Method for forming a gate in a FinFET device
    8.
    发明授权
    Method for forming a gate in a FinFET device 有权
    在FinFET器件中形成栅极的方法

    公开(公告)号:US06815268B1

    公开(公告)日:2004-11-09

    申请号:US10301732

    申请日:2002-11-22

    IPC分类号: H01L2100

    CPC分类号: H01L29/785 H01L29/66795

    摘要: A method of forming a gate in a FinFET device includes forming a fin on an insulating layer, forming source/drain regions and forming a gate oxide on the fin. The method also includes depositing a gate material over the insulating layer and the fin, depositing a barrier layer over the gate material and depositing a bottom anti-reflective coating (BARC) layer over the barrier layer. The method further includes forming a gate mask over the BARC layer, etching the BARC layer, where the etching terminates on the barrier layer, and etching the gate material to form the gate.

    摘要翻译: 在FinFET器件中形成栅极的方法包括在绝缘层上形成鳍片,形成源极/漏极区域并在鳍片上形成栅极氧化物。 该方法还包括在绝缘层和鳍上沉积栅极材料,在栅极材料上沉积阻挡层并在阻挡层上沉积底部抗反射涂层(BARC)层。 该方法还包括在BARC层上形成栅极掩模,蚀刻BARC层,其中蚀刻在阻挡层上终止,并蚀刻栅极材料以形成栅极。