公开(公告)号：US09960671B2

公开(公告)日：2018-05-01

申请号：US14588112

申请日：2014-12-31

Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.

Inventor： Dominique Ho ,  Kwee Chong Chang ,  Kah Weng Lee ,  Brian J. Misek

IPC: H02M3/06 ,  H02M1/32 ,  H01L23/00 ,  H01L25/065 ,  H01L23/60 ,  H01L23/58 ,  H01L23/48 ,  H01L23/495 ,  H01L23/522 ,  H01L23/31

CPC classification number: H02M3/06 ,  H01L23/3107 ,  H01L23/48 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/5223 ,  H01L23/58 ,  H01L23/60 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/0612 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/07025 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/1711 ,  H01L2924/172 ,  H01L2924/3025 ,  H01L2924/386 ,  H02M1/32 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599

Abstract: A capacitive isolation system, capacitive isolator, and method of operating the same are disclosed. The capacitive isolation system is described to include a first semiconductor die and a second semiconductor die each having capacitive elements established thereon and positioned in a face-to-face configuration. An isolation layer is provided between the first and second semiconductor die so as to establish an isolation boundary therebetween. Capacitive coupling is used to carry information across the isolation boundary.