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公开(公告)号：US07463043B2
公开(公告)日：2008-12-09
申请号：US11748988
申请日：2007-05-15
IPC分类号： G01R31/02
CPC分类号： G01R31/2886 , G01R31/2887
摘要： An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.
摘要翻译： 电子设备移动到第一位置，使得电子设备的端子是与端子电接触的相邻探头。 然后电子设备水平或对角地移动，使得端子接触探针。 然后通过探头将测试数据传送到电子设备和从电子设备传送。
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公开(公告)号：US07868632B2
公开(公告)日：2011-01-11
申请号：US11697603
申请日：2007-04-06
IPC分类号： G01R31/02
CPC分类号： G01R31/2887 , G01R1/06705 , G01R31/2886
摘要： An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.
摘要翻译： 电子设备相对于用于与设备电接触的探针移动到第一位置。 然后将电子设备移动到第二位置，其中电子设备被压靠在探针上，压缩探针。 进入第二位置的运动包括两个部件。 移动的一个组件倾向于将电子装置压靠在探针上，压缩探针并在探针中引起应力。 第二动作往往会减轻压力。 然后通过探头将测试数据传送到电子设备和从电子设备传送。
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公开(公告)号：US20090085592A1
公开(公告)日：2009-04-02
申请号：US12331163
申请日：2008-12-09
IPC分类号： G01R31/3181
CPC分类号： G01R31/2886 , G01R31/2887
摘要： An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.
摘要翻译： 电子设备移动到第一位置，使得电子设备的端子是与端子电接触的相邻探头。 然后电子设备水平或对角地移动，使得端子接触探针。 然后通过探头将测试数据传送到电子设备和从电子设备传送。
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公开(公告)号：US07202682B2
公开(公告)日：2007-04-10
申请号：US10328113
申请日：2002-12-20
IPC分类号： G01R31/02
CPC分类号： G01R31/2887 , G01R1/06705 , G01R31/2886
摘要： An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.
摘要翻译： 电子设备相对于用于与设备电接触的探针移动到第一位置。 然后将电子设备移动到第二位置，其中电子设备被压靠在探针上，压缩探针。 进入第二位置的运动包括两个部件。 移动的一个组件倾向于将电子装置压靠在探针上，压缩探针并在探针中引起应力。 第二动作往往会减轻压力。 然后通过探头将测试数据传送到电子设备和从电子设备传送。
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5.发明授权Electronic device testing using a probe tip having multiple contact features 失效使用具有多个接触特征的探头的电子设备测试公开(公告)号：US07701243B2
公开(公告)日：2010-04-20
申请号：US12331163
申请日：2008-12-09
IPC分类号： G01R31/02
CPC分类号： G01R31/2886 , G01R31/2887
摘要： An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.
摘要翻译： 电子设备移动到第一位置，使得电子设备的端子是与端子电接触的相邻探头。 然后电子设备水平或对角地移动，使得端子接触探针。 然后通过探头将测试数据传送到电子设备和从电子设备传送。
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6.发明授权Method and apparatus for probing an electronic device in which movement of probes and/or the electronic device includes a lateral component 失效用于探测电子设备的方法和装置，其中探针和/或电子设备的移动包括侧向分量公开(公告)号：US07218127B2
公开(公告)日：2007-05-15
申请号：US10781369
申请日：2004-02-18
IPC分类号： G01R31/02
CPC分类号： G01R31/2886 , G01R31/2887
摘要： An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the probes. Test data are then communicated to and from the electronic device through the probes.
摘要翻译： 电子设备移动到第一位置，使得电子设备的端子是与端子电接触的相邻探头。 然后电子设备水平或对角地移动，使得端子接触探针。 然后通过探头将测试数据传送到电子设备和从电子设备传送。
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公开(公告)号：US07731503B2
公开(公告)日：2010-06-08
申请号：US11466039
申请日：2006-08-21
IPC分类号： H01R12/00
CPC分类号： G01R1/06755 , H01R13/03 , Y10T29/49204
摘要： A carbon nanotube contact structure can be used for making pressure connections to a DUT. The contact structure can be formed using a carbon nanotube film or with carbon nanotubes in solution. The carbon nanotube film can be grown in a trench in a sacrificial substrate in which a contact structure such as a beam or contact element is then formed by metal plating. The film can also be formed on a contact element and have metal posts dispersed therein to provide rigidity and elasticity. Contact structures or portions thereof can also be plated with a solution containing carbon nanotubes. The resulting contact structure can be tough, and can provide good electrical conductivity.
摘要翻译： 可以使用碳纳米管接触结构来与DUT进行压力连接。 可以使用碳纳米管膜或溶液中的碳纳米管来形成接触结构。 碳纳米管膜可以在牺牲基板中的沟槽中生长，其中通过金属电镀形成诸如光束或接触元件的接触结构。 膜也可以形成在接触元件上，并且金属柱分散在其中以提供刚性和弹性。 接触结构或其部分也可以镀有含有碳纳米管的溶液。 所得到的接触结构可以是韧性的，并且可以提供良好的导电性。
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公开(公告)号：US20100112828A1
公开(公告)日：2010-05-06
申请号：US11466039
申请日：2006-08-21
CPC分类号： G01R1/06755 , H01R13/03 , Y10T29/49204
摘要： A carbon nanotube contact structure can be used for making pressure connections to a DUT. The contact structure can be formed using a carbon nanotube film or with carbon nanotubes in solution. The carbon nanotube film can be grown in a trench in a sacrificial substrate in which a contact structure such as a beam or contact element is then formed by metal plating. The film can also be formed on a contact element and have metal posts dispersed therein to provide rigidity and elasticity. Contact structures or portions thereof can also be plated with a solution containing carbon nanotubes. The resulting contact structure can be tough, and can provide good electrical conductivity.
摘要翻译： 可以使用碳纳米管接触结构来与DUT进行压力连接。 可以使用碳纳米管膜或溶液中的碳纳米管来形成接触结构。 碳纳米管膜可以在牺牲基板中的沟槽中生长，其中通过金属电镀形成诸如光束或接触元件的接触结构。 膜也可以形成在接触元件上，并且金属柱分散在其中以提供刚性和弹性。 接触结构或其部分也可以镀有含有碳纳米管的溶液。 所得到的接触结构可以是韧性的，并且可以提供良好的导电性。
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公开(公告)号：US07948252B2
公开(公告)日：2011-05-24
申请号：US12173695
申请日：2008-07-15
申请人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
发明人： Gary W. Grube , Igor Y. Khandros , Benjamin N. Eldridge , Gaetan L. Mathieu , Poya Lotfizadeh , Chih-Chiang Tseng
IPC分类号： G01R31/02
CPC分类号： G01R1/07314 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2886 , G01R31/2889 , Y10T29/49002 , Y10T29/49004 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49149 , Y10T29/49453
摘要： A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.
摘要翻译： 一种设计和制造探针卡组件的方法包括将探针卡组件的一个或多个元件预制成一个或多个预定的设计。 此后，接收关于新设计的半导体器件的设计数据以及描述用于测试半导体器件的测试器和测试算法的数据。 使用接收到的数据，选择一个或多个预制元素。 再次使用接收的数据，定制一个或多个所选择的预制元素。 然后使用选定和定制的元件构建探针卡组件。
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10.发明授权Contact carriers (tiles) for populating larger substrates with spring contacts 失效接触托架（瓷砖），用于通过弹簧触点填充较大的基板公开(公告)号：US07714598B2
公开(公告)日：2010-05-11
申请号：US12054289
申请日：2008-03-24
申请人： Benjamin N. Eldridge , Thomas H. Dozier, II , Igor Y. Khandros , Gaetan L. Mathieu , William D. Smith
发明人： Benjamin N. Eldridge , Thomas H. Dozier, II , Igor Y. Khandros , Gaetan L. Mathieu , William D. Smith
CPC分类号： H05K3/4015 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/06711 , G01R1/06716 , G01R1/07342 , G01R1/07378 , G01R3/00 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49004 , Y10T29/49126 , Y10T29/49208 , Y10T29/49222 , H01L2924/00 , H01L2224/48
摘要： An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.
摘要翻译： 一种互连装置和形成互连装置的方法。 接触结构附着在第一基底上或形成在第一基底上。 第一衬底附接到比第一衬底大的第二衬底。 可以将多个这样的第一基板附接到第二基板，以便产生接触结构的阵列。 每个接触结构可以是细长的和弹性的，并且可以包括在涂覆有向接触结构赋予期望的结构特性的材料的芯上。
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