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公开(公告)号:US20230112531A1
公开(公告)日:2023-04-13
申请号:US17701683
申请日:2022-03-23
Applicant: Au Optronics Corporation
Inventor: Yang-En Wu , Shih-Hsiung Lin , Jenn-Jia Su , June Woo Lee
IPC: H01L25/075 , H01L23/00 , H01L33/00 , H01L33/62
Abstract: A display panel includes a pixel array substrate, a plurality of vertical light emitting devices and a flip-chip light emitting device. The pixel array substrate has a first pixel area and a second pixel area. The vertical light emitting devices are disposed in the first pixel area and the second pixel area and electrically connected to the pixel array substrate. The flip-chip light emitting device is disposed in the second pixel area and electrically connected to the pixel array substrate. A color of an emitted light beam of the flip-chip light emitting device and a color of an emitted light beam of one of the vertical light emitting devices located in the first pixel area are identical.
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公开(公告)号:US11955506B2
公开(公告)日:2024-04-09
申请号:US17348681
申请日:2021-06-15
Applicant: Au Optronics Corporation
Inventor: Shih-Hsiung Lin , Yang-En Wu
CPC classification number: H01L27/156 , H01L33/005 , H01L33/0093 , H01L33/382 , H01L33/62 , H01L2933/0016 , H01L2933/0066
Abstract: A fabrication method of a display device includes the following steps: providing a light-emitting diode (LED) display device including an circuit substrate, first LEDs, and a second LED; detecting the LED display device, wherein the second LED cannot emit light normally; removing the second LED from the circuit substrate; providing a LED substrate; transferring a third LED of the LED substrate to a first transferring substrate; transferring the third LED on the first transferring substrate to a second transferring substrate; and electrically connecting the third LED on the second transposed substrate to the circuit substrate.
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公开(公告)号:US20220029051A1
公开(公告)日:2022-01-27
申请号:US17348681
申请日:2021-06-15
Applicant: Au Optronics Corporation
Inventor: Shih-Hsiung Lin , Yang-En Wu
Abstract: A fabrication method of a display device includes the following steps: providing a light-emitting diode (LED) display device including an circuit substrate, first LEDs, and a second LED; detecting the LED display device, wherein the second LED cannot emit light normally; removing the second LED from the circuit substrate; providing a LED substrate; transferring a third LED of the LED substrate to a first transferring substrate; transferring the third LED on the first transferring substrate to a second transferring substrate; and electrically connecting the third LED on the second transposed substrate to the circuit substrate.
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公开(公告)号:US11948928B2
公开(公告)日:2024-04-02
申请号:US17377401
申请日:2021-07-16
Applicant: Au Optronics Corporation
Inventor: Yang-En Wu , Shih-Hsiung Lin
CPC classification number: H01L25/167 , H01L24/95 , H01L24/08 , H01L24/80 , H01L2224/08225 , H01L2224/80815 , H01L2224/95001 , H01L2924/12041 , H01L2924/13069
Abstract: A display apparatus, including a circuit substrate, a driving unit and a light-emitting unit is provided. The driving unit is disposed on the circuit substrate. The light-emitting unit is disposed on the circuit substrate. A thickness of the driving unit is substantially the same as a thickness of the light-emitting unit.
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公开(公告)号:US20220254766A1
公开(公告)日:2022-08-11
申请号:US17377401
申请日:2021-07-16
Applicant: Au Optronics Corporation
Inventor: Yang-En Wu , Shih-Hsiung Lin
Abstract: A display apparatus, including a circuit substrate, a driving unit and a light-emitting unit is provided. The driving unit is disposed on the circuit substrate. The light-emitting unit is disposed on the circuit substrate. A thickness of the driving unit is substantially the same as a thickness of the light-emitting unit.
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公开(公告)号:US20220028924A1
公开(公告)日:2022-01-27
申请号:US17344979
申请日:2021-06-11
Applicant: Au Optronics Corporation
Inventor: Shih-Hsiung Lin , Yang-En Wu
Abstract: A display device includes a circuit substrate and a light-emitting diode. Two electrodes of the light-emitting diode are connected to two pads of the circuit substrate. Each electrode of the light-emitting diode includes a first conductive layer, a barrier layer, and a metal layer. The first conductive layer is connected to a semiconductor stack layer of the light-emitting diode. The barrier layer is electrically connected to the semiconductor stack layer of the light-emitting diode through the first conductive layer. The adhesion of the material selected for the first conductive layer to the semiconductor stack layer is greater than the adhesion of the material selected for the barrier layer to the semiconductor stack layer. The metal layer electrically connects the barrier layer to the corresponding one of the pads. The melting point of the metal layer is lower than 260 degrees Celsius.
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公开(公告)号:US20140104513A1
公开(公告)日:2014-04-17
申请号:US14106855
申请日:2013-12-16
Applicant: Au Optronics Corporation
Inventor: Yi-Shan Chang , Juin-Ming Wu , Shih-Hsiung Lin , Ying-Cheng Chen , Sheng-Hung Wang , Wen-Hau Lee , Chang-Cheng Chen
IPC: G02F1/1333
CPC classification number: G02F1/13338 , G03F7/2022 , G06F3/041 , G06F2203/04103
Abstract: A method of fabricating an electronic apparatus having an active region and a peripheral region surrounding the active region is described. A first main device and a second main device are provided. An optical clear liquid adhesive (OCLA) is applied between the first main device and the second main device and within the active region. A photo-mask having a transparent region and an opaque region is provided above the second main device, and the transparent region corresponds to the peripheral region. An OCLA diffusion process is performed such that the OCLA diffuses from the active region to the peripheral region. During the OCLA diffusion process, a first irradiating process with the photo-mask is performed, such that the OCLA diffusing to the peripheral region is partially cured. After removing the photo-mask, a second irradiating process is performed, such that the OCLA is completely cured.
Abstract translation: 描述了制造具有有源区域和围绕有源区域的周边区域的电子设备的方法。 提供第一主装置和第二主装置。 光学透明液体粘合剂(OCLA)被施加在第一主装置和第二主装置之间并且在有源区域内。 具有透明区域和不透明区域的光掩模设置在第二主设备的上方,透明区域对应于周边区域。 执行OCLA扩散过程,使得OCLA从活性区扩散到周边区域。 在OCLA扩散处理期间,进行利用光掩模的第一照射处理,使得扩散到周边区域的OCLA部分固化。 在去除光掩模之后,进行第二次照射处理,使得OCLA完全固化。
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