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公开(公告)号：US20160286689A1
公开(公告)日：2016-09-29
申请号：US14672191
申请日：2015-03-29
IPC分类号： H05K7/20
CPC分类号： H05K7/2079 , G06F1/20 , G06F1/206 , H05K7/20 , H05K7/20218 , H05K7/20709 , H05K7/20763 , H05K7/20772
摘要： A computer system using 3D IC is cooled by using liquid coolants such as water, oil, and ionic liquid. Liquid coolant flows in a closed coolant conduit which is configured thermally to contact heat-generating components and a liquid-liquid heat exchanger. The heat generated in 3D IC chips is carried out by liquid coolant and dissipated to heat exchanger where cooling water dissipates heat to large water body. For economic stable operation, cooling water is pumped from large water body such as river to a water tower where water level is kept constant to ensure heat exchanger work at optimal condition. The simple approach for computer system cooling provided in this disclosure is a cost-effective data center efficiency solution.
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公开(公告)号：US20160286695A1
公开(公告)日：2016-09-29
申请号：US14672198
申请日：2015-03-29
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , H05K7/2079
摘要： A computer system includes central processing units designed by using reduced instruction set computing (RISC) strategy, dynamic random access memory (DRAM) packages manufactured by using three-dimensional integrated circuit (3D IC) stacked using through-silicon via (TSV) stacking processes, and liquid cooling approach. The system has advantages of low power consumption, fast DRAM access rate, high performance, high cooling efficiency, small form factor, and low costs. Cooling liquid could be water, oil, and ionic liquid. The heat generated in 3D IC chips is carried out by liquid coolant and dissipated to heat exchanger where cooling water dissipates heat to large water body such as river, reservoir, or ocean. The computer disclosed in this invention is suitable to be a server for application in datacenter.
摘要翻译： 计算机系统包括通过使用精简指令集计算（RISC）策略设计的中央处理单元，使用通过使用硅通孔（TSV）堆叠处理堆叠的三维集成电路（3D IC）制造的动态随机存取存储器（DRAM）封装 ，和液体冷却方式。 该系统具有功耗低，DRAM访问速度快，性能高，冷却效率高，外形尺寸小，成本低等优点。 冷却液体可以是水，油和离子液体。 3D IC芯片产生的热量由液体冷却剂进行，并散发到热交换器，冷却水将热量散发到诸如河流，水库或海洋等大型水体。 本发明公开的计算机适合作为数据中心应用的服务器。
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公开(公告)号：US09480187B2
公开(公告)日：2016-10-25
申请号：US14672191
申请日：2015-03-29
CPC分类号： H05K7/2079 , G06F1/20 , G06F1/206 , H05K7/20 , H05K7/20218 , H05K7/20709 , H05K7/20763 , H05K7/20772
摘要： A computer system using 3D IC is cooled by using liquid coolants such as water, oil, and ionic liquid. Liquid coolant flows in a closed coolant conduit which is configured thermally to contact heat-generating components and a liquid-liquid heat exchanger. The heat generated in 3D IC chips is carried out by liquid coolant and dissipated to heat exchanger where cooling water dissipates heat to large water body. For economic stable operation, cooling water is pumped from large water body such as river to a water tower where water level is kept constant to ensure heat exchanger work at optimal condition. The simple approach for computer system cooling provided in this disclosure is a cost-effective data center efficiency solution.
摘要翻译： 使用3D IC的计算机系统通过使用液体冷却剂如水，油和离子液体来冷却。 液体冷却剂在封闭的冷却剂管道中流动，其被热构造以接触发热部件和液体 - 液体热交换器。 3D IC芯片产生的热量由液体冷却剂进行，并散发到热交换器，在这种情况下，冷却水将热量散发到大型水体。 为了经济稳定运行，将冷水从河水等大型水体泵送到水位保持不变的水塔，确保热交换器在最佳状态下工作。 本公开中提供的简单的计算机系统冷却方法是具有成本效益的数据中心效率解决方案。
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公开(公告)号：US20160286688A1
公开(公告)日：2016-09-29
申请号：US14670405
申请日：2015-03-26
CPC分类号： H05K7/2079 , H05K7/20772
摘要： A computer system (taking server as an example) is cooled by using liquid coolants such as water, oil, and ionic liquid. Liquid coolant flows in a closed coolant conduit which is configured thermally to contact heat-generating components and a liquid-liquid heat exchanger. The heat generated in computer chips is carried out by liquid coolant and dissipated to heat exchanger where cooling water dissipates heat to large water body. For economic stable operation, cooling water is pumped from large water body such as river to a water tower where water level kept constant to ensure heat exchanger work at optimal condition. The simple and effective approach for computer system cooling provided in this disclosure is a cost-effective data center efficiency solution.
摘要翻译： 计算机系统（以服务器为例）通过使用液体冷却剂如水，油和离子液体进行冷却。 液体冷却剂在封闭的冷却剂管道中流动，其被热构造以接触发热部件和液体 - 液体热交换器。 计算机芯片产生的热量由液体冷却剂进行，并散发到热交换器，冷却水将热量散发到大型水体。 为了经济稳定运行，冷水从河水等大型水体泵送到水位保持不变的水塔，确保热交换器在最佳状态下工作。 本公开中提供的简单有效的计算机系统冷却方法是具有成本效益的数据中心效率解决方案。
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公开(公告)号：US20160286690A1
公开(公告)日：2016-09-29
申请号：US14672196
申请日：2015-03-29
IPC分类号： H05K7/20
CPC分类号： H05K7/2079 , H05K7/20772
摘要： A computer system using regular IC or 3D IC is cooled by using liquid coolants such as water, oil, and ionic liquid. Liquid coolant flows in a closed coolant conduit which is configured to thermally contact heat-generating components in a computer system and a large water body such as river and reservoir. The heat created in computer system is carried out by liquid coolant and dissipated to large water body. The cooling system is simple and cost-effective.
摘要翻译： 使用常规IC或3D IC的计算机系统通过使用液体冷却剂如水，油和离子液体来冷却。 液体冷却剂在封闭的冷却剂管道中流动，该冷却剂管道被配置为热接触计算机系统中的发热部件和诸如河流和水库的大型水体。 计算机系统产生的热量由液体冷却剂进行，并散发到大型水体。 冷却系统简单，性价比高。
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公开(公告)号：US09439331B1
公开(公告)日：2016-09-06
申请号：US14672196
申请日：2015-03-29
CPC分类号： H05K7/2079 , H05K7/20772
摘要： A computer system using regular IC or 3D IC is cooled by using liquid coolants such as water, oil, and ionic liquid. Liquid coolant flows in a closed coolant conduit which is configured to thermally contact heat-generating components in a computer system and a large water body such as river and reservoir. The heat created in computer system is carried out by liquid coolant and dissipated to large water body. The cooling system is simple and cost-effective.
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公开(公告)号：US09439330B1
公开(公告)日：2016-09-06
申请号：US14672198
申请日：2015-03-29
CPC分类号： H05K7/20772 , H05K7/2079
摘要： A computer system includes central processing units designed by using reduced instruction set computing (RISC) strategy, dynamic random access memory (DRAM) packages manufactured by using three-dimensional integrated circuit (3D IC) stacked using through-silicon via (TSV) stacking processes, and liquid cooling approach. The system has advantages of low power consumption, fast DRAM access rate, high performance, high cooling efficiency, small form factor, and low costs. Cooling liquid could be water, oil, and ionic liquid. The heat generated in 3D IC chips is carried out by liquid coolant and dissipated to heat exchanger where cooling water dissipates heat to large water body such as river, reservoir, or ocean. The computer disclosed in this invention is suitable to be a server for application in datacenter.
摘要翻译： 计算机系统包括通过使用精简指令集计算（RISC）策略设计的中央处理单元，使用通过使用硅通孔（TSV）堆叠处理堆叠的三维集成电路（3D IC）制造的动态随机存取存储器（DRAM）封装 ，和液体冷却方式。 该系统具有功耗低，DRAM访问速度快，性能高，冷却效率高，外形尺寸小，成本低等优点。 冷却液体可以是水，油和离子液体。 3D IC芯片产生的热量由液体冷却剂进行，并散发到热交换器，冷却水将热量散发到诸如河流，水库或海洋等大型水体。 本发明公开的计算机适合作为数据中心应用的服务器。
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8.发明申请IN-SITU DEPOSITED MASK LAYER FOR DEVICE SINGULATION BY LASER SCRIBING AND PLASMA ETCH 审中-公开用于激光扫描和等离子体蚀刻的器件结合的现场沉积掩模层公开(公告)号：US20140065797A1
公开(公告)日：2014-03-06
申请号：US14072653
申请日：2013-11-05
申请人： Madhava Rao Yalamanchili , Wei-Sheng Lei , Brad Eaton , Saravjeet Singh , Ajay Kumar , Banqiu Wu
发明人： Madhava Rao Yalamanchili , Wei-Sheng Lei , Brad Eaton , Saravjeet Singh , Ajay Kumar , Banqiu Wu
IPC分类号： H01L21/78
CPC分类号： H01L21/78 , B23K26/0624 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/172 , B23K2103/50 , H01L21/30655 , H01L21/3086 , H01L21/67207
摘要： Methods of dicing substrates by both laser scribing and plasma etching. A method includes forming an in-situ mask with a plasma etch chamber by accumulating a thickness of plasma deposited polymer to protect IC bump surfaces from a subsequent plasma etch. Second mask materials, such as a water soluble mask material may be utilized along with the plasma deposited polymer. At least some portion of the mask is patterned with a femtosecond laser scribing process to provide a patterned mask with trenches. The patterning exposing regions of the substrate between the ICs in which the substrate is plasma etched to singulate the IC and the water soluble material layer washed off.
摘要翻译： 通过激光划线和等离子体蚀刻来切割基板的方法。 一种方法包括通过累积等离子体沉积聚合物的厚度来形成具有等离子体蚀刻室的原位掩模，以保护IC凸起表面免于随后的等离子体蚀刻。 可以与等离子体沉积的聚合物一起使用第二掩模材料，例如水溶性掩模材料。 用飞秒激光划线工艺对掩模的至少一部分进行图案化以提供具有沟槽的图案化掩模。 在IC之间的衬底的图案化曝光区域中，其中衬底被等离子体蚀刻以分离IC和水溶性材料层被洗掉。
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9.发明申请METHODS FOR CONTROLLING DEFECTS FOR EXTREME ULTRAVIOLET LITHOGRAPHY (EUVL) PHOTOMASK SUBSTRATE 有权控制超极紫外光刻（EUVL）光电子基板缺陷的方法公开(公告)号：US20140045103A1
公开(公告)日：2014-02-13
申请号：US13774010
申请日：2013-02-22
申请人： Banqiu Wu , Ajay Kumar , Omkaram Nalamasu
发明人： Banqiu Wu , Ajay Kumar , Omkaram Nalamasu
IPC分类号： G03F1/00
摘要： Methods for providing a silicon layer on a photomask substrate surface with minimum defeats for fabricating film stack thereon for EUVL applications are provided. In one embodiment, a method for forming a silicon layer on a photomask substrate includes performing an oxidation process to form a silicon oxide layer on a surface of a first substrate wherein the first substrate comprises a crystalline silicon material, performing an ion implantation process to define a cleavage plane in the first substrate, and bonding the silicon oxide layer to a surface of a second substrate, wherein the second substrate is a quartz photomask.
摘要翻译： 提供了用于在光掩模衬底表面上提供硅层的方法，其中用于在EUVL应用中制造膜堆叠的最小失败。 在一个实施例中，在光掩模衬底上形成硅层的方法包括在第一衬底的表面上执行氧化处理以形成氧化硅层，其中第一衬底包括结晶硅材料，执行离子注入工艺以界定 在第一衬底中的解理面，并将氧化硅层接合到第二衬底的表面，其中第二衬底是石英光掩模。
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公开(公告)号：US20130192524A1
公开(公告)日：2013-08-01
申请号：US13755891
申请日：2013-01-31
申请人： Banqiu Wu , Nag B. Patibandla , Toshiaki Fujita , Ralf Hofmann , Pravin K. Narwankar , Jeonghoon Oh , Srinivas Satya , Li-Qun Xia
发明人： Banqiu Wu , Nag B. Patibandla , Toshiaki Fujita , Ralf Hofmann , Pravin K. Narwankar , Jeonghoon Oh , Srinivas Satya , Li-Qun Xia
IPC分类号： H01L21/673
CPC分类号： H01L21/673 , C23C16/45546 , C23C16/4558 , C23C16/4584 , C23C16/54 , H01L21/67346 , H01L21/677
摘要： A processing chamber having a plurality of movable substrate carriers stacked therein for continuously processing a plurality of substrates is provided. The movable substrate carrier is capable of being transported from outside of the processing chamber, e.g., being transferred from a load luck chamber, into the processing chamber and out of the processing chamber, e.g., being transferred into another load luck chamber. Process gases delivered into the processing chamber are spatially separated into a plurality of processing slots, and/or temporally controlled. The processing chamber can be part of a multi-chamber substrate processing system.
摘要翻译： 提供一种处理室，其具有堆叠在其中的多个可移动基板载体，用于连续处理多个基板。 可移动衬底载体能够从处理室的外部传送，例如从负载运送室转移到处理室中并且从处理室中输送，例如被转移到另一负载运送室中。 输送到处理室中的工艺气体在空间上分离成多个处理槽，和/或在时间上被控制。 处理室可以是多室衬底处理系统的一部分。
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