公开(公告)号：US20230089928A1

公开(公告)日：2023-03-23

申请号：US17482351

申请日：2021-09-22

申请人： Ziyin Lin ,  Yiqun Bai ,  Hongxia Feng ,  Dingying Xu ,  Jieying Kong ,  Srinivas Pietambaram

发明人： Ziyin Lin ,  Yiqun Bai ,  Hongxia Feng ,  Dingying Xu ,  Jieying Kong ,  Srinivas Pietambaram

IPC分类号： H01L23/31 ,  H01L23/18 ,  H01L23/29 ,  H01L23/538 ,  H01L23/00 ,  H01L21/56

摘要： Semiconductor devices having hollow filler materials are disclosed. A disclosed example semiconductor device includes at least one of a substrate or an interposer, interconnects extending through the at least one of the substrate or the interposer, and a composite material integral with or covering at least a portion of the semiconductor device, the composite material including a polymer matrix with a hollow filler material having voids therein.

公开(公告)号：US20150179478A1

公开(公告)日：2015-06-25

申请号：US14135236

申请日：2013-12-19

申请人： Yonghao Xiu ,  Nisha Ananthakrishnan ,  Yiqun Bai ,  Arjun Krishnan

发明人： Yonghao Xiu ,  Nisha Ananthakrishnan ,  Yiqun Bai ,  Arjun Krishnan

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/00

CPC分类号： C08K3/013 ,  H01L21/563 ,  H01L23/295 ,  H01L24/17 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L24/91 ,  H01L2224/131 ,  H01L2224/16057 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2924/01006 ,  H01L2924/04642 ,  H01L2924/0493 ,  H01L2924/053 ,  H01L2924/0533 ,  H01L2924/05341 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/186 ,  H01L2924/0665 ,  H01L2924/05032 ,  H01L2924/014

摘要： An underfill composition comprises a curable resin, a plurality of filler particles loaded within the resin, the filler particles comprising at least 50 weight % of the underfill composition. The filler particles comprise first filler particles having a particle size of from 0.1 micrometers to 15 micrometers and second filler particles having a particle size of less than 100 nanometers. A viscosity of the underfill composition is less than a viscosity of a corresponding composition not including the second filler particles.

摘要翻译： 底部填充组合物包含可固化树脂，负载在树脂内的多个填料颗粒，填料颗粒包含至少50重量％的底部填充组合物。 填料颗粒包含粒度为0.1微米至15微米的第一填料颗粒和粒径小于100纳米的第二填料颗粒。 底部填充剂组合物的粘度小于不包括第二填料颗粒的相应组合物的粘度。

公开(公告)号：US08916981B2

公开(公告)日：2014-12-23

申请号：US13891475

申请日：2013-05-10

申请人： Yonghao Xiu ,  Yiqun Bai ,  Nisha Ananthakrishnan ,  Nachiket R. Raravikar

发明人： Yonghao Xiu ,  Yiqun Bai ,  Nisha Ananthakrishnan ,  Nachiket R. Raravikar

IPC分类号： H01L23/29 ,  H01L25/00

CPC分类号： H01L23/293 ,  C09J163/00 ,  H01L21/563 ,  H01L25/00 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00

摘要： Epoxy-amine underfill materials for semiconductor packages and semiconductor packages having an epoxy-amine underfill material are described. In an example, a semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon. A semiconductor package substrate has a surface with a plurality of contact pads thereon. A plurality of conductive contacts couples the surface of the semiconductor die to the surface of the semiconductor package substrate. An epoxy-amine underfill material is disposed between the surface of the semiconductor die and the surface of the semiconductor package substrate and surrounds the plurality of conductive contacts. The epoxy-amine underfill has high adhesion and is based on a low volatility multi-functional amine species.

摘要翻译： 描述了具有环氧 - 胺底部填充材料的半导体封装和半导体封装的环氧胺底部填充材料。 在一个示例中，半导体装置包括其上具有集成电路的表面的半导体管芯。 半导体封装衬底具有其上具有多个接触焊盘的表面。 多个导电触头将半导体管芯的表面耦合到半导体封装衬底的表面。 环氧胺底部填充材料设置在半导体管芯的表面和半导体封装衬底的表面之间并且围绕多个导电触点。 环氧胺底部填充剂具有高粘合性，并且基于低挥发性多官能胺物质。

公开(公告)号：US20140332966A1

公开(公告)日：2014-11-13

申请号：US13891475

申请日：2013-05-10

申请人： Yonghao Xiu ,  Yiqun Bai ,  Nisha Ananthakrishnan ,  Nachiket R. Raravikar

发明人： Yonghao Xiu ,  Yiqun Bai ,  Nisha Ananthakrishnan ,  Nachiket R. Raravikar

IPC分类号： H01L23/29 ,  H01L25/00

CPC分类号： H01L23/293 ,  C09J163/00 ,  H01L21/563 ,  H01L25/00 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/00

摘要： Epoxy-amine underfill materials for semiconductor packages and semiconductor packages having an epoxy-amine underfill material are described. In an example, a semiconductor apparatus includes a semiconductor die having a surface with an integrated circuit thereon. A semiconductor package substrate has a surface with a plurality of contact pads thereon. A plurality of conductive contacts couples the surface of the semiconductor die to the surface of the semiconductor package substrate. An epoxy-amine underfill material is disposed between the surface of the semiconductor die and the surface of the semiconductor package substrate and surrounds the plurality of conductive contacts. The epoxy-amine underfill has high adhesion and is based on a low volatility multi-functional amine species.

摘要翻译： 描述了具有环氧 - 胺底部填充材料的半导体封装和半导体封装的环氧胺底部填充材料。 在一个示例中，半导体装置包括其上具有集成电路的表面的半导体管芯。 半导体封装衬底具有其上具有多个接触焊盘的表面。 多个导电触点将半导体管芯的表面耦合到半导体封装衬底的表面。 环氧胺底部填充材料设置在半导体管芯的表面和半导体封装衬底的表面之间并且围绕多个导电触点。 环氧胺底部填充剂具有高粘合性，并且基于低挥发性多官能胺物质。

公开(公告)号：US20140177149A1

公开(公告)日：2014-06-26

申请号：US13722886

申请日：2012-12-20

申请人： Suriyakala Ramalingam ,  Manish Dubey ,  Hsin-Yu Li ,  Michelle S. Phen ,  Hitesh Arora ,  Nisha Ananthakrishnan ,  Yiqun Bai ,  Yonghao Xiu ,  Rajendra C. Dias

发明人： Suriyakala Ramalingam ,  Manish Dubey ,  Hsin-Yu Li ,  Michelle S. Phen ,  Hitesh Arora ,  Nisha Ananthakrishnan ,  Yiqun Bai ,  Yonghao Xiu ,  Rajendra C. Dias

IPC分类号： H01L23/28 ,  G06F1/16 ,  H01L21/56

CPC分类号： H01L21/563 ,  H01L23/295 ,  H01L24/09 ,  H01L24/17 ,  H01L24/29 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/29386 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

摘要： Embodiments of the present disclosure are directed to techniques and configurations for an integrated circuit (IC) package having an underfill layer with filler particles arranged in a generally random distribution pattern. In some embodiments, a generally random distribution pattern of filler particles may be obtained by reducing an electrostatic charge on one or more components of the IC package assembly, by applying a surface treatment to filler to reduce filler electrical charge, by applying an electric force against the filler particles of the underfill material in a direction opposite to a direction of gravitational force, by using an underfill material with a relatively low maximum filler particle size, and/or by snap curing the underfill layer at a relatively low temperature. Other embodiments may be described and/or claimed.

摘要翻译： 本公开的实施例涉及用于具有以通常随机分布图案排列的填充颗粒的底部填充层的集成电路（IC）封装的技术和配置。 在一些实施例中，通过对IC封装组件的一个或多个部件上的静电电荷，通过对填料进行表面处理以减少填充剂电荷，可以通过施加电力来抵抗填料颗粒的大致随机分布图案 通过使用相对较低的最大填充剂粒度的底部填充材料和/或通过在相对低的温度下快速固化底部填充层，使底部填充材料的填料颗粒在与重力方向相反的方向上。 可以描述和/或要求保护其他实施例。

公开(公告)号：US08012808B2

公开(公告)日：2011-09-06

申请号：US12028090

申请日：2008-02-08

申请人： Wei Shi ,  Daoqiang Lu ,  Yiqun Bai ,  Qing A. Zhou ,  Jianqqi He

发明人： Wei Shi ,  Daoqiang Lu ,  Yiqun Bai ,  Qing A. Zhou ,  Jianqqi He

IPC分类号： H01L21/00

CPC分类号： H01L23/473 ,  H01L25/0657 ,  H01L25/18 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/00

摘要： Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures.

摘要翻译： 本发明的一些实施例包括与通过硅架构从3D去除热量的集成微通道相关的装置和方法。

公开(公告)号：US20090201643A1

公开(公告)日：2009-08-13

申请号：US12028090

申请日：2008-02-08

申请人： Wei Shi ,  Daoqiang Lu ,  Yiqun Bai ,  Qing A. Zhou ,  Jianqqi He

发明人： Wei Shi ,  Daoqiang Lu ,  Yiqun Bai ,  Qing A. Zhou ,  Jianqqi He

IPC分类号： H05K7/20 ,  H01L21/30

CPC分类号： H01L23/473 ,  H01L25/0657 ,  H01L25/18 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/00

摘要： Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures.

摘要翻译： 本发明的一些实施例包括与通过硅架构从3D去除热量的集成微通道相关的装置和方法。

公开(公告)号：US20070085198A1

公开(公告)日：2007-04-19

申请号：US11250644

申请日：2005-10-13

申请人： Wei Shi ,  Daoqiang Lu ,  Yiqun Bai ,  Qing Zhou ,  Jiangqi He

发明人： Wei Shi ,  Daoqiang Lu ,  Yiqun Bai ,  Qing Zhou ,  Jiangqi He

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L25/0657 ,  H01L25/18 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/00

摘要： Some embodiments of the present invention include apparatuses and methods relating to integrated micro-channels for removing heat from 3D through silicon architectures.

摘要翻译： 本发明的一些实施例包括与通过硅架构从3D去除热量的集成微通道相关的装置和方法。

公开(公告)号：US09330993B2

公开(公告)日：2016-05-03

申请号：US13721266

申请日：2012-12-20

申请人： Yiqun Bai ,  Yuying Wei ,  Arjun Krishnan ,  Suriyakala Ramalingam ,  Yonghao Xiu ,  Beverly J. Canham ,  Sivakumar Nagarajan ,  Saikumar Jayaraman ,  Nisha Ananthakrishnan

发明人： Yiqun Bai ,  Yuying Wei ,  Arjun Krishnan ,  Suriyakala Ramalingam ,  Yonghao Xiu ,  Beverly J. Canham ,  Sivakumar Nagarajan ,  Saikumar Jayaraman ,  Nisha Ananthakrishnan

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/29 ,  H01L21/56

CPC分类号： H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/296 ,  H01L24/13 ,  H01L2224/16225 ,  H01L2224/29647 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include modifying an underfill material with one of a thiol adhesion promoter, an azole coupling agent, surface modified filler, and peroxide based cross-linking polymer chemistries to greatly enhance adhesion in package structures utilizing the embodiments herein.

摘要翻译： 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法和结构可以包括用硫醇粘合促进剂，唑偶合剂，表面改性填料和基于过氧化物的交联聚合物化学物质之一改性底部填充材料，以便利用本文的实施方案极大地增强包装结构中的粘合性。

公开(公告)号：US20140175634A1

公开(公告)日：2014-06-26

申请号：US13721266

申请日：2012-12-20

申请人： Yiqun Bai ,  Yuying Wei ,  Arjun Krishnan ,  Suriyakala Ramalingam ,  Yonghao Xiu ,  Beverly J. Canham ,  Sivakumar Nagarajan ,  Saikumar Jayaraman ,  Nisha Ananthakrishnan

发明人： Yiqun Bai ,  Yuying Wei ,  Arjun Krishnan ,  Suriyakala Ramalingam ,  Yonghao Xiu ,  Beverly J. Canham ,  Sivakumar Nagarajan ,  Saikumar Jayaraman ,  Nisha Ananthakrishnan

IPC分类号： H01L23/29 ,  H01L21/56

CPC分类号： H01L21/563 ,  H01L23/293 ,  H01L23/295 ,  H01L23/296 ,  H01L24/13 ,  H01L2224/16225 ,  H01L2224/29647 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00

摘要： Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include modifying an underfill material with one of a thiol adhesion promoter, an azole coupling agent, surface modified filler, and peroxide based cross-linking polymer chemistries to greatly enhance adhesion in package structures utilizing the embodiments herein.

摘要翻译： 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法和结构可以包括用硫醇粘合促进剂，唑偶合剂，表面改性填料和基于过氧化物的交联聚合物化学物质之一改性底部填充材料，以便利用本文的实施方案极大地增强包装结构中的粘合性。