DISPLAY PANEL
    1.
    发明申请
    DISPLAY PANEL 审中-公开

    公开(公告)号:US20190107753A1

    公开(公告)日:2019-04-11

    申请号:US16151344

    申请日:2018-10-04

    Abstract: A display panel including a first substrate, a second substrate, a first display medium layer, a polarizing layer, and a second display medium layer is provided. The first display medium layer is disposed between the first substrate and the second substrate. The first display medium layer includes a first base material and a plurality of first encapsulated particles immobilized in the first base material. The average size of the first encapsulated particles is 1 nm to 400 nm. The polarizing layer is disposed between the first display medium layer and the second substrate. The polarizing layer is in contact with the first display medium layer. The second display medium layer is disposed between the polarizing layer and the second substrate.

    DISPLAY DEVICE
    2.
    发明申请

    公开(公告)号:US20230005894A1

    公开(公告)日:2023-01-05

    申请号:US17511600

    申请日:2021-10-27

    Abstract: A display device includes a circuit board and a plurality of light-emitting units disposed on the circuit board. The circuit board includes a substrate and a plurality of signal lines disposed on the substrate. Each light-emitting unit includes a base board, at least one light-emitting element and a driving circuit layer. The light-emitting element is between the base board and the substrate. The driving circuit layer is between the light-emitting element and the base board, and electrically connected to the light-emitting element and the signal line.

    DISPLAY DEVICE, LIGHT-EMITTING DIODE SUBSTRATE, AND FABRICATION METHOD OF DISPLAY DEVICE

    公开(公告)号:US20220028924A1

    公开(公告)日:2022-01-27

    申请号:US17344979

    申请日:2021-06-11

    Abstract: A display device includes a circuit substrate and a light-emitting diode. Two electrodes of the light-emitting diode are connected to two pads of the circuit substrate. Each electrode of the light-emitting diode includes a first conductive layer, a barrier layer, and a metal layer. The first conductive layer is connected to a semiconductor stack layer of the light-emitting diode. The barrier layer is electrically connected to the semiconductor stack layer of the light-emitting diode through the first conductive layer. The adhesion of the material selected for the first conductive layer to the semiconductor stack layer is greater than the adhesion of the material selected for the barrier layer to the semiconductor stack layer. The metal layer electrically connects the barrier layer to the corresponding one of the pads. The melting point of the metal layer is lower than 260 degrees Celsius.

    FABRICATION METHOD OF DISPLAY DEVICE

    公开(公告)号:US20220029051A1

    公开(公告)日:2022-01-27

    申请号:US17348681

    申请日:2021-06-15

    Abstract: A fabrication method of a display device includes the following steps: providing a light-emitting diode (LED) display device including an circuit substrate, first LEDs, and a second LED; detecting the LED display device, wherein the second LED cannot emit light normally; removing the second LED from the circuit substrate; providing a LED substrate; transferring a third LED of the LED substrate to a first transferring substrate; transferring the third LED on the first transferring substrate to a second transferring substrate; and electrically connecting the third LED on the second transposed substrate to the circuit substrate.

    LIGHT EMITTING DIODE DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20200083206A1

    公开(公告)日:2020-03-12

    申请号:US16566897

    申请日:2019-09-11

    Abstract: The light emitting diode display apparatus including a first substrate, a plurality of light emitting diodes, an adhesive layer, a color layer, and a second substrate is provided. The first substrate has a plurality of switching elements. The light emitting diode includes a first semiconductor layer, a plurality of second semiconductor layers, a plurality of light emitting layers, a first electrode, and a plurality of second electrodes. The first electrode is disposed on the first semiconductor layer. The second electrodes are respectively disposed on the corresponding second semiconductor layers. Each of the second electrodes is electrically connected to the corresponding switching element. The adhesive layer and the first substrate are respectively located at two opposite sides of the light emitting diode. The color layer is disposed on the first substrate and covers the adhesive layer and the light emitting diode. The second substrate is disposed opposite to the first substrate.

Patent Agency Ranking