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    Method and system for compensating thermally induced motion of probe cards
    2.
    发明授权
    Method and system for compensating thermally induced motion of probe cards 有权
    用于补偿探针卡热诱导运动的方法和系统

    公开(公告)号：US06972578B2

    公开(公告)日：2005-12-06

    申请号：US10159560

    申请日：2002-05-31

    申请人： Rod Martens ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Ken S. Matsubayashi ,  Richard A. Larder ,  Makarand Shinde ,  Gaetan L. Mathieu

    发明人： Rod Martens ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Ken S. Matsubayashi ,  Richard A. Larder ,  Makarand Shinde ,  Gaetan L. Mathieu

    IPC分类号： G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/66 ,  G01R31/00

    CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R31/2886

    摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

    摘要翻译： 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

    Method and system for compensating for thermally induced motion of probe cards
    3.
    发明授权
    Method and system for compensating for thermally induced motion of probe cards 有权
    用于补偿探针卡的热诱导运动的方法和系统

    公开(公告)号：US07071714B2

    公开(公告)日：2006-07-04

    申请号：US10003012

    申请日：2001-11-02

    申请人： Benjamin N. Eldridge ,  Gary W. Grube ,  Ken S. Matsubayashi ,  Richard A. Larder ,  Makarand Shinde ,  Gaetan L. Mathieu

    发明人： Benjamin N. Eldridge ,  Gary W. Grube ,  Ken S. Matsubayashi ,  Richard A. Larder ,  Makarand Shinde ,  Gaetan L. Mathieu

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2886

    摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

    摘要翻译： 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

    METHOD AND SYSTEM FOR COMPENSATING THERMALLY INDUCED MOTION OF PROBE CARDS
    4.
    发明申请
    METHOD AND SYSTEM FOR COMPENSATING THERMALLY INDUCED MOTION OF PROBE CARDS 有权
    用于补偿探针卡的热诱导运动的方法和系统

    公开(公告)号：US20070139060A1

    公开(公告)日：2007-06-21

    申请号：US11548183

    申请日：2006-10-10

    申请人： Rod Martens ,  Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

    发明人： Rod Martens ,  Benjamin Eldridge ,  Gary Grube ,  Ken Matsubayashi ,  Richard Larder ,  Makarand Shinde ,  Gaetan Mathieu

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R31/2886

    摘要： The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

    摘要翻译： 本发明公开了一种补偿晶片上测试晶片使用的探针卡的热诱导运动的方法和系统。 公开了一种结合温度控制装置的探针卡，以在探针卡的整个厚度上保持均匀的温度。 公开了一种包括双材料加强元件的探针卡，其包括滚动元件，狭槽和润滑，以响应于温度变化，以抵消探针卡的热诱导运动。 还公开了用于允许探针卡的径向膨胀以防止探针卡的热诱导运动的各种装置。 还公开了一种用于检测探针卡的热诱导运动并移动晶片进行补偿的方法。

    Optimizing Utility Usage by Smart Monitoring
    6.
    发明申请
    Optimizing Utility Usage by Smart Monitoring 审中-公开
    通过智能监控优化实用程序使用

    公开(公告)号：US20110082599A1

    公开(公告)日：2011-04-07

    申请号：US12899488

    申请日：2010-10-06

    申请人： Makarand Shinde ,  William Brisko ,  Nitu Shinde

    发明人： Makarand Shinde ,  William Brisko ,  Nitu Shinde

    IPC分类号： G06F1/28 ,  G01R21/00 ,  G06F19/00

    CPC分类号： H02J13/0003 ,  Y02B90/228 ,  Y04S20/18

    摘要： A system for optimizing utility usage is described. The system comprises a monitoring device adapted to be connected to a utility point, a utility consuming device and a central processing unit (CPU). The monitoring device is configured to regulate utility usage information of the utility consuming device and is further configured to assign a unique identifier to the monitoring device. The monitoring device comprises a measurement circuit for measuring utility usage information, wherein the measurement circuit is coupled to the utility point. The monitoring device is configured to communicate with the CPU, wherein the monitoring device is configured to transmit utility usage information of the utility consuming device to the CPU on the unique identifier and wherein the monitoring device is configured to receive utility usage information of the utility consuming device and wherein the CPU is configured to process the utility usage information based on the unique identifier.

    摘要翻译： 描述用于优化实用程序使用的系统。 该系统包括适于连接到效用点的监视装置，公用设施消耗装置和中央处理单元（CPU）。 监视设备被配置为调节公用设施消耗设备的公用事业使用信息，并且还被配置为向监控设备分配唯一的标识符。 监视装置包括用于测量公用事业使用信息的测量电路，其中测量电路耦合到效用点。 所述监控设备被配置为与所述CPU通信，其中所述监控设备被配置为将所述公用设施消耗设备的公用设施使用信息传送到所述唯一标识符上的CPU，并且其中所述监控设备被配置为接收所述公用设施消耗的公用设施使用信息 设备，并且其中所述CPU被配置为基于所述唯一标识符处理所述公用设施使用信息。

    APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY
    8.
    发明申请
    APPARATUS AND METHOD FOR MANAGING THERMALLY INDUCED MOTION OF A PROBE CARD ASSEMBLY 有权
    用于管理探针卡组件的热诱导运动的装置和方法

    公开(公告)号：US20080042668A1

    公开(公告)日：2008-02-21

    申请号：US11877466

    申请日：2007-10-23

    申请人： Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

    发明人： Benjamin Eldridge ,  Gary Grube ,  Eric Hobbs ,  Gaetan Mathieu ,  Makarand Shinde ,  Alexander Slocum ,  A. Sporck ,  Thomas Watson

    IPC分类号： G01R1/073

    CPC分类号： G01R31/2874 ,  G01R31/2863 ,  G01R31/2889 ,  Y10T29/5313

    摘要： A probe card assembly can include a probe head assembly having probes for contacting an electronic device to be tested. The probe head assembly can be electrically connected to a wiring substrate and mechanically attached to a stiffener plate. The wiring substrate can provide electrical connections to a testing apparatus, and the stiffener plate can provide structure for attaching the probe card assembly to the testing apparatus. The stiffener plate can have a greater mechanical strength than the wiring substrate and can be less susceptible to thermally induced movement than the wiring substrate. The wiring substrate may be attached to the stiffener plate at a central location of the wiring substrate. Space may be provided at other locations where the wiring substrate is attached to the stiffener plate so that the wiring substrate can expand and contract with respect to the stiffener plate.

    摘要翻译： 探针卡组件可以包括具有用于接触要测试的电子设备的探针的探针头组件。 探针头组件可以电连接到布线基板并且机械地附接到加强板。 布线基板可以提供到测试装置的电连接，并且加强板可以提供用于将探针卡组件附接到测试装置的结构。 加强板可以具有比布线基板更大的机械强度，并且可以比布线基板更不易受热引起的移动。 布线基板可以在布线基板的中心位置处附接到加强板。 可以在将布线基板附接到加强板的其他位置处设置空间，使得布线基板能够相对于加强板膨胀和收缩。

    Probe card with coplanar daughter card
    9.
    发明申请
    Probe card with coplanar daughter card 失效

    公开(公告)号：US20050140381A1

    公开(公告)日：2005-06-30

    申请号：US11059164

    申请日：2005-02-15

    申请人： A. Sporck ,  Makarand Shinde

    发明人： A. Sporck ,  Makarand Shinde

    IPC分类号： G01R1/073 ,  G01R31/02

    CPC分类号： G01R1/07342

    摘要： A probe card assembly includes a printed circuit board with tester contacts for making electrical connections to a semiconductor tester. The probe card assembly also includes a probe head assembly with probes for contacting a semiconductor device under test. One or more daughter cards is mounted to the printed circuit board such that they are substantially coplanar with the printed circuit board. The daughter cards may contain a circuit for processing test data, including test signals to be input into the semiconductor and/or response signals generated by the semiconductor device in response to the test signals.

    MECHANICALLY RECONFIGURABLE VERTICAL TESTER INTERFACE FOR IC PROBING
    10.
    发明申请
    MECHANICALLY RECONFIGURABLE VERTICAL TESTER INTERFACE FOR IC PROBING 有权
    用于IC探测的机械可重构的垂直测试仪接口

    公开(公告)号：US20070229102A1

    公开(公告)日：2007-10-04

    申请号：US11761912

    申请日：2007-06-12

    申请人： Benjamin Eldridge ,  Barbara Vasquez ,  Makarand Shinde ,  Gaetan Mathieu ,  A. Sporck

    发明人： Benjamin Eldridge ,  Barbara Vasquez ,  Makarand Shinde ,  Gaetan Mathieu ,  A. Sporck

    IPC分类号： G01R31/02

    CPC分类号： G01R31/2889 ,  G01R1/0416 ,  G01R1/07307

    摘要： A wafer test assembly includes multiple probe head substrates arranged like tiles with connectors attached to one side and probes supported on the opposing side. In one embodiment, flexible cable connectors directly connect the connectors on the probe head tile to a test head, while in another embodiment the flexible cables connect the probe head tile to a PCB providing horizontal routing to test head connectors. In one embodiment, leveling pins provide a simplified support structure connecting to a retaining element attached to the tiles to provide for applying a push-pull leveling force. A test head connector interface frame enables rearrangement of connectors between the test head and the probe card to provide for both full wafer contact or partial wafer contact. The test head connectors are rearranged by being slidable on rails, or pluggable and unpluggable enabling movement over a range of positions.

    摘要翻译： 晶片测试组件包括多个探针头基底，其布置成瓦片，其中连接器连接到一侧，探针支撑在相对侧上。 在一个实施例中，柔性电缆连接器将探头头瓦片上的连接器直接连接到测试头，而在另一个实施例中，柔性电缆将探头头瓦片连接到PCB，从而向测试头连接器提供水平布线。 在一个实施例中，调平销提供连接到附接到瓦片的保持元件以提供施加推挽平整力的简化支撑结构。 测试头连接器接口框架能够重新布置测试头和探针卡之间的连接器，以提供完整的晶片接触或部分晶片接触。 测试头连接器通过在轨道上滑动来重新布置，或者可插拔和可拔出，使得能够在一定范围的位置上移动。