Pixelated photoresists
    1.
    发明授权
    Pixelated photoresists 有权
    像素化的光刻胶

    公开(公告)号:US08003293B2

    公开(公告)日:2011-08-23

    申请号:US10956284

    申请日:2004-09-30

    摘要: A deliberately engineered placement and size constraint (molecular weight distribution) of photoacid generators, solubility switches, photoimageable species, and quenchers forms individual pixels within a photoresist. Upon irradiation, a self-contained reaction occurs within each of the individual pixels that were irradiated to pattern the photoresist. These pixels may take on a variety of forms including a polymer chain, a bulky cluster, a micelle, or a micelle formed of several polymer chains. Furthermore, these pixels may be designed to self-assemble onto the substrate on which the photoresist is applied.

    摘要翻译: 光致酸产生剂,溶解度开关,可光成象物质和猝灭剂的故意设计的放置和尺寸约束(分子量分布)在光致抗蚀剂内形成各个像素。 在照射时,在被照射以对光致抗蚀剂进行图案化的各个像素内发生独立的反应。 这些像素可以具有各种形式,包括由几个聚合物链形成的聚合物链,大体积聚集体,胶束或胶束。 此外,这些像素可以被设计为自组装到其上施加光致抗蚀剂的基板上。

    Layered films formed by controlled phase segregation
    2.
    发明授权
    Layered films formed by controlled phase segregation 有权
    通过控制相分离形成的层状膜

    公开(公告)号:US07241707B2

    公开(公告)日:2007-07-10

    申请号:US11060843

    申请日:2005-02-17

    IPC分类号: H01L21/469

    摘要: Multiple-layer films in integrated circuit processing may be formed by the phase segregation of a single composition formed above a semiconductor substrate. The composition is then induced to phase segregate into at least a first continuous phase and a second continuous phase. The composition may be formed of two or more components that phase segregate into different continuous layers. The composition may also be a single component that breaks down upon activation into two or more components that phase segregate into different continuous layers. Phase segregation may be used to form, for example, a sacrificial light absorbing material (SLAM) and a developer resistant skin, a dielectric layer and a hard mask, a photoresist and an anti-reflective coating (ARC), a stress buffer coating and a protective layer on a substrate package, and light interference layers.

    摘要翻译: 集成电路处理中的多层膜可以通过在半导体衬底上形成的单一组合物的相分离来形成。 然后将组合物诱导相分离成至少第一连续相和第二连续相。 组合物可以由相分离成不同连续层的两种或更多种组分形成。 组合物还可以是单一组分,其在活化时分解成两个或多个相分离成不同连续层的组分。 相分离可以用于形成例如牺牲光吸收材料(SLAM)和显影剂抗性皮肤,电介质层和硬掩模,光致抗蚀剂和抗反射涂层(ARC),应力缓冲涂层和 衬底封装上的保护层,以及光干涉层。