Semiconductor device and method for manufacturing semiconductor device
    1.
    发明授权
    Semiconductor device and method for manufacturing semiconductor device 有权
    半导体装置及半导体装置的制造方法

    公开(公告)号:US08624314B2

    公开(公告)日:2014-01-07

    申请号:US13713341

    申请日:2012-12-13

    IPC分类号: H01L29/76 H01L21/8238

    CPC分类号: H01L29/78 H01L21/76232

    摘要: According to one embodiment, a semiconductor device comprises an active area extending in a first direction, a contact plug located on a first portion of the active area, and a transistor located on a second portion adjacent to the first portion of the active area in the first direction. A width of a top surface area of the first portion in a second direction perpendicular to the first direction is smaller than that of a top surface area of the second portion in the second direction.

    摘要翻译: 根据一个实施例,半导体器件包括沿着第一方向延伸的有源区域,位于有源区域的第一部分上的接触插塞和位于与有源区域中的有源区域的第一部分相邻的第二部分的晶体管 第一个方向 第一部分的垂直于第一方向的第二方向的顶表面积的宽度小于第二部分在第二方向上的顶表面积的宽度。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    2.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 有权
    半导体器件及制造半导体器件的方法

    公开(公告)号:US20130187208A1

    公开(公告)日:2013-07-25

    申请号:US13713341

    申请日:2012-12-13

    IPC分类号: H01L29/78

    CPC分类号: H01L29/78 H01L21/76232

    摘要: According to one embodiment, a semiconductor device comprises an active area extending in a first direction, a contact plug located on a first portion of the active area, and a transistor located on a second portion adjacent to the first portion of the active area in the first direction. A width of a top surface area of the first portion in a second direction perpendicular to the first direction is smaller than that of a top surface area of the second portion in the second direction.

    摘要翻译: 根据一个实施例,半导体器件包括沿着第一方向延伸的有源区域,位于有源区域的第一部分上的接触插塞和位于与有源区域中的有源区域的第一部分相邻的第二部分的晶体管 第一个方向 第一部分的垂直于第一方向的第二方向的顶表面积的宽度小于第二部分在第二方向上的顶表面积的宽度。

    Semiconductor device and method for manufacturing semiconductor device
    3.
    发明授权
    Semiconductor device and method for manufacturing semiconductor device 失效
    半导体装置及半导体装置的制造方法

    公开(公告)号:US08357966B2

    公开(公告)日:2013-01-22

    申请号:US12884764

    申请日:2010-09-17

    IPC分类号: H01L29/76 H01L21/8238

    CPC分类号: H01L29/78 H01L21/76232

    摘要: According to one embodiment, a semiconductor device comprises an active area extending in a first direction, a contact plug located on a first portion of the active area, and a transistor located on a second portion adjacent to the first portion of the active area in the first direction. A width of a top surface area of the first portion in a second direction perpendicular to the first direction is smaller than that of a top surface area of the second portion in the second direction.

    摘要翻译: 根据一个实施例,半导体器件包括沿着第一方向延伸的有源区域,位于有源区域的第一部分上的接触插塞和位于与有源区域中的有源区域的第一部分相邻的第二部分的晶体管 第一个方向 第一部分的垂直于第一方向的第二方向的顶表面积的宽度小于第二部分在第二方向上的顶表面积的宽度。

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    4.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE 失效
    半导体器件及制造半导体器件的方法

    公开(公告)号:US20110233622A1

    公开(公告)日:2011-09-29

    申请号:US12884764

    申请日:2010-09-17

    IPC分类号: H01L29/78 H01L21/76

    CPC分类号: H01L29/78 H01L21/76232

    摘要: According to one embodiment, a semiconductor device comprises an active area extending in a first direction, a contact plug located on a first portion of the active area, and a transistor located on a second portion adjacent to the first portion of the active area in the first direction. A width of a top surface area of the first portion in a second direction perpendicular to the first direction is smaller than that of a top surface area of the second portion in the second direction.

    摘要翻译: 根据一个实施例,半导体器件包括沿着第一方向延伸的有源区域,位于有源区域的第一部分上的接触插塞和位于与有源区域中的有源区域的第一部分相邻的第二部分的晶体管 第一个方向 第一部分的垂直于第一方向的第二方向的顶表面积的宽度小于第二部分在第二方向上的顶表面积的宽度。

    Semiconductor memory device
    5.
    发明授权
    Semiconductor memory device 有权
    半导体存储器件

    公开(公告)号:US08395922B2

    公开(公告)日:2013-03-12

    申请号:US13035134

    申请日:2011-02-25

    IPC分类号: G11C5/06

    摘要: According to one embodiment, a semiconductor memory device includes a memory cell array, a first sense amplifier circuit, and a second sense amplifier circuit. The memory cell array includes a plurality of first memory cell units, a plurality of second memory cell units, a plurality of first interconnects, and a plurality of second interconnects. The first sense amplifier circuit is connected to the plurality of first interconnects. The second sense amplifier circuit is connected to the plurality of second interconnects. Heights of upper surfaces of interconnects are equal. At least one of a width of each of the plurality of second interconnects along a second direction perpendicular to the first direction and a thickness of each of the plurality of second interconnects along a third direction perpendicular to the first direction and the second direction is set smaller than each of the plurality of first interconnects, and the first sense amplifier circuit and the second sense amplifier circuit are disposed to face each other across the memory cell array.

    摘要翻译: 根据一个实施例,半导体存储器件包括存储单元阵列,第一读出放大器电路和第二读出放大器电路。 存储单元阵列包括多个第一存储单元单元,多个第二存储单元单元,多个第一互连和多个第二互连。 第一读出放大器电路连接到多个第一互连。 第二读出放大器电路连接到多个第二互连。 互连上表面的高度相等。 沿着与第一方向垂直的第二方向的多个第二互连件的每一个的宽度中的至少一个以及沿着垂直于第一方向和第二方向的第三方向的多个第二互连件中的每一个的厚度被设置得较小 并且第一读出放大器电路和第二读出放大器电路被设置为跨越存储单元阵列彼此面对。

    Semiconductor memory device
    6.
    发明授权
    Semiconductor memory device 失效
    半导体存储器件

    公开(公告)号:US07636256B2

    公开(公告)日:2009-12-22

    申请号:US11869160

    申请日:2007-10-09

    IPC分类号: G11C16/00

    摘要: A semiconductor memory device includes a memory cell string provided on a semiconductor substrate, and a first select transistor including a gate insulation film, which is provided on the semiconductor substrate having a recess structure which is lower, only at a central portion thereof, than the semiconductor substrate on which the memory cell string is provided, and a gate electrode provided on the gate insulation film, the first select transistor selecting the memory cell string.

    摘要翻译: 半导体存储器件包括设置在半导体衬底上的存储单元串和包括栅极绝缘膜的第一选择晶体管,该第一选择晶体管包括栅绝缘膜,该第一选择晶体管包括位于半导体衬底上的半导体衬底, 设置有存储单元串的半导体衬底和设置在栅极绝缘膜上的栅电极,第一选择晶体管选择存储单元串。

    SEMICONDUCTOR MEMORY DEVICE
    7.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE 失效
    半导体存储器件

    公开(公告)号:US20090003070A1

    公开(公告)日:2009-01-01

    申请号:US11869160

    申请日:2007-10-09

    IPC分类号: G11C11/34 H01L29/788

    摘要: A semiconductor memory device includes a memory cell string provided on a semiconductor substrate, and a first select transistor including a gate insulation film, which is provided on the semiconductor substrate having a recess structure which is lower, only at a central portion thereof, than the semiconductor substrate on which the memory cell string is provided, and a gate electrode provided on the gate insulation film, the first select transistor selecting the memory cell string.

    摘要翻译: 半导体存储器件包括设置在半导体衬底上的存储单元串和包括栅极绝缘膜的第一选择晶体管,该第一选择晶体管包括栅极绝缘膜,该第一选择晶体管设置在半导体衬底上,该半导体衬底的中心部分具有较低的凹部结构, 设置有存储单元串的半导体衬底和设置在栅极绝缘膜上的栅电极,第一选择晶体管选择存储单元串。

    Data memory system
    8.
    发明授权
    Data memory system 有权
    数据存储系统

    公开(公告)号:US08327229B2

    公开(公告)日:2012-12-04

    申请号:US12818709

    申请日:2010-06-18

    申请人: Mitsuhiro Noguchi

    发明人: Mitsuhiro Noguchi

    IPC分类号: G11C29/00

    摘要: A data memory system is provided which includes a nonvolatile memory cell array, an error correction code generation circuit, an error correction code decoding circuit, and a first circuit. The nonvolatile memory cell array includes a plurality of memory cells which store digital data each having at least a value of “1” or “0” as a charge of a charge accumulation layer included in each memory cell, and use a difference between charges of the accumulation layer as a writing bit or an erasing bit. The nonvolatile memory cell array erases memory cells in units of pages, each page being formed of adjacent memory cells included in the plurality of memory cells.

    摘要翻译: 提供一种包括非易失性存储单元阵列,纠错码产生电路,纠错码解码电路和第一电路的数据存储系统。 非易失性存储单元阵列包括多个存储单元,其存储每个具有至少1或0值的数字数据作为每个存储单元中包含的电荷累积层的电荷,并且使用积累层的电荷之间的差作为 写位或擦除位。 非易失性存储单元阵列以页为单位擦除存储单元,每页由包含在多个存储单元中的相邻存储单元形成。

    Data memory system
    9.
    发明授权
    Data memory system 有权
    数据存储系统

    公开(公告)号:US08185802B2

    公开(公告)日:2012-05-22

    申请号:US12369889

    申请日:2009-02-12

    申请人: Mitsuhiro Noguchi

    发明人: Mitsuhiro Noguchi

    IPC分类号: G11C29/00

    摘要: A data memory system includes a nonvolatile memory cell array which includes a plurality of memory cells, a page adjacently formed by the plurality of memory cells being collectively erased in the nonvolatile memory cell, at least binary pieces of digital data of “1” and “0” being stored as charges of a charge accumulation layer in the memory cell, a programming bit and an erasing bit being formed by a difference between the charges of the charge accumulation layer. And the system includes an error correcting code generation circuit, an error correcting code decoding circuit, and a code conversion circuit.

    摘要翻译: 一种数据存储器系统包括:非易失性存储单元阵列,其包括多个存储单元,由所述多个存储器单元相邻形成的页面在所述非易失性存储单元中被共同擦除;至少二进制数字数据“1”和“ 0“作为电荷累积层的电荷存储在存储单元中,由电荷累积层的电荷之间的差异形成的编程位和擦除位。 该系统包括纠错码产生电路,纠错码解码电路和代码转换电路。

    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    10.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICE 审中-公开
    非易失性半导体存储器件

    公开(公告)号:US20120037973A1

    公开(公告)日:2012-02-16

    申请号:US13281083

    申请日:2011-10-25

    IPC分类号: H01L29/788 H01L29/792

    摘要: A memory cell includes a floating gate electrode, a first inter-electrode insulating film and a control gate electrode. A peripheral transistor includes a lower electrode, a second inter-electrode insulating film and an upper electrode. The lower electrode and the upper electrode are electrically connected via an opening provided on the second inter-electrode insulating film. The first and second inter-electrode insulating films include a high-permittivity material, the first inter-electrode insulating film has a first structure, and the second inter-electrode insulating film has a second structure different from the first structure.

    摘要翻译: 存储单元包括浮置栅电极,第一电极间绝缘膜和控制栅电极。 外围晶体管包括下电极,第二电极间绝缘膜和上电极。 下电极和上电极通过设置在第二电极间绝缘膜上的开口电连接。 第一和第二电极间绝缘膜包括高电容率材料,第一电极间绝缘膜具有第一结构,第二电极间绝缘膜具有与第一结构不同的第二结构。