Method for the production of substrates, magnetron source and sputter-coating chamber
    3.
    发明授权
    Method for the production of substrates, magnetron source and sputter-coating chamber 失效
    制造基板,磁控管源和溅射镀膜室的方法

    公开(公告)号:US06579424B2

    公开(公告)日:2003-06-17

    申请号:US09775527

    申请日:2001-02-01

    IPC分类号: C23C1435

    摘要: A target of an alloy of metals having different specific weights is used in a method for producing substrates that are coated with a layer comprising the same two metals by magnetron sputtering of the target. When sputtering such a target material, the metals of the alloy will sputter off with different sputtering characteristics with regard to a static angle &agr; at which the sputtered off material leaves the target. For this reason, at the substrate to be sputter-coated, there occurs a demixing effect of these metals which will be deposited with a varying local ratio of the metals, that differs form the ratio of the metals in the alloy of the target. To counter-act this demixing phenomenon, the location of an electron trap formed by the magnetron field of the sputter source at the target with respect to the location of the substrate, is selected. By proving this electron trap and the resulting erosion profile on the target, the amount of deposited heavier metal to the amount of lighter metal is increased along the surface of the substrate.

    摘要翻译: 在具有不同比重的金属的合金的靶材用于通过靶的磁控溅射涂覆有包含相同的两种金属的层的基板的制造方法。 当溅射这种目标材料时,关于溅射的材料离开靶材的静态角度α,合金的金属将以不同的溅射特性溅射掉。 为此,在溅射涂覆的基板上,会发生这些金属的分层效应,这些金属将以不同的局部比例的金属沉积,这不同于目标合金中金属的比例。 为了抵消这种分层现象,选择了相对于衬底的位置在靶处由溅射源的磁控管场形成的电子阱的位置。 通过证明该电子阱和在靶上产生的侵蚀曲线,沿着衬底的表面增加沉积的较重金属量与较轻金属量的量。

    Apparatus for large-area ionic etching
    4.
    发明授权
    Apparatus for large-area ionic etching 失效
    大面积离子蚀刻装置

    公开(公告)号:US5292394A

    公开(公告)日:1994-03-08

    申请号:US881530

    申请日:1992-05-12

    IPC分类号: H01J37/32 C23F1/02

    摘要: An evacuable tank having gas inlet and gas outlet openings, with at least one large-area anode at ground potential and a cathode provided as a substrate holder disposed substantially parallel thereto and connected to a high-frequency voltage source. The anode surface has step-shaped areas each being spaced at a different distance from the cathode in order to maintain a uniform ion concentration and therefore a uniform plasma.

    摘要翻译: 具有气体入口和气体出口开口的排气罐,具有至少一个接地电位的大面积阳极和设置为基本平行于其并与高频电压源连接的衬底保持器的阴极。 阳极表面具有每个与阴极间隔不同距离的阶梯形区域,以便保持均匀的离子浓度并因此保持均匀的等离子体。

    Method and device for vacuum sputtering
    5.
    发明授权
    Method and device for vacuum sputtering 有权
    真空溅射的方法和装置

    公开(公告)号:US07155115B2

    公开(公告)日:2006-12-26

    申请号:US10119541

    申请日:2002-04-09

    申请人: Bernhard Cord

    发明人: Bernhard Cord

    IPC分类号: C23C14/24 C23C14/54

    CPC分类号: B05D1/60 B05D5/083 G11B5/8408

    摘要: The invention concerns a device and a process for applying a lubricant by means of vapour deposition to a target object, especially a magnetic data carrier. The device in accordance with the invention comprises a lubricant supply means (1) that can be filled from outside, possibly by means of a feed line. The produced lubricant vapour (5) is expanded through one or more exit openings (6) in the direction of a target object (8) on which the vapour deposition is to be effected. The vapour at first becomes adsorbed on the walls of a cone-shaped distribution element (4) situated between the lubricant supply means (1) and the target object (8), from which it subsequently desorbs again. Said adsorption/desorption process assures an even and homogeneous vapour distribution over the target object (8). A device for interrupting the vapour supply makes it possible for the device to be operated in a discontinuous manner.

    摘要翻译: 本发明涉及通过气相沉积将润滑剂施加到目标物体,特别是磁性数据载体上的装置和方法。 根据本发明的装置包括可以通过进料管线从外部填充的润滑剂供给装置(1)。 产生的润滑剂蒸汽(5)通过一个或多个出口(6)沿着要进行气相沉积的目标物体(8)的方向膨胀。 蒸汽首先被吸附在位于润滑剂供应装置(1)和目标物体(8)之间的锥形分配元件(4)的壁上,其随后再次解吸。 所述吸附/解吸过程确保在目标物体(8)上均匀且均匀的蒸气分布。 用于中断蒸汽供应的装置使得可以以不连续的方式操作装置。