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公开(公告)号：US08461022B2
公开(公告)日：2013-06-11
申请号：US12763400
申请日：2010-04-20
IPC分类号： H01L21/00
CPC分类号： H01L21/68
摘要： Methods and apparatus for aligning a substrate in a process chamber are provided herein. In some embodiments, an apparatus may include a process chamber having an interior volume for processing a substrate therein; and a substrate positioning system configured to determine a substrate position within the interior volume, wherein the substrate positioning system determines the substrate position in two dimensions by the interaction of a first position and a second position along an edge of a substrate with two beams of electromagnetic radiation provided by the substrate positioning system. In some embodiments, a method for aligning a substrate may include placing a substrate in the interior volume of a process chamber; directing electromagnetic radiation into the interior volume in a first beam along a first path and in a second beam along a second path; and determining the position of the substrate in two dimensions by interaction of the first and second beams of electromagnetic radiation with an edge of the substrate proximate a first position and a second position.
摘要翻译： 本文提供了用于在处理室中对准衬底的方法和装置。 在一些实施例中，装置可以包括具有用于在其中处理衬底的内部容积的处理室; 以及衬底定位系统，其被配置为确定所述内部体积内的衬底位置，其中所述衬底定位系统通过沿着衬底的边缘的第一位置和第二位置与两个电磁束的相互作用来确定所述衬底位置的二维 由基板定位系统提供的辐射。 在一些实施例中，用于对准衬底的方法可包括将衬底放置在处理室的内部容积中; 沿着第一路径将电磁辐射引导到第一光束中的内部空间中，并且沿着第二路径将电磁辐射引导到第二光束中; 以及通过第一和第二电磁辐射束与靠近第一位置和第二位置的衬底的边缘的相互作用来确定衬底在两个维度中的位置。
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公开(公告)号：US08367983B2
公开(公告)日：2013-02-05
申请号：US12483770
申请日：2009-06-12
CPC分类号： H01L21/67115
摘要： Methods and apparatus for processing substrates and measuring the temperature using radiation pyrometry are disclosed. A reflective layer is provided on a window of a processing chamber. A radiation source providing radiation in a first range of wavelengths heats the substrate, the substrate being transparent to radiation in a second range of wavelengths within the first range of wavelengths for a predetermined temperature range. Radiation within the second range of wavelength is reflected by the reflective layer.
摘要翻译： 公开了用于处理衬底和使用辐射测温法测量温度的方法和装置。 反射层设置在处理室的窗口上。 提供在第一波长范围内的辐射的辐射源加热衬底，所述衬底对于处于预定温度范围的第一波长范围内的第二波长范围内的辐射是透明的。 在第二波长范围内的辐射被反射层反射。
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公开(公告)号：US20090289053A1
公开(公告)日：2009-11-26
申请号：US12483770
申请日：2009-06-12
CPC分类号： H01L21/67115
摘要： Methods and apparatus for processing substrates and measuring the temperature using radiation pyrometry are disclosed. A reflective layer is provided on a window of a processing chamber. A radiation source providing radiation in a first range of wavelengths heats the substrate, the substrate being transparent to radiation in a second range of wavelengths within the first range of wavelengths for a predetermined temperature range. Radiation within the second range of wavelength is reflected by the reflective layer.
摘要翻译： 公开了用于处理衬底和使用辐射测温法测量温度的方法和装置。 反射层设置在处理室的窗口上。 提供在第一波长范围内的辐射的辐射源加热衬底，所述衬底对于处于预定温度范围的第一波长范围内的第二波长范围内的辐射是透明的。 在第二波长范围内的辐射被反射层反射。
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公开(公告)号：US08283607B2
公开(公告)日：2012-10-09
申请号：US12100179
申请日：2008-04-09
CPC分类号： H01L21/67115 , H01L21/67248
摘要： Methods and apparatus for processing substrates and measuring the temperature using radiation pyrometry are disclosed. A reflective layer is provided on a window of a processing chamber. A radiation source providing radiation in a first range of wavelengths heats the substrate, the substrate being transparent to radiation in a second range of wavelengths within the first range of wavelengths for a predetermined temperature range. Radiation within the second range of wavelength is reflected by the reflective layer.
摘要翻译： 公开了用于处理衬底和使用辐射测温法测量温度的方法和装置。 反射层设置在处理室的窗口上。 提供在第一波长范围内的辐射的辐射源加热衬底，所述衬底对于处于预定温度范围的第一波长范围内的第二波长范围内的辐射是透明的。 在第二波长范围内的辐射被反射层反射。
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公开(公告)号：US09640412B2
公开(公告)日：2017-05-02
申请号：US12622736
申请日：2009-11-20
IPC分类号： A21B2/00 , H01L21/324 , H01L21/67
CPC分类号： H01L21/324 , H01L21/67109 , H01L21/67115
摘要： The present invention generally relates to methods and apparatus for processing substrates. Embodiments of the invention include apparatuses for processing a substrate comprising a dynamic heat sink that is substantially transparent to light from a radiant heat source, the dynamic heat sink being positioned near the substrate so the two are coupled. Additional embodiments of the invention are directed to methods of processing a substrate using the apparatuses described.
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6.发明申请Apparatus and Method for Improved Control of Heating and Cooling of Substrates 审中-公开改善基板加热和冷却控制的装置和方法公开(公告)号：US20140004716A1
公开(公告)日：2014-01-02
申请号：US14012473
申请日：2013-08-28
IPC分类号： H01L21/263
CPC分类号： H01L21/2636 , H01L21/67098 , H01L21/67115
摘要： Methods and apparatus for processing substrates and controlling the heating and cooling of substrates are described. A radiation source providing radiation in a first range of wavelengths heats the substrate within a predetermined temperature range, the substrate being absorptive of radiation in a second range of wavelengths within the first range of wavelengths and within the predetermined temperature rang. A filter prevents at least a portion of radiation within the second wavelength range from reaching the substrate.
摘要翻译： 描述了用于处理衬底和控制衬底的加热和冷却的方法和设备。 提供在第一波长范围内的辐射的辐射源将衬底加热到预定温度范围内，所述衬底吸收第一波长范围内的第二波长范围内且在预定温度范围内的辐射。 滤光器防止第二波长范围内的至少一部分辐射到达基板。
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公开(公告)号：US08314371B2
公开(公告)日：2012-11-20
申请号：US12611958
申请日：2009-11-04
申请人： Khurshed Sorabji , Joseph M. Ranish , Wolfgang Aderhold , Aaron M. Hunter , Blake R. Koelmel , Alexander N. Lerner , Nir Merry
发明人： Khurshed Sorabji , Joseph M. Ranish , Wolfgang Aderhold , Aaron M. Hunter , Blake R. Koelmel , Alexander N. Lerner , Nir Merry
IPC分类号： H01B1/00
CPC分类号： H01L21/67259 , C23C16/46 , H01L21/324 , H01L21/67115 , H01L21/68 , H01L21/681 , H01L21/6835 , H01L21/68742
摘要： Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.
摘要翻译： 描述了包括将衬底轴向对准衬底支撑件或经验确定的位置的用于快速热处理平面衬底的方法和装置。 所述方法和装置包括确定衬底和衬底支撑件的相对取向的传感器系统。
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公开(公告)号：US20120070136A1
公开(公告)日：2012-03-22
申请号：US13184895
申请日：2011-07-18
IPC分类号： F27D11/12
CPC分类号： H01L21/67115 , F27B5/06 , F27B5/14 , F27B5/18 , F27D11/02 , F27D2019/0003 , H01L21/67011 , H01L21/67248
摘要： The present invention generally relates to methods and apparatus for processing substrates. Embodiments of the invention include apparatuses for processing a substrate comprising a ceramic reflector plate, which may be optically transparent. The reflector plate may include a reflective coating and be part of a reflector plate assembly in which the reflector plate is assembled to a baseplate.
摘要翻译： 本发明一般涉及用于处理衬底的方法和装置。 本发明的实施例包括用于处理包括可以是光学透明的陶瓷反射板的基板的装置。 反射板可以包括反射涂层，并且是反射板组件的一部分，其中反射板组装到基板上。
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9.发明申请Apparatus and Method for Enhancing the Cool Down of Radiatively Heated Substrates 有权用于增强放热加热基板的冷却的装置和方法公开(公告)号：US20110123178A1
公开(公告)日：2011-05-26
申请号：US12622736
申请日：2009-11-20
IPC分类号： F27B5/06
CPC分类号： H01L21/324 , H01L21/67109 , H01L21/67115
摘要： The present invention generally relates to methods and apparatus for processing substrates. Embodiments of the invention include apparatuses for processing a substrate comprising a dynamic heat sink that is substantially transparent to light from a radiant heat source, the dynamic heat sink being positioned near the substrate so the two are coupled. Additional embodiments of the invention are directed to methods of processing a substrate using the apparatuses described.
摘要翻译： 本发明一般涉及用于处理衬底的方法和装置。 本发明的实施例包括用于处理衬底的装置，该衬底包括对来自辐射热源的光基本透明的动态散热器，动态散热器位于衬底附近，使得两者耦合。 本发明的另外的实施例涉及使用所述装置处理衬底的方法。
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公开(公告)号：US20100133257A1
公开(公告)日：2010-06-03
申请号：US12611958
申请日：2009-11-04
申请人： Khurshed Sorabji , Joseph M. Ranish , Wolfgang Aderhold , Aaron M. Hunger , Blake R. Koelmel , Alexander N. Lerner , Nir Merry
发明人： Khurshed Sorabji , Joseph M. Ranish , Wolfgang Aderhold , Aaron M. Hunger , Blake R. Koelmel , Alexander N. Lerner , Nir Merry
CPC分类号： H01L21/67259 , C23C16/46 , H01L21/324 , H01L21/67115 , H01L21/68 , H01L21/681 , H01L21/6835 , H01L21/68742
摘要： Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.
摘要翻译： 描述了包括将衬底轴向对准衬底支撑件或经验确定的位置的用于快速热处理平面衬底的方法和装置。 所述方法和装置包括确定衬底和衬底支撑件的相对取向的传感器系统。
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