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    ISOLATION DEVICE
    1.
    发明申请
    ISOLATION DEVICE 审中-公开

    公开(公告)号：US20180068946A1

    公开(公告)日：2018-03-08

    申请号：US15798963

    申请日：2017-10-31

    申请人： Avago Technologies General IP (Singapore) Pte. Ltd.

    发明人： Dominique Ho ,  Chris Tao ,  Boon Keat Tan

    IPC分类号： H01L23/522 ,  H01L27/02 ,  H01L23/528

    CPC分类号： H01L23/5223 ,  H01L23/48 ,  H01L23/5225 ,  H01L23/528 ,  H01L27/0288 ,  H01L2224/48463 ,  H01L2224/49107

    摘要： An isolation system, isolation device, and Integrated Circuit are disclosed. The isolation system is described to include an integrated circuit chip having a first capacitive plate, a second capacitive plate positioned with respect to the first capacitive plate to enable a capacitive coupling therebetween, an enhanced isolation layer positioned between the first capacitive the second capacitive plate that facilitates an electrical isolation between the first capacitive plate and the second capacitive plate, a first bonding wire that is in electrical communication with the second capacitive plate, and an isolation trench that at least partially circumscribes the first capacitive plate and is positioned between the first capacitive plate and the first bonding wire.

    Isolation device
    3.
    发明授权
    Isolation device 有权

    公开(公告)号：US09812389B2

    公开(公告)日：2017-11-07

    申请号：US15228727

    申请日：2016-08-04

    申请人： Avago Technologies General IP (Singapore) Pte. Ltd.

    发明人： Dominique Ho ,  Chris Tao ,  Boon Keat Tan

    IPC分类号： H01L29/00 ,  H01L23/522 ,  H01L23/528 ,  H01L27/02

    CPC分类号： H01L23/5223 ,  H01L23/48 ,  H01L23/5225 ,  H01L23/528 ,  H01L27/0288 ,  H01L2224/48463 ,  H01L2224/49107

    摘要： An isolation system, isolation device, and Integrated Circuit are disclosed. The isolation system is described to include an integrated circuit chip having a first capacitive plate, a second capacitive plate positioned with respect to the first capacitive plate to enable a capacitive coupling therebetween, an enhanced isolation layer positioned between the first capacitive the second capacitive plate that facilitates an electrical isolation between the first capacitive plate and the second capacitive plate, a first bonding wire that is in electrical communication with the second capacitive plate, and an isolation trench that at least partially circumscribes the first capacitive plate and is positioned between the first capacitive plate and the first bonding wire.

    ISOLATION DEVICE
    4.
    发明申请
    ISOLATION DEVICE 有权

    公开(公告)号：US20170098604A1

    公开(公告)日：2017-04-06

    申请号：US15228727

    申请日：2016-08-04

    申请人： Avago Technologies General IP (Singapore) Pte. Ltd

    发明人： Dominique Ho ,  Chris Tao ,  Boon Keat Tan

    IPC分类号： H01L23/522 ,  H01L27/02 ,  H01L23/528

    CPC分类号： H01L23/5223 ,  H01L23/48 ,  H01L23/5225 ,  H01L23/528 ,  H01L27/0288 ,  H01L2224/48463 ,  H01L2224/49107

    摘要： An isolation system, isolation device, and Integrated Circuit are disclosed. The isolation system is described to include an integrated circuit chip having a first capacitive plate, a second capacitive plate positioned with respect to the first capacitive plate to enable a capacitive coupling therebetween, an enhanced isolation layer positioned between the first capacitive the second capacitive plate that facilitates an electrical isolation between the first capacitive plate and the second capacitive plate, a first bonding wire that is in electrical communication with the second capacitive plate, and an isolation trench that at least partially circumscribes the first capacitive plate and is positioned between the first capacitive plate and the first bonding wire.

    Silicon designs for high voltage isolation
    6.
    发明授权
    Silicon designs for high voltage isolation 有权
    硅设计用于高压隔离

    公开(公告)号：US09520354B1

    公开(公告)日：2016-12-13

    申请号：US14813110

    申请日：2015-07-29

    申请人： Avago Technologies General IP (Singapore) Pte. Ltd

    发明人： Ricky Chow ,  Dominique Ho ,  Qian Tao

    IPC分类号： H01L23/38 ,  H01L23/522 ,  H01L49/02

    CPC分类号： H01L28/40 ,  H01L23/5223 ,  H02M3/33523

    摘要： An isolation system, isolation capacitor, and Integrated Circuit are disclosed. The isolation capacitor is described to include a first capacitive element, a second capacitive element, a primary isolation layer positioned between the first and second capacitive elements, as well as a secondary isolation layer positioned between the first and second capacitive elements. The secondary isolation layer has an area that is larger than an area of one or both of the first and second capacitive elements, thereby reducing the likelihood of breakdown between the first and second capacitive elements.

    摘要翻译： 公开了隔离系统，隔离电容器和集成电路。 隔离电容器被描述为包括第一电容元件，第二电容元件，位于第一和第二电容元件之间的主隔离层，以及位于第一和第二电容元件之间的次级隔离层。 二次隔离层具有比第一和第二电容元件中的一个或两个的面积大的区域，从而降低第一和第二电容元件之间的击穿可能性。