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公开(公告)号：US20140126856A1
公开(公告)日：2014-05-08
申请号：US14149626
申请日：2014-01-07
IPC分类号： G02F1/01
CPC分类号： G02F1/0136 , G02B6/125 , G02B6/126 , G02B6/2726 , G02B6/2773 , G02B6/29344 , G02B6/34 , G02B6/4286 , G02B2006/12142 , G02F1/011 , G02F1/313
摘要： A method and system for integrated power combiners are disclosed and may include a chip comprising a polarization controller, the polarization controller comprising an input optical waveguide, optical couplers, and a polarization-splitting grating coupler. The chip may be operable to: generate two output signals from a first optical coupler that receives an input signal from said input optical waveguide, phase modulate one or both of the two output signals to configure a phase offset between the two generated output signals before communicating signals with the phase offset to a second optical coupler. One or both optical signals generated by said second optical coupler may be phase modulated to configure a phase offset between signals communicated to the polarization-splitting grating coupler; and an optical signal of a desired polarization may be launched into an optical fiber via the polarization-splitting grating coupler by combining the signals communicated to the polarization-splitting grating coupler.
摘要翻译： 公开了用于集成功率组合器的方法和系统，并且可以包括包括偏振控制器的芯片，所述偏振控制器包括输入光波导，光耦合器和偏振分离光栅耦合器。 该芯片可操作用于：从第一光耦合器产生两个输出信号，该第一光耦合器从所述输入光波导接收输入信号，相位调制两个输出信号中的一个或两者，以在通信之前配置两个产生的输出信号之间的相位偏移 具有相位偏移到第二光耦合器的信号。 由所述第二光耦合器产生的一个或两个光信号可以被相位调制以配置传送到偏振分离光栅耦合器的信号之间的相位偏移; 并且通过组合传送到偏振分离光栅耦合器的信号，可以通过偏振分离光栅耦合器将期望的偏振光学信号发射到光纤中。
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公开(公告)号：US20190196230A1
公开(公告)日：2019-06-27
申请号：US16293233
申请日：2019-03-05
CPC分类号： G02F1/0136 , G02B6/125 , G02B6/126 , G02B6/2726 , G02B6/2773 , G02B6/29344 , G02B6/34 , G02B6/4286 , G02B2006/12142 , G02F1/011 , G02F1/313
摘要： A system for integrated power combiners is disclosed and may include receiving optical signals in input optical waveguides and phase-modulating the signals to configure a phase offset between signals received at a first optical coupler, where the first optical coupler may generate output signals having substantially equal optical powers. Output signals of the first optical coupler may be phase-modulated to configure a phase offset between signals received at a second optical coupler, which may generate an output signal having an optical power of essentially zero and a second output signal having a maximized optical power. Optical signals received by the input optical waveguides may be generated utilizing a polarization-splitting grating coupler to enable polarization-insensitive combining of optical signals. Optical power may be monitored using optical detectors. The monitoring of optical power may be used to determine a desired phase offset between the signals received at the first optical coupler.
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公开(公告)号：US20110305414A1
公开(公告)日：2011-12-15
申请号：US13157642
申请日：2011-06-10
IPC分类号： G02F1/035
CPC分类号： G02F1/0136 , G02B6/125 , G02B6/126 , G02B6/2726 , G02B6/2773 , G02B6/29344 , G02B6/34 , G02B6/4286 , G02B2006/12142 , G02F1/011 , G02F1/313
摘要： A system for integrated power combiners is disclosed and may include receiving optical signals in input optical waveguides and phase-modulating the signals to configure a phase offset between signals received at a first optical coupler, where the first optical coupler may generate output signals having substantially equal optical powers. Output signals of the first optical coupler may be phase-modulated to configure a phase offset between signals received at a second optical coupler, which may generate an output signal having an optical power of essentially zero and a second output signal having a maximized optical power. Optical signals received by the input optical waveguides may be generated utilizing a polarization-splitting grating coupler to enable polarization-insensitive combining of optical signals. Optical power may be monitored using optical detectors. The monitoring of optical power may be used to determine a desired phase offset between the signals received at the first optical coupler.
摘要翻译： 公开了用于集成功率组合器的系统，并且可以包括在输入光波导中接收光信号并相位调制信号以配置在第一光耦合器处接收的信号之间的相位偏移，其中第一光耦合器可以产生具有基本相等的输出信号 光功率 可以对第一光耦合器的输出信号进行相位调制，以配置在第二光耦合器处接收的信号之间的相位偏移，其可以产生具有基本为零的光功率的输出信号和具有最大光功率的第二输出信号。 由输入光波导接收的光信号可以利用偏振光分离光栅耦合器产生，以实现光信号的偏振不敏感组合。 可以使用光学检测器监视光功率。 可以使用光功率的监视来确定在第一光耦合器处接收的信号之间的期望的相位偏移。
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公开(公告)号：US08625935B2
公开(公告)日：2014-01-07
申请号：US13157642
申请日：2011-06-10
CPC分类号： G02F1/0136 , G02B6/125 , G02B6/126 , G02B6/2726 , G02B6/2773 , G02B6/29344 , G02B6/34 , G02B6/4286 , G02B2006/12142 , G02F1/011 , G02F1/313
摘要： A system for integrated power combiners is disclosed and may include receiving optical signals in input optical waveguides and phase-modulating the signals to configure a phase offset between signals received at a first optical coupler, where the first optical coupler may generate output signals having substantially equal optical powers. Output signals of the first optical coupler may be phase-modulated to configure a phase offset between signals received at a second optical coupler, which may generate an output signal having an optical power of essentially zero and a second output signal having a maximized optical power. Optical signals received by the input optical waveguides may be generated utilizing a polarization-splitting grating coupler to enable polarization-insensitive combining of optical signals. Optical power may be monitored using optical detectors. The monitoring of optical power may be used to determine a desired phase offset between the signals received at the first optical coupler.
摘要翻译： 公开了用于集成功率组合器的系统，并且可以包括在输入光波导中接收光信号并对信号进行相位调制以配置在第一光耦合器处接收的信号之间的相位偏移，其中第一光耦合器可以产生具有基本相等的输出信号 光功率 可以对第一光耦合器的输出信号进行相位调制，以配置在第二光耦合器处接收的信号之间的相位偏移，其可以产生具有基本为零的光功率的输出信号和具有最大光功率的第二输出信号。 由输入光波导接收的光信号可以利用偏振光分离光栅耦合器产生，以实现光信号的偏振不敏感组合。 可以使用光学检测器监视光功率。 可以使用光功率的监视来确定在第一光耦合器处接收的信号之间的期望的相位偏移。
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5.发明申请Method And System For Coupling Optical Signals Into Silicon Optoelectronic Chips 有权将光信号耦合到硅光电芯片的方法和系统公开(公告)号：US20120314997A1
公开(公告)日：2012-12-13
申请号：US13590821
申请日：2012-08-21
申请人： Thierry Pinguet , Attila Mekis , Steffen Gloeckner
发明人： Thierry Pinguet , Attila Mekis , Steffen Gloeckner
IPC分类号： G02B6/34
CPC分类号： G02B6/124 , G01J1/02 , G01J1/0425 , G02B6/12004 , G02B6/30 , G02B6/34 , G02B6/4208 , G02B2006/12038 , G02B2006/12061 , G02B2006/12104 , G02B2006/12157
摘要： A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of one or more of a plurality of CMOS photonic chips comprising photonic, electronic, and optoelectronic devices. The devices may be integrated in a front surface of the chips and optical couplers may receive the optical signals in the front surface of the chips. The optical signals may be coupled into the back surface of the chips via optical fibers and/or optical source assemblies. The optical signals may be coupled to the optical couplers via a light path etched in the chips, which may be refilled with silicon dioxide. The chips may be flip-chip bonded to a packaging substrate. Optical signals may be reflected back to the optical couplers via metal reflectors, which may be integrated in dielectric layers on the chips.
摘要翻译： 公开了一种用于将光信号耦合到硅光电子芯片的方法和系统，并且可以包括将一个或多个光信号耦合到包括光子，电子和光电器件的多个CMOS光子芯片中的一个或多个的后表面中。 这些器件可以集成在芯片的前表面中，并且光耦合器可以接收芯片前表面中的光信号。 光信号可以经由光纤和/或光源组件耦合到芯片的后表面中。 光信号可以经由在芯片中蚀刻的光路耦合到光耦合器，其可以用二氧化硅再填充。 芯片可以倒装芯片结合到封装基板。 光信号可以经由金属反射器反射回到光耦合器，金属反射器可以集成在芯片上的电介质层中。
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6.发明申请Method and System For Coupling Optical Signals Into Silicon Optoelectronic Chips 有权将光信号耦合到硅光电芯片的方法和系统公开(公告)号：US20120163755A9
公开(公告)日：2012-06-28
申请号：US12614024
申请日：2009-11-06
申请人： Thierry Pinguet , Attila Mekis , Steffen Gloeckner
发明人： Thierry Pinguet , Attila Mekis , Steffen Gloeckner
CPC分类号： G02B6/124 , G01J1/02 , G01J1/0425 , G02B6/12004 , G02B6/30 , G02B6/34 , G02B6/4208 , G02B2006/12038 , G02B2006/12061 , G02B2006/12104 , G02B2006/12157
摘要： A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a CMOS photonic chip comprising photonic, electronic, and optoelectronic devices. The devices may be integrated in a front surface of the chip and one or more grating couplers may receive the optical signals in the front surface of the chip. The optical signals may be coupled into the back surface of the chip via one or more optical fibers and/or optical source assemblies. The optical signals may be coupled to the grating couplers via a light path etched in the chip, which may be refilled with silicon dioxide. The chip may be flip-chip bonded to a packaging substrate. Optical signals may be reflected back to the grating couplers via metal reflectors, which may be integrated in dielectric layers on the chip.
摘要翻译： 公开了一种用于将光信号耦合到硅光电芯片的方法和系统，并且可以包括将一个或多个光信号耦合到包括光子，电子和光电器件的CMOS光子芯片的背表面中。 器件可以集成在芯片的前表面中，并且一个或多个光栅耦合器可以在芯片的前表面中接收光信号。 光信号可以经由一个或多个光纤和/或光源组件耦合到芯片的后表面中。 光信号可以通过蚀刻在芯片中的光路耦合到光栅耦合器，其可以用二氧化硅再填充。 芯片可以倒装芯片结合到封装基板。 光信号可以经由金属反射器反射回光栅耦合器，金属反射器可以集成在芯片上的电介质层中。
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公开(公告)号：US20100209114A1
公开(公告)日：2010-08-19
申请号：US12708496
申请日：2010-02-18
IPC分类号： H04B10/12
CPC分类号： H04B10/2587
摘要： A method and system for single laser bidirectional links are disclosed and may include communicating a high speed optical signal from a transmit CMOS photonics chip to a receive CMOS photonics chip and communicating a low-speed optical signal from the receive CMOS photonics chip to the transmit CMOS photonics chip via one or more optical fibers. The optical signals may be coupled to and from the CMOS photonics chips utilizing single-polarization grating couplers. The optical signals may be coupled to and from the CMOS photonics chips utilizing polarization-splitting grating couplers. The optical signals may be amplitude or phase modulated. The optical fibers may comprise single-mode or polarization-maintaining fibers. A polarization of the high-speed optical signal may be configured before communicating it over the single-mode fibers. The low-speed optical signal may be generated by modulating the received high-speed optical signal or from a portion of the received high-speed optical signal.
摘要翻译： 公开了用于单激光双向链路的方法和系统，并且可以包括将来自发射CMOS光子芯片的高速光信号传送到接收CMOS光子芯片，并将低速光信号从接收CMOS光子芯片传送到发射CMOS 光子芯片通过一根或多根光纤。 光信号可以使用单偏振光栅耦合器耦合到CMOS光子芯片和从CMOS光子芯片耦合。 光信号可以使用偏振分离光栅耦合器耦合到CMOS光子芯片和从CMOS光子芯片耦合。 光信号可以是幅度或相位调制的。 光纤可以包括单模或偏振保持光纤。 可以在通过单模光纤通信之前配置高速光信号的极化。 低速光信号可以通过调制所接收的高速光信号或从所接收的高速光信号的一部分来产生。
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8.发明申请公开(公告)号：US20140010498A1
公开(公告)日：2014-01-09
申请号：US13936408
申请日：2013-07-08
申请人： Lieven Verslegers , Attila Mekis
发明人： Lieven Verslegers , Attila Mekis
IPC分类号： G02B6/42
CPC分类号： G02B6/26 , G02B5/1861 , G02B6/124 , G02B6/126 , G02B6/30 , G02B6/34 , G02B6/4214 , G02B2006/12107 , G02B2006/12147 , G02B2006/1215
摘要： Methods and systems for grating couplers incorporating perturbed waveguides are disclosed and may include in a semiconductor photonics die, communicating optical signals into and/or out of the die utilizing a grating coupler on the die, where the grating coupler comprises perturbed waveguides. The perturbed waveguides may comprise a variable width along their length. The grating coupler may comprise a single polarization grating coupler comprising perturbed waveguides and a non-perturbed grating. The grating coupler may comprise a polarization splitting grating coupler (PSCC) that includes two sets of perturbed waveguides at a non-zero angle, or a plurality of non-linear rows of discrete shapes. The PSCC may comprise discrete scatterers at an intersection of the sets of perturbed waveguides. The grating couplers may be etched in a silicon layer on the semiconductor photonics die or deposited on the semiconductor photonics die. The grating coupler may comprise individual scatterers between the perturbed waveguides.
摘要翻译： 公开了包含扰动波导的光栅耦合器的方法和系统，并且可以包括在半导体光子管芯中，使用管芯上的光栅耦合器将光信号传送到和/或离开裸片，其中光栅耦合器包括扰动的波导。 扰动的波导可以包括沿其长度的可变宽度。 光栅耦合器可以包括包含扰动波导和非扰动光栅的单偏振光栅耦合器。 光栅耦合器可以包括偏振光分裂光栅耦合器（PSCC），其包括非零角度的两组扰动波导或多个离散形状的非线性行。 PSCC可以包括在这些扰动波导组的交点处的离散散射体。 光栅耦合器可以在半导体光子管芯上的硅层中蚀刻或沉积在半导体光子晶体管上。 光栅耦合器可以包括扰动波导之间的各个散射体。
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9.发明授权Method and system for coupling optical signals into silicon optoelectronic chips 有权将光信号耦合到硅光电芯片的方法和系统公开(公告)号：US08280207B2
公开(公告)日：2012-10-02
申请号：US12614024
申请日：2009-11-06
申请人： Thierry Pinguet , Attila Mekis , Steffen Gloeckner
发明人： Thierry Pinguet , Attila Mekis , Steffen Gloeckner
IPC分类号： G02B6/34
CPC分类号： G02B6/124 , G01J1/02 , G01J1/0425 , G02B6/12004 , G02B6/30 , G02B6/34 , G02B6/4208 , G02B2006/12038 , G02B2006/12061 , G02B2006/12104 , G02B2006/12157
摘要： A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a CMOS photonic chip comprising photonic, electronic, and optoelectronic devices. The devices may be integrated in a front surface of the chip and one or more grating couplers may receive the optical signals in the front surface of the chip. The optical signals may be coupled into the back surface of the chip via one or more optical fibers and/or optical source assemblies. The optical signals may be coupled to the grating couplers via a light path etched in the chip, which may be refilled with silicon dioxide. The chip may be flip-chip bonded to a packaging substrate. Optical signals may be reflected back to the grating couplers via metal reflectors, which may be integrated in dielectric layers on the chip.
摘要翻译： 公开了一种用于将光信号耦合到硅光电芯片的方法和系统，并且可以包括将一个或多个光信号耦合到包括光子，电子和光电器件的CMOS光子芯片的背表面中。 器件可以集成在芯片的前表面中，并且一个或多个光栅耦合器可以在芯片的前表面中接收光信号。 光信号可以经由一个或多个光纤和/或光源组件耦合到芯片的后表面中。 光信号可以通过蚀刻在芯片中的光路耦合到光栅耦合器，其可以用二氧化硅再填充。 芯片可以倒装芯片结合到封装基板。 光信号可以经由金属反射器反射回光栅耦合器，金属反射器可以集成在芯片上的电介质层中。
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10.发明申请METHOD AND SYSTEM FOR MONOLITHIC INTEGRATION OF PHOTONICS AND ELECTRONICS IN CMOS PROCESSES 有权CMOS工艺中光电子和电子单片集成的方法与系统公开(公告)号：US20100059822A1
公开(公告)日：2010-03-11
申请号：US12554449
申请日：2009-09-04
申请人： Thierry Pinguet , Steffen Gloeckner , Peter De Dobbelaere , Sherif Abdalla , Daniel Kucharski , Gianlorenzo Masini , Kosei Yokoyama , John Guckenberger , Attila Mekis
发明人： Thierry Pinguet , Steffen Gloeckner , Peter De Dobbelaere , Sherif Abdalla , Daniel Kucharski , Gianlorenzo Masini , Kosei Yokoyama , John Guckenberger , Attila Mekis
IPC分类号： H01L27/12 , H01L21/782
CPC分类号： H04B10/2575 , H01L21/84 , H01L27/1203 , H04B10/40
摘要： Methods and systems for monolithic integration of photonics and electronics in CMOS processes are disclosed and may include fabricating photonic and electronic devices on a single CMOS wafer with different silicon layer thicknesses. The devices may be fabricated on a semiconductor-on-insulator (SOI) wafer utilizing a bulk CMOS process and/or on a SOI wafer utilizing a SOI CMOS process. The different thicknesses may be fabricated utilizing a double SOI process and/or a selective area growth process. Cladding layers may be fabricated utilizing one or more oxygen implants and/or utilizing CMOS trench oxide on the CMOS wafer. Silicon may be deposited on the CMOS trench oxide utilizing epitaxial lateral overgrowth. Cladding layers may be fabricated utilizing selective backside etching. Reflective surfaces may be fabricated by depositing metal on the selectively etched regions. Silicon dioxide or silicon germanium integrated in the CMOS wafer may be utilized as an etch stop layer.
摘要翻译： 公开了用于在CMOS工艺中单片集成光子学和电子学的方法和系统，并且可以包括在具有不同硅层厚度的单个CMOS晶片上制造光子和电子器件。 利用体CMOS工艺和/或利用SOI CMOS工艺的SOI晶片，可以在绝缘体上半导体（SOI）晶片上制造器件。 可以使用双重SOI工艺和/或选择性区域生长工艺来制造不同的厚度。 可以利用一个或多个氧注入和/或在CMOS晶片上利用CMOS沟槽氧化物来制造覆层。 硅可以利用外延横向过度生长沉积在CMOS沟槽氧化物上。 可以利用选择性背面蚀刻来制造包覆层。 可以通过在选择性蚀刻的区域上沉积金属来制造反射表面。 集成在CMOS晶片中的二氧化硅或硅锗可以用作蚀刻停止层。
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