摘要:
In an optically scanning displacement detector for determination of an object's profile, the detector comprises a light projecting unit for radiating a light beam on the object, a light receiving unit for receiving a reflected light beam from the object to output an object position signal, and a distance determining unit for determining a distance between the projecting unit and the object in accordance with the object position signal. The light projecting and receiving units are mounted in a carrier which is movably supported to a frame. The carrier can be moved in a scanning direction to scan the light beam across the object by the use of an electric motor such as a voice-coil linear motor. Since the present detector does not use a scanning mirror for deviating the light beam, the object's profile can be determined with improved accuracy of measurement, while preventing a formation of dead space in which the light beam can not be radiated during the scanning operation. The detector also comprises a carrier position sensor for determining a position of the carrier in the scanning direction, and a safeguard unit for sensing unusual operation of the motor to generate a stop signal, and stopping a supply of electric current to the motor in response to the stop signal.
摘要:
An optical sensor comprises a sensor circuit having parts which are optically interconnected with each other through an optical interconnection board interposed therebetween. The interconnection between the sensor circuit parts is thereby simplified remarkably, so that the mass-producibility of the sensor can be increased to lower its manufacturing costs.
摘要:
An optical sensor discriminating the presence of an object or detecting distance to an object which includes a light projecting element for projecting light to a detection area, a light receiving element for receiving light reflected from an object present in the detection area and an anamorphic light receiving lens for expanding a condensed light spot received on the light receiving element in a direction perpendicular to a direction of movement of the light spot on the light receiving element. The light receiving element outputs a detection signal which discriminates the presence of the object in the detection area. The light receiving element can be rectangular in shape and comprise two or more triangular shaped photodiodes which output detection signals that can be processed to determine a distance between the object and the light receiving element. A movable prism can also be provided to compensate for movement of the object other than towards or away from the light receiving element to avoid erroneous distance measurement which might otherwise occur.
摘要:
A connector receptacle (20) is constituted by a contact (2) to which a data signal is serially communicated through a connector plug and a physical layer basic circuit (5) provided inside the connector receptacle (20) and adapted to perform specified processings so that the data signal is parallel communicated between the basic circuit and a link layer circuit for the communication. As a result, the distance between the contact (2) and the physical layer basic circuit (5) is short. Therefore, it is not necessary to pay so much attention as in conventional cases in designing a pattern layout (7) so as to prevent influence on the EMI and transmission characteristics, and it is easy to design the layout of the pattern constituting the transmission line for the data.
摘要:
An integrated circuit formed on a semiconductor chip includes voltage regulators for stepping down an externally-supplied power voltage to produce an internal power voltage, and internal circuits which operate based on the internal power voltage. The voltage regulators are laid in the area of the buffers and protective elements for the input/output signals and power voltages so that the overhead area due to the on-chip provision of the voltage regulators is minimized. The internal power voltage is distributed to the internal circuits through a looped main power line, with an electrode pad for connecting an external capacitor for stabilizing the internal power voltage being provided on it, so that the internal power voltage is stabilized and the power consumption of the integrated circuit is minimized.
摘要:
The semiconductor integrated circuit is provided, in which an external temperature control or temperature monitoring is possible, with little influence by the noise of a system board which mounts the semiconductor integrated circuit. The semiconductor integrated circuit includes the temperature detection circuit which detects the chip temperature, and the functional module which flows a large operating current. An external terminal which supplies operating voltage, and an external terminal which supplies ground voltage are coupled to the functional module. The temperature detection circuit generates a temperature detection signal and a reference signal. The reference signal and the temperature detection signal are led out to the exterior of the semiconductor integrated circuit via a first external output terminal and a second external output terminal, respectively, and are supplied to an external temperature control/monitoring circuit which has a circuitry type of a differential amplifier circuit.
摘要:
A difference between both emitter voltages of a first transistor having an emitter through which a first current flows, and at least one second transistor having an emitter through which such a second current as to reach a current density thereof smaller than that of the emitter of the first transistor flows, is applied across a first resistor. A second resistor is provided between the emitter of the second transistor and a circuit's ground potential. A third resistor and a fourth resistor are respectively provided between collectors of the first and second transistors and a power supply voltage. Such an output voltage that a collector voltage of the first transistor and a collector voltage of the second transistor become equal is formed in response to the collector voltage of the first transistor and the collector voltage of the second transistor and supplied to bases of the first and second transistors in common. A temperature sense voltage is formed from a connecting point of the first and second resistors.
摘要:
An integrated circuit formed on a semiconductor chip includes voltage regulators for stepping down an externally-supplied power voltage to produce an internal power voltage, and internal circuits which operate based on the internal power voltage. The voltage regulators are laid in the area of the buffers and protective elements for the input/output signals and power voltages so that the overhead area due to the on-chip provision of the voltage regulators is minimized. The internal power voltage is distributed to the internal circuits through a looped main power line, with an electrode pad for connecting an external capacitor for stabilizing the internal power voltage being provided on it, so that the internal power voltage is stabilized and the power consumption of the integrated circuit is minimized.
摘要:
For an internal circuit having a first operation mode consuming a first operational current and a second operation mode consuming a second and smaller operational current, a first regulator for providing a predefined voltage from an input voltage and having a current supply ability corresponding to the first operational current and a second regulator having a current supply ability corresponding to the second operational current are provided. A power supply control unit operates the first regulator in response to a first control signal instructing the first operation mode and operates the second regulator in response to a second control signal instructing the second operation mode. The internal circuit and power supply control unit are provided in one semiconductor integrated circuit device.
摘要:
An integrated circuit formed on a semiconductor chip includes voltage regulators for stepping down an externally-supplied power voltage to produce an internal power voltage, and internal circuits which operate based on the internal power voltage. The voltage regulators are laid in the area of the buffers and protective elements for the input/output signals and power voltages so that the overhead area due to the on-chip provision of the voltage regulators is minimized. The internal power voltage is distributed to the internal circuits through a looped main power line, with an electrode pad for connecting an external capacitor for stabilizing the internal power voltage being provided on it, so that the internal power voltage is stabilized and the power consumption of the integrated circuit is minimized.