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公开(公告)号：US10984994B2
公开(公告)日：2021-04-20
申请号：US15551493
申请日：2016-10-09
Inventor： Jun Zhang , Boyu Dong , Jinrong Zhao , Xuewei Wu , Bingliang Guo , Baogang Xu , Henan Zhang , Tong Wang , Shaohui Liu , Jun Wang
Abstract: The present disclosure provides a deposition apparatus, including a first chamber, a second chamber and a third chamber. The first chamber is configured to load a substrate. The second chamber is configured to provide a high temperature environment in which a degas process and a sputtering process are performed on the substrate. The third chamber is provided between the first chamber and the second chamber. The third chamber is configured to transfer the substrate from the first chamber to the second chamber via the third chamber.
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公开(公告)号：US11710624B2
公开(公告)日：2023-07-25
申请号：US17075484
申请日：2020-10-20
Inventor： Bingliang Guo , Huaichao Ma , Andong Sun , Henan Zhang , Boyu Dong , Lu Zhang , Yujing Chen
CPC classification number: H01J37/3464 , C23C14/3492 , C23C14/54 , C23C14/541 , C23C14/542 , H01J37/3447 , H01J37/3476 , H01J37/3485 , H01J37/3488 , H01L21/02266 , C23C14/0617
Abstract: A sputtering method includes one or more sputtering processes. Each sputtering process includes in a first pre-sputtering phase, sputtering a target material on a baffle plate configured to shield a substrate; in a second pre-sputtering phase, sputtering a target material compound on the baffle plate; and in a main sputtering phase, sputtering the target material compound on the substrate. The first pre-sputtering phase is used to adjust a sputtering voltage for the main sputtering phase.
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公开(公告)号：US11315768B2
公开(公告)日：2022-04-26
申请号：US16626863
申请日：2018-06-15
Inventor： Xuewei Wu , Tong Wang , Boyu Dong , Jun Zhang , Bingliang Guo , Jun Wang , Henan Zhang , Baogang Xu , Huaichao Ma , Shaohui Liu , Kangning Zhao , Yujie Geng , Qingxuan Wang , Yaxin Cui
Abstract: The present disclosure provides a loading apparatus and a physical vapor deposition (PVD) apparatus. The loading apparatus includes a pedestal configured to support a workpiece; and a first support member placed on the pedestal and configured to push up a cover ring when the pedestal is at an operation position to prevent an overlapping portion of a cover ring and the workpiece from contacting each other. In the loading apparatus and the PVD apparatus, the first support member supports the cover ring, such that the cover ring does not contact the workpiece, thereby reducing stress forces on the workpiece by external components.
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公开(公告)号：US10937672B2
公开(公告)日：2021-03-02
申请号：US15543472
申请日：2015-12-30
Inventor： Jun Zhang , Xuewei Wu , Boyu Dong , Baogang Xu , Henan Zhang , Bingliang Guo , Wen Zhang , Shaohui Liu
IPC: H01L21/67 , C23C14/54 , H05B1/02 , H05B3/00 , F27D19/00 , F27D5/00 , C23C14/35 , F27D3/00 , H01L21/687
Abstract: A heating device and a heating chamber are provided, comprising a base plate (21), at least three supporting columns (22) and a heating assembly, where the at least three supporting columns are arranged vertically on the base plate and are distributed at intervals along a circumferential direction of the base plate Top ends of the at least three supporting columns form a bearing surface for supporting a to-be-heated member (23). The heating assembly includes a heating light tube (24) and a thermal radiation shielding assembly, where the heating light tube is disposed above the base plate and below the bearing surface. A projection of an effective heating area formed by uniform distribution of the heating light tube on the base plate covers a projection of the bearing surface on the base plate. The thermal radiation shielding assembly shields heat radiated by the heating light tube towards surroundings and bottom.
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