Calibration wafer and method of calibrating in situ temperatures
    1.
    发明授权
    Calibration wafer and method of calibrating in situ temperatures 失效
    校准晶圆和校准原位温度的方法

    公开(公告)号:US07452125B2

    公开(公告)日:2008-11-18

    申请号:US11894453

    申请日:2007-08-21

    IPC分类号: G01K15/00 G01J3/00

    CPC分类号: G01J5/0003 G01J5/522

    摘要: A system and method for calibrating a pyrometer used in temperature detection in a chemical vapor deposition system is provided. A calibration wafer with a reference region including a metal such as Al or Ag for forming a eutectic, and an exposed non-reference region without such a metal, are provided. Reflectivity measurements are taken from the reference region, and temperature measurements are taken from the non-reference region, over a range of temperatures including a known melting point for the metal eutectic. The pyrometer is calibrated based on the correlation of the known eutectic melting point with the change in reflectivity data obtained in the reference region, in light of the temperature data obtained from the non-reference region.

    摘要翻译: 提供了用于校准化学气相沉积系统中用于温度检测的高温计的系统和方法。 提供具有包括用于形成共晶的诸如Al或Ag的金属的参考区域的校准晶片,以及没有这种金属的暴露的非参考区域。 反射率测量取自参考区域,温度测量取自非参考区域,在包括金属共晶体的已知熔点的温度范围内。 根据从非参考区获得的温度数据,基于已知共晶熔点与在参考区域中获得的反射率数据的变化的相关性校正高温计。

    Calibration wafer and method of calibrating in situ temperatures

    公开(公告)号:US20070291816A1

    公开(公告)日:2007-12-20

    申请号:US11894453

    申请日:2007-08-21

    IPC分类号: G01K15/00

    CPC分类号: G01J5/0003 G01J5/522

    摘要: A system and method for calibrating a pyrometer used in temperature detection in a chemical vapor deposition system is provided. A calibration wafer with a reference region including a metal such as Al or Ag for forming a eutectic, and an exposed non-reference region without such a metal, are provided. Reflectivity measurements are taken from the reference region, and temperature measurements are taken from the non-reference region, over a range of temperatures including a known melting point for the metal eutectic. The pyrometer is calibrated based on the correlation of the known eutectic melting point with the change in reflectivity data obtained in the reference region, in light of the temperature data obtained from the non-reference region.

    Calibration wafer and method of calibrating in situ temperatures
    3.
    发明授权
    Calibration wafer and method of calibrating in situ temperatures 失效
    校准晶圆和校准原位温度的方法

    公开(公告)号:US07275861B2

    公开(公告)日:2007-10-02

    申请号:US11046741

    申请日:2005-01-31

    IPC分类号: G01K15/00 G01J5/00

    CPC分类号: G01J5/0003 G01J5/522

    摘要: A system and method for calibrating a pyrometer used in temperature detection in a chemical vapor deposition system is provided. A calibration wafer with a reference region including a metal such as Al or Ag for forming a eutectic, and an exposed non-reference region without such a metal, are provided. Reflectivity measurements are taken from the reference region, and temperature measurements are taken from the non-reference region, over a range of temperatures including a known melting point for the metal eutectic. The pyrometer is calibrated based on the correlation of the known eutectic melting point with the change in reflectivity data obtained in the reference region, in light of the temperature data obtained from the non-reference region.

    摘要翻译: 提供了用于校准化学气相沉积系统中用于温度检测的高温计的系统和方法。 提供具有包括用于形成共晶的诸如Al或Ag的金属的参考区域的校准晶片,以及没有这种金属的暴露的非参考区域。 反射率测量取自参考区域,温度测量取自非参考区域,在包括金属共晶体的已知熔点的温度范围内。 根据从非参考区获得的温度数据,基于已知共晶熔点与在参考区域中获得的反射率数据的变化的相关性校正高温计。

    Method and apparatus for measuring the curvature of reflective surfaces
    4.
    发明申请
    Method and apparatus for measuring the curvature of reflective surfaces 有权
    用于测量反射表面曲率的方法和装置

    公开(公告)号:US20050286058A1

    公开(公告)日:2005-12-29

    申请号:US11127834

    申请日:2005-05-12

    IPC分类号: G01B11/24

    CPC分类号: G01B11/24

    摘要: A method for monitoring the curvature of a surface of a body such as a semiconductor wafer (22) includes directing a beam of light along an impingement axis (36) onto the surface so that a beam of light (41) is reflected from the surface at a point of impingement. The position of the reflected beam (41) is detected in two dimensions (x,y). The body (22) is moved relative to the impingement axis (41) in a direction transverse to the impingement axis and the beam-directing and position determining steps are repeated. The curvature of the surface is calculated from the detected positions of the reflected beam in a plurality of repetitions.

    摘要翻译: 用于监测诸如半导体晶片(22)的主体的表面的曲率的方法包括将光束沿着冲击轴线(36)引导到表面上,使得光束(41)从表面反射 在撞击点。 在二维(x,y)中检测反射光束(41)的位置。 主体(22)相对于冲击轴线(41)在横向于冲击轴线的方向上移动,并且重新进行光束定向和位置确定步骤。 从多个重复的反射光束的检测位置算出表面的曲率。

    Method and apparatus for measuring the curvature of reflective surfaces
    5.
    发明授权
    Method and apparatus for measuring the curvature of reflective surfaces 有权
    用于测量反射表面曲率的方法和装置

    公开(公告)号:US07570368B2

    公开(公告)日:2009-08-04

    申请号:US11127834

    申请日:2005-05-12

    IPC分类号: G01B11/24

    CPC分类号: G01B11/24

    摘要: A method for monitoring the curvature of a surface of a body such as a semiconductor wafer (22) includes directing a beam of light along an impingement axis (36) onto the surface so that a beam of light (41) is reflected from the surface at a point of impingement. The position of the reflected beam (41) is detected in two dimensions (x,y). The body (22) is moved relative to the impingement axis (41) in a direction transverse to the impingement axis and the beam-directing and position determining steps are repeated. The curvature of the surface is calculated from the detected positions of the reflected beam in a plurality of repetitions.

    摘要翻译: 用于监测诸如半导体晶片(22)的主体的表面的曲率的方法包括将光束沿着冲击轴线(36)引导到表面上,使得光束(41)从表面反射 在撞击点。 在二维(x,y)中检测反射光束(41)的位置。 主体(22)相对于冲击轴线(41)在横向于冲击轴线的方向上移动,并且重新进行光束定向和位置确定步骤。 从多个重复的反射光束的检测位置算出表面的曲率。

    Calibration wafer and method of calibrating in situ temperatures
    6.
    发明申请
    Calibration wafer and method of calibrating in situ temperatures 失效
    校准晶圆和校准原位温度的方法

    公开(公告)号:US20060171442A1

    公开(公告)日:2006-08-03

    申请号:US11046741

    申请日:2005-01-31

    IPC分类号: G01K13/00 G01K15/00 G01K1/08

    CPC分类号: G01J5/0003 G01J5/522

    摘要: A system and method for calibrating a pyrometer used in temperature detection in a chemical vapor deposition system is provided. A calibration wafer with a reference region including a metal such as Al or Ag for forming a eutectic, and an exposed non-reference region without such a metal, are provided. Reflectivity measurements are taken from the reference region, and temperature measurements are taken from the non-reference region, over a range of temperatures including a known melting point for the metal eutectic. The pyrometer is calibrated based on the correlation of the known eutectic melting point with the change in reflectivity data obtained in the reference region, in light of the temperature data obtained from the non-reference region.

    摘要翻译: 提供了用于校准化学气相沉积系统中用于温度检测的高温计的系统和方法。 提供具有包括用于形成共晶的诸如Al或Ag的金属的参考区域的校准晶片,以及没有这种金属的暴露的非参考区域。 反射率测量取自参考区域,温度测量取自非参考区域,在包括金属共晶体的已知熔点的温度范围内。 根据从非参考区获得的温度数据,基于已知共晶熔点与在参考区域中获得的反射率数据的变化的相关性校正高温计。

    Chemical vapor deposition flow inlet elements and methods
    9.
    发明授权
    Chemical vapor deposition flow inlet elements and methods 有权
    化学气相沉积流入口元素及方法

    公开(公告)号:US08636847B2

    公开(公告)日:2014-01-28

    申请号:US13606130

    申请日:2012-09-07

    IPC分类号: C23C16/00 C23C16/455

    摘要: A flow inlet element (22) for a chemical vapor deposition reactor (10) is formed from a plurality of elongated tubular elements (64, 65) extending side-by-side with one another in a plane transverse to the upstream to downstream direction of the reactor. The tubular elements have inlets for ejecting gas in the downstream direction. A wafer carrier (14) rotates around an upstream to downstream axis. The gas distribution elements may provide a pattern of gas distribution which is asymmetrical with respect to a medial plane (108) extending through the axis.

    摘要翻译: 用于化学气相沉积反应器(10)的流入口元件(22)由多个细长管状元件(64,65)形成,所述多个细长管状元件(64,65)在横向于上游到下游方向的平面中彼此并排延伸 反应堆。 管状元件具有用于沿下游方向喷射气体的入口。 晶片载体(14)围绕上游到下游轴线旋转。 气体分布元件可以提供相对于延伸穿过轴线的中间平面(108)不对称的气体分布图案。