to a predetermined wavelength; and a groove provided on a side of the semiconductor light-emitting element, recessed from a top surface of the base on which the semiconductor light-emitting element is provided or a back surface of the base which is a surface opposite to the top surface, and for holding a second wavelength conversion material for converting the wavelength of the light emitted by the semiconductor light-emitting element to the predetermined wavelength.
摘要翻译: 一种发光器件,包括:半透明的基底; 设置在基座上的半导体发光元件; 用于密封半导体发光元件并且包括用于将由半导体发光元件发射的光的波长转换为预定波长的第一波长转换材料的密封构件; 以及设置在半导体发光元件的从设置有半导体发光元件的基座的顶面凹下的槽或与该顶面相反的表面的基座的后表面的槽, 并且用于保持用于将由半导体发光元件发射的光的波长转换为预定波长的第二波长转换材料。
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公开(公告)号:US20130049031A1
公开(公告)日:2013-02-28
申请号:US13502662
申请日:2011-09-06
申请人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
发明人: Tsugihiro Matsuda , Nobuyoshi Takeuchi , Hideo Nagai , Takaari Uemoto , Masahiro Miki , Atsushi Motoya
CPC分类号: H01L33/486 , F21K9/232 , F21V3/00 , F21Y2105/10 , F21Y2115/10 , H01L33/507 , H01L2924/0002 , H01L2933/0033 , H01L2924/00
摘要: A light-emitting device which emits light omnidirectionally is provided. A light-emitting device according to the present invention includes: a package which is translucent; an LED provided in a recess in the package; and a sealing member for sealing the LED and packaging the recess; and the recess includes a bottom surface on which the LED is mounted and a side surface surrounding a bottom surface, and light emitted by the LED is transmitted inside the package through the bottom surface and the side surface of the recess and is emitted to outside of the package from the back surface and the side surface of the package.
摘要翻译: 提供了全向发光的发光装置。 根据本发明的发光器件包括:半透明的封装; 设置在所述封装中的凹部中的LED; 以及用于密封LED并封装凹部的密封构件; 并且所述凹部包括其上安装有LED的底表面和围绕底表面的侧表面,并且由所述LED发射的光通过所述凹部的底表面和侧表面在所述封装内部传输并且被发射到 包装从包装的后表面和侧表面。
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公开(公告)号:US09016900B2
公开(公告)日:2015-04-28
申请号:US13882204
申请日:2011-11-04
IPC分类号: F21V29/00 , F21V23/00 , F21K99/00 , F21V19/00 , F21Y101/02 , F21V3/04 , F21Y103/00 , F21Y105/00
CPC分类号: F21V23/002 , F21K9/232 , F21V3/061 , F21V19/003 , F21V23/001 , F21V29/85 , F21Y2103/10 , F21Y2105/10 , F21Y2115/10 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/4903 , H01L2224/49107 , H01L2224/73265 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A light bulb shaped lamp according to the present invention includes: a hollow globe; an LED module including a base platform and an LED chip mounted on the base platform, the LED module being provided in the globe; a lead wire for supplying power to the LED module; and a stem extending toward the interior of the globe, in which the base platform is directly fixed to the stem.
摘要翻译: 根据本发明的灯泡形灯包括:中空球体; LED模块,其包括基座平台和安装在所述基台上的LED芯片,所述LED模块设置在所述球体中; 用于向LED模块供电的引线; 以及朝向球体内部延伸的杆,其中基座平台直接固定到杆上。
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