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    CARBON NANOTUBE CONTACT STRUCTURES
    1.
    发明申请
    CARBON NANOTUBE CONTACT STRUCTURES 失效
    碳纳米管接触结构

    公开(公告)号：US20100112828A1

    公开(公告)日：2010-05-06

    申请号：US11466039

    申请日：2006-08-21

    申请人： Benjamin N. Eldridge ,  John K. Gritters ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

    发明人： Benjamin N. Eldridge ,  John K. Gritters ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

    IPC分类号： H01R12/00 ,  H01R13/02 ,  H01R43/16

    CPC分类号： G01R1/06755 ,  H01R13/03 ,  Y10T29/49204

    摘要： A carbon nanotube contact structure can be used for making pressure connections to a DUT. The contact structure can be formed using a carbon nanotube film or with carbon nanotubes in solution. The carbon nanotube film can be grown in a trench in a sacrificial substrate in which a contact structure such as a beam or contact element is then formed by metal plating. The film can also be formed on a contact element and have metal posts dispersed therein to provide rigidity and elasticity. Contact structures or portions thereof can also be plated with a solution containing carbon nanotubes. The resulting contact structure can be tough, and can provide good electrical conductivity.

    摘要翻译： 可以使用碳纳米管接触结构来与DUT进行压力连接。 可以使用碳纳米管膜或溶液中的碳纳米管来形成接触结构。 碳纳米管膜可以在牺牲基板中的沟槽中生长，其中通过金属电镀形成诸如光束或接触元件的接触结构。 膜也可以形成在接触元件上，并且金属柱分散在其中以提供刚性和弹性。 接触结构或其部分也可以镀有含有碳纳米管的溶液。 所得到的接触结构可以是韧性的，并且可以提供良好的导电性。

    Carbon nanotube contact structures
    2.
    发明授权
    Carbon nanotube contact structures 失效
    碳纳米管接触结构

    公开(公告)号：US07731503B2

    公开(公告)日：2010-06-08

    申请号：US11466039

    申请日：2006-08-21

    申请人： Benjamin N. Eldridge ,  John K. Gritters ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

    发明人： Benjamin N. Eldridge ,  John K. Gritters ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

    IPC分类号： H01R12/00

    CPC分类号： G01R1/06755 ,  H01R13/03 ,  Y10T29/49204

    摘要： A carbon nanotube contact structure can be used for making pressure connections to a DUT. The contact structure can be formed using a carbon nanotube film or with carbon nanotubes in solution. The carbon nanotube film can be grown in a trench in a sacrificial substrate in which a contact structure such as a beam or contact element is then formed by metal plating. The film can also be formed on a contact element and have metal posts dispersed therein to provide rigidity and elasticity. Contact structures or portions thereof can also be plated with a solution containing carbon nanotubes. The resulting contact structure can be tough, and can provide good electrical conductivity.

    摘要翻译： 可以使用碳纳米管接触结构来与DUT进行压力连接。 可以使用碳纳米管膜或溶液中的碳纳米管来形成接触结构。 碳纳米管膜可以在牺牲基板中的沟槽中生长，其中通过金属电镀形成诸如光束或接触元件的接触结构。 膜也可以形成在接触元件上，并且金属柱分散在其中以提供刚性和弹性。 接触结构或其部分也可以镀有含有碳纳米管的溶液。 所得到的接触结构可以是韧性的，并且可以提供良好的导电性。

    Composite motion probing
    5.
    发明授权
    Composite motion probing 失效
    复合运动探测

    公开(公告)号：US07202682B2

    公开(公告)日：2007-04-10

    申请号：US10328113

    申请日：2002-12-20

    申请人： Timothy E. Cooper ,  Benjamin N. Eldridge ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

    发明人： Timothy E. Cooper ,  Benjamin N. Eldridge ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2887 ,  G01R1/06705 ,  G01R31/2886

    摘要： An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.

    摘要翻译： 电子设备相对于用于与设备电接触的探针移动到第一位置。 然后将电子设备移动到第二位置，其中电子设备被压靠在探针上，压缩探针。 进入第二位置的运动包括两个部件。 移动的一个组件倾向于将电子装置压靠在探针上，压缩探针并在探针中引起应力。 第二动作往往会减轻压力。 然后通过探头将测试数据传送到电子设备和从电子设备传送。

    Composite motion probing
    8.
    发明授权
    Composite motion probing 失效
    复合运动探测

    公开(公告)号：US07868632B2

    公开(公告)日：2011-01-11

    申请号：US11697603

    申请日：2007-04-06

    申请人： Timothy E. Cooper ,  Benjamin N. Eldridge ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

    发明人： Timothy E. Cooper ,  Benjamin N. Eldridge ,  Igor Y. Khandros ,  Rod Martens ,  Gaetan L. Mathieu

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2887 ,  G01R1/06705 ,  G01R31/2886

    摘要： An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.

    摘要翻译： 电子设备相对于用于与设备电接触的探针移动到第一位置。 然后将电子设备移动到第二位置，其中电子设备被压靠在探针上，压缩探针。 进入第二位置的运动包括两个部件。 移动的一个组件倾向于将电子装置压靠在探针上，压缩探针并在探针中引起应力。 第二动作往往会减轻压力。 然后通过探头将测试数据传送到电子设备和从电子设备传送。

    Method and system for compensating thermally induced motion of probe cards
    10.
    发明授权
    Method and system for compensating thermally induced motion of probe cards 有权
    用于补偿探针卡热诱导运动的方法和系统

    公开(公告)号：US07560941B2

    公开(公告)日：2009-07-14

    申请号：US11548183

    申请日：2006-10-10

    申请人： Rod Martens ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Ken S. Matsubayashi ,  Richard A. Larder ,  Makarand S. Shinde ,  Gaetan L. Mathieu

    发明人： Rod Martens ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Ken S. Matsubayashi ,  Richard A. Larder ,  Makarand S. Shinde ,  Gaetan L. Mathieu

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R31/2886

    摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

    摘要翻译： 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。