Cooling method for a 3D IC computer system
    1.
    发明申请

    公开(公告)号:US20160286689A1

    公开(公告)日:2016-09-29

    申请号:US14672191

    申请日:2015-03-29

    申请人: Banqiu Wu Ming Xu

    发明人: Banqiu Wu Ming Xu

    IPC分类号: H05K7/20

    摘要: A computer system using 3D IC is cooled by using liquid coolants such as water, oil, and ionic liquid. Liquid coolant flows in a closed coolant conduit which is configured thermally to contact heat-generating components and a liquid-liquid heat exchanger. The heat generated in 3D IC chips is carried out by liquid coolant and dissipated to heat exchanger where cooling water dissipates heat to large water body. For economic stable operation, cooling water is pumped from large water body such as river to a water tower where water level is kept constant to ensure heat exchanger work at optimal condition. The simple approach for computer system cooling provided in this disclosure is a cost-effective data center efficiency solution.

    3D IC Computer System
    2.
    发明申请
    3D IC Computer System 审中-公开
    3D IC电脑系统

    公开(公告)号:US20160286695A1

    公开(公告)日:2016-09-29

    申请号:US14672198

    申请日:2015-03-29

    申请人: Banqiu Wu Ming Xu

    发明人: Banqiu Wu Ming Xu

    IPC分类号: H05K7/20

    CPC分类号: H05K7/20772 H05K7/2079

    摘要: A computer system includes central processing units designed by using reduced instruction set computing (RISC) strategy, dynamic random access memory (DRAM) packages manufactured by using three-dimensional integrated circuit (3D IC) stacked using through-silicon via (TSV) stacking processes, and liquid cooling approach. The system has advantages of low power consumption, fast DRAM access rate, high performance, high cooling efficiency, small form factor, and low costs. Cooling liquid could be water, oil, and ionic liquid. The heat generated in 3D IC chips is carried out by liquid coolant and dissipated to heat exchanger where cooling water dissipates heat to large water body such as river, reservoir, or ocean. The computer disclosed in this invention is suitable to be a server for application in datacenter.

    摘要翻译: 计算机系统包括通过使用精简指令集计算(RISC)策略设计的中央处理单元,使用通过使用硅通孔(TSV)堆叠处理堆叠的三维集成电路(3D IC)制造的动态随机存取存储器(DRAM)封装 ,和液体冷却方式。 该系统具有功耗低,DRAM访问速度快,性能高,冷却效率高,外形尺寸小,成本低等优点。 冷却液体可以是水,油和离子液体。 3D IC芯片产生的热量由液体冷却剂进行,并散发到热交换器,冷却水将热量散发到诸如河流,水库或海洋等大型水体。 本发明公开的计算机适合作为数据中心应用的服务器。

    Cost-effective cooling method for computer system
    3.
    发明申请
    Cost-effective cooling method for computer system 审中-公开
    高性价比的计算机系统冷却方法

    公开(公告)号:US20160286690A1

    公开(公告)日:2016-09-29

    申请号:US14672196

    申请日:2015-03-29

    申请人: Banqiu Wu Ming Xu

    发明人: Banqiu Wu Ming Xu

    IPC分类号: H05K7/20

    CPC分类号: H05K7/2079 H05K7/20772

    摘要: A computer system using regular IC or 3D IC is cooled by using liquid coolants such as water, oil, and ionic liquid. Liquid coolant flows in a closed coolant conduit which is configured to thermally contact heat-generating components in a computer system and a large water body such as river and reservoir. The heat created in computer system is carried out by liquid coolant and dissipated to large water body. The cooling system is simple and cost-effective.

    摘要翻译: 使用常规IC或3D IC的计算机系统通过使用液体冷却剂如水,油和离子液体来冷却。 液体冷却剂在封闭的冷却剂管道中流动,该冷却剂管道被配置为热接触计算机系统中的发热部件和诸如河流和水库的大型水体。 计算机系统产生的热量由液体冷却剂进行,并散发到大型水体。 冷却系统简单,性价比高。

    Cost-effective cooling method for computer system

    公开(公告)号:US09439331B1

    公开(公告)日:2016-09-06

    申请号:US14672196

    申请日:2015-03-29

    申请人: Banqiu Wu Ming Xu

    发明人: Banqiu Wu Ming Xu

    IPC分类号: H05K7/20 G06F1/20

    CPC分类号: H05K7/2079 H05K7/20772

    摘要: A computer system using regular IC or 3D IC is cooled by using liquid coolants such as water, oil, and ionic liquid. Liquid coolant flows in a closed coolant conduit which is configured to thermally contact heat-generating components in a computer system and a large water body such as river and reservoir. The heat created in computer system is carried out by liquid coolant and dissipated to large water body. The cooling system is simple and cost-effective.

    3D IC computer system
    5.
    发明授权
    3D IC computer system 有权
    3D IC电脑系统

    公开(公告)号:US09439330B1

    公开(公告)日:2016-09-06

    申请号:US14672198

    申请日:2015-03-29

    申请人: Banqiu Wu Ming Xu

    发明人: Banqiu Wu Ming Xu

    IPC分类号: H05K7/20 G06F1/20

    CPC分类号: H05K7/20772 H05K7/2079

    摘要: A computer system includes central processing units designed by using reduced instruction set computing (RISC) strategy, dynamic random access memory (DRAM) packages manufactured by using three-dimensional integrated circuit (3D IC) stacked using through-silicon via (TSV) stacking processes, and liquid cooling approach. The system has advantages of low power consumption, fast DRAM access rate, high performance, high cooling efficiency, small form factor, and low costs. Cooling liquid could be water, oil, and ionic liquid. The heat generated in 3D IC chips is carried out by liquid coolant and dissipated to heat exchanger where cooling water dissipates heat to large water body such as river, reservoir, or ocean. The computer disclosed in this invention is suitable to be a server for application in datacenter.

    摘要翻译: 计算机系统包括通过使用精简指令集计算(RISC)策略设计的中央处理单元,使用通过使用硅通孔(TSV)堆叠处理堆叠的三维集成电路(3D IC)制造的动态随机存取存储器(DRAM)封装 ,和液体冷却方式。 该系统具有功耗低,DRAM访问速度快,性能高,冷却效率高,外形尺寸小,成本低等优点。 冷却液体可以是水,油和离子液体。 3D IC芯片产生的热量由液体冷却剂进行,并散发到热交换器,冷却水将热量散发到诸如河流,水库或海洋等大型水体。 本发明公开的计算机适合作为数据中心应用的服务器。

    Cooling method for a 3D IC computer system
    6.
    发明授权
    Cooling method for a 3D IC computer system 有权
    3D IC计算机系统的冷却方法

    公开(公告)号:US09480187B2

    公开(公告)日:2016-10-25

    申请号:US14672191

    申请日:2015-03-29

    申请人: Banqiu Wu Ming Xu

    发明人: Banqiu Wu Ming Xu

    IPC分类号: H05K7/20 G06F1/20

    摘要: A computer system using 3D IC is cooled by using liquid coolants such as water, oil, and ionic liquid. Liquid coolant flows in a closed coolant conduit which is configured thermally to contact heat-generating components and a liquid-liquid heat exchanger. The heat generated in 3D IC chips is carried out by liquid coolant and dissipated to heat exchanger where cooling water dissipates heat to large water body. For economic stable operation, cooling water is pumped from large water body such as river to a water tower where water level is kept constant to ensure heat exchanger work at optimal condition. The simple approach for computer system cooling provided in this disclosure is a cost-effective data center efficiency solution.

    摘要翻译: 使用3D IC的计算机系统通过使用液体冷却剂如水,油和离子液体来冷却。 液体冷却剂在封闭的冷却剂管道中流动,其被热构造以接触发热部件和液体 - 液体热交换器。 3D IC芯片产生的热量由液体冷却剂进行,并散发到热交换器,在这种情况下,冷却水将热量散发到大型水体。 为了经济稳定运行,将冷水从河水等大型水体泵送到水位保持不变的水塔,确保热交换器在最佳状态下工作。 本公开中提供的简单的计算机系统冷却方法是具有成本效益的数据中心效率解决方案。

    Cooling Method for Computer System
    7.
    发明申请
    Cooling Method for Computer System 审中-公开
    计算机系统冷却方式

    公开(公告)号:US20160286688A1

    公开(公告)日:2016-09-29

    申请号:US14670405

    申请日:2015-03-26

    申请人: Banqiu Wu Ming Xu

    发明人: Banqiu Wu Ming Xu

    IPC分类号: H05K7/20 F24F5/00

    CPC分类号: H05K7/2079 H05K7/20772

    摘要: A computer system (taking server as an example) is cooled by using liquid coolants such as water, oil, and ionic liquid. Liquid coolant flows in a closed coolant conduit which is configured thermally to contact heat-generating components and a liquid-liquid heat exchanger. The heat generated in computer chips is carried out by liquid coolant and dissipated to heat exchanger where cooling water dissipates heat to large water body. For economic stable operation, cooling water is pumped from large water body such as river to a water tower where water level kept constant to ensure heat exchanger work at optimal condition. The simple and effective approach for computer system cooling provided in this disclosure is a cost-effective data center efficiency solution.

    摘要翻译: 计算机系统(以服务器为例)通过使用液体冷却剂如水,油和离子液体进行冷却。 液体冷却剂在封闭的冷却剂管道中流动,其被热构造以接触发热部件和液体 - 液体热交换器。 计算机芯片产生的热量由液体冷却剂进行,并散发到热交换器,冷却水将热量散发到大型水体。 为了经济稳定运行,冷水从河水等大型水体泵送到水位保持不变的水塔,确保热交换器在最佳状态下工作。 本公开中提供的简单有效的计算机系统冷却方法是具有成本效益的数据中心效率解决方案。

    IMAGE RECEIVER MEDIA AND IMAGING PROCESS

    公开(公告)号:US20210268820A1

    公开(公告)日:2021-09-02

    申请号:US17189686

    申请日:2021-03-02

    IPC分类号: B41M5/035

    摘要: An image is formed on a transfer medium comprising a hydrophilic tackifier. Any portion of the image that is dimensionally insufficient to permanently adhere the image to the receiver substrate is determined, and a colorless liquid ink comprising water is applied to cover and surround the portion of the image that is dimensionally insufficient to permanently adhere the image to the receiver substrate. When heat is applied to the image to transfer the image layer to a receiver substrate, water in the image layer swells the image layer and the hydrophilic tackifier becomes sufficiently tacky to permanently adhere the image to the receiver substrate.