ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY PANEL
    2.
    发明申请
    ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY PANEL 有权
    阵列基板,其制造方法和显示面板

    公开(公告)号:US20160349584A1

    公开(公告)日:2016-12-01

    申请号:US14354186

    申请日:2013-12-03

    摘要: An array substrate, a manufacturing method thereof and a display panel are disclosed. The array substrate includes: a base substrate, gate scanning lines, a gate-insulating layer, an active layer, data lines, a passivation layer, and pixel electrodes; the array substrate further includes: a bridge structure and a connection line corresponding to each data line; the bridge structure is located on the passivation layer and is provided in a same layer as the pixel electrodes; each connection line is located on the base substrate and is connected with the data line, through the bridge structure in an LED region and in a region under a scribe line of a counter substrate. Therefore the problem of defective display caused by breakage of data lines can be solved, and the display effect of a liquid crystal display device can be improved.

    摘要翻译: 公开了阵列基板,其制造方法和显示面板。 阵列基板包括:基底基板,栅极扫描线,栅极绝缘层,有源层,数据线,钝化层和像素电极; 阵列基板还包括:桥结构和对应于每条数据线的连接线; 桥结构位于钝化层上并且设置在与像素电极相同的层中; 每个连接线位于基底基板上,并通过LED区域中的桥结构和相对基板的划线下方的区域与数据线连接。 因此,可以解决由于数据线的破损引起的不良显示的问题,并且可以提高液晶显示装置的显示效果。

    LIGHT-EMITTING DIODE AND DRIVING METHOD THEREFOR, AND LIGHT SOURCE APPARATUS AND ELECTRONIC DEVICE

    公开(公告)号:US20220344537A1

    公开(公告)日:2022-10-27

    申请号:US17762654

    申请日:2021-05-17

    摘要: A light emitting diode and a driving method thereof, a light source apparatus, and an electronic device are disclosed, relating to the technical field of semiconductors. The light emitting diode includes: a substrate; a reflective light-emitting layer disposed on the substrate; a first electrode, a second electrode, and a first insulating layer which are discretely disposed on the reflective light-emitting layer; a saturable absorber layer disposed on the first insulating layer; and a third electrode, a fourth electrode, and a reflective composite layer which are disposed on the saturable absorber layer, respectively, the reflectivity of the reflective light-emitting layer is greater than the reflectivity of the reflective composite layer; wherein the orthographic projections of the saturable absorber layer, the third electrode, the fourth electrode, and the reflective composite layer on the reflective light-emitting layer, respectively, do not overlap with the first electrode and the second electrode.

    PIXEL CIRCUIT AND DISPLAY PANEL
    8.
    发明申请

    公开(公告)号:US20220319416A1

    公开(公告)日:2022-10-06

    申请号:US17299078

    申请日:2020-09-30

    IPC分类号: G09G3/3233 G09G3/3266

    摘要: The pixel circuit includes a write-in compensation module for writing data signal(s) into a light emission device through a driving transistor and compensating a threshold voltage of the driving transistor; a first reset module for providing a signal of a first reset signal end to a gate of the driving transistor under control of a first reset control end; a second reset module for providing a signal of a second reset signal end to an anode of the light emission device under control of a second reset control end; and a light emission control module for connecting a drain electrode of the driving transistor with the anode under control of a light emission control end. A cathode of the light emission device is connected with a first power source voltage end; a potential of the first reset signal end is larger than a potential of the second reset signal end.

    PACKAGING COVER PLATE, ORGANIC LIGHT-EMITTING DIODE DISPLAY AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:US20210249632A1

    公开(公告)日:2021-08-12

    申请号:US16319576

    申请日:2018-05-11

    发明人: Linlin WANG

    IPC分类号: H01L51/52 H01L51/56

    摘要: Disclosed are a packaging cover plate, an organic light-emitting diode display and a manufacturing method therefor. The packaging cover plate comprises: a cover plate body, the cover plate body being provided with open slots; cover plugs for covering openings at two ends of the open slots; and water absorption layers for at least covering mouths of the open slots. By means of the arranged open slots, the packaging cover plate can conveniently introduce a dry gas. In addition, the water absorption layers absorb water vapour, the introduced dry gas dries the water absorption layers, and the water vapour and oxygen in the water absorption layers can be taken away by means of the circular flow of the dry gas, so that damage to a device by water vapour and oxygen can be reduced, and the packaging effect is better.