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    Method and device for generating digital still pictures of wafer-shaped elements during a production process
    6.
    发明授权
    Method and device for generating digital still pictures of wafer-shaped elements during a production process 有权
    用于在生产过程中产生晶片状元件的数字静止图像的方法和装置

    公开(公告)号：US08233697B2

    公开(公告)日：2012-07-31

    申请号：US12557050

    申请日：2009-09-10

    申请人： Michael Stelzl

    发明人： Michael Stelzl

    IPC分类号： G06K9/00

    CPC分类号： G01N21/9501 ,  G01N21/9505 ,  G01N2021/845 ,  G01N2021/8896

    摘要： A method and device generate digital still pictures of wafer-shaped elements, such as wafers or solar cells, which are transported in series on a conveyor belt during a production process. The device has a camera taking pictures of the wafer-shaped elements in sections step-by-step, in particular continuously taking digital pictures line-by-line (linear scanning) transverse to the transport direction, and then sampling the recorded image data. The device also includes a hardware-based image data processing unit, e.g. FPGA, for detecting edges of the wafer-shaped elements that indicate a beginning or an end of each of the wafer-shaped elements. The edge detection is for controlling the generation of the digital still pictures for visual inspection to find defective areas of the elements.

    摘要翻译： 一种方法和装置产生在制造过程中串联输送到传送带上的晶片状元件（例如晶片或太阳能电池）的数字静态照片。 该装置具有相机以分段方式截取晶片状元件的照片，特别是与输送方向垂直地逐行（线性扫描）连续拍摄数字图像，然后对记录的图像数据进行采样。 该设备还包括基于硬件的图像数据处理单元，例如， FPGA，用于检测指示每个晶片形元件的开始或结束的晶片形元件的边缘。 边缘检测用于控制用于目视检查的数字静态图像的生成，以发现元件的缺陷区域。

    Method and device for generating digital still pictures of wafer-shaped elements during a production process
    7.
    发明申请
    Method and device for generating digital still pictures of wafer-shaped elements during a production process 有权
    用于在生产过程中产生晶片状元件的数字静止图像的方法和装置

    公开(公告)号：US20100061621A1

    公开(公告)日：2010-03-11

    申请号：US12557050

    申请日：2009-09-10

    申请人： Michael Stelzl

    发明人： Michael Stelzl

    IPC分类号： G06K9/00

    CPC分类号： G01N21/9501 ,  G01N21/9505 ,  G01N2021/845 ,  G01N2021/8896

    摘要： A method and device generate digital still pictures of wafer-shaped elements, such as wafers or solar cells, which are transported in series on a conveyor belt during a production process. The device has a camera taking pictures of the wafer-shaped elements in sections step-by-step, in particular continuously taking digital pictures line-by-line (linear scanning) transverse to the transport direction, and then sampling the recorded image data. The device also includes a hardware-based image data processing unit, e.g. FPGA, for detecting edges of the wafer-shaped elements that indicate a beginning or an end of each of the wafer-shaped elements. The edge detection is for controlling the generation of the digital still pictures for visual inspection to find defective areas of the elements.

    摘要翻译： 一种方法和装置产生在制造过程中串联输送到传送带上的晶片状元件（例如晶片或太阳能电池）的数字静态照片。 该装置具有相机以分段方式截取晶片状元件的照片，特别是与输送方向垂直地逐行（线性扫描）连续拍摄数字图像，然后对记录的图像数据进行采样。 该设备还包括基于硬件的图像数据处理单元，例如， FPGA，用于检测指示每个晶片形元件的开始或结束的晶片形元件的边缘。 边缘检测用于控制用于目视检查的数字静态图像的生成，以发现元件的缺陷区域。

    Method for Measuring Topographic Structures on Devices
    8.
    发明申请
    Method for Measuring Topographic Structures on Devices 审中-公开
    测量设备上的地形结构的方法

    公开(公告)号：US20080144006A1

    公开(公告)日：2008-06-19

    申请号：US11569242

    申请日：2005-05-13

    申请人： Michael Stelzl ,  Volker Seidemann ,  Jürgen Leib ,  Ha-Duong Ngo

    发明人： Michael Stelzl ,  Volker Seidemann ,  Jürgen Leib ,  Ha-Duong Ngo

    IPC分类号： G01J3/00 ,  G01B11/28 ,  G01N21/55

    CPC分类号： G02B21/0076 ,  G01B11/0608

    摘要： In order to be able to measure topographies on wafers or devices in a fashion free from destruction, the invention provides a method for measuring three-dimensional topographic structures (22) on wafers (2) or devices in which with the aid of a confocal microscope (1) at least one fluorescing topographic structure (22) is scanned with excitation light, and the fluorescence light emitted from the focal point (17) in the focal plane (19) of the objective (15) and excited by the excitation light is detected, and measured data are obtained from the position of the focal point (17) and the detected fluorescence signal.

    摘要翻译： 为了能够以没有破坏的方式测量晶片或器件上的形貌，本发明提供了一种用于测量晶片（2）上的三维地形结构（22）的方法或其中借助于共聚焦显微镜 （1）用激发光扫描至少一个荧光地形结构（22），并且从物镜（15）的焦平面（19）发射并被激发光激发的焦点（17）发出的荧光是 从焦点（17）的位置和检测到的荧光信号获得检测和测量的数据。