公开(公告)号：US06791198B2

公开(公告)日：2004-09-14

申请号：US10328896

申请日：2002-12-24

申请人： Bret K. Street ,  Casey L. Prindiville ,  Cary Baerlocher

发明人： Bret K. Street ,  Casey L. Prindiville ,  Cary Baerlocher

IPC分类号： H01L2348

CPC分类号： H01L21/565 ,  H01L2924/0002 ,  Y10T29/49121 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T29/5137 ,  Y10T29/53178 ,  H01L2924/00

摘要： A method and device for providing a gate blocking material. Specifically, a method for molding a substrate having known good and bad sites thereon, by blocking the gate area of the bad sites during the molding process. A blocking material or an injection pin are used to interrupt the flow of molding compound through an injection molding system, and thereby prevent molding compound from flowing onto the known bad substrate sites.

摘要翻译： 一种用于提供栅极阻挡材料的方法和装置。 具体而言，通过在成型工序中阻挡不良部位的浇口面积，对其上具有已知良好和不良位置的基板成型的方法。 使用阻挡材料或注射针来通过注塑系统中断模塑料的流动，从而防止模塑料流入已知的不良基底部位。

公开(公告)号：US06776599B2

公开(公告)日：2004-08-17

申请号：US10328503

申请日：2002-12-24

申请人： Bret K. Street ,  Casey L. Prindiville ,  Cary Baerlocher

发明人： Bret K. Street ,  Casey L. Prindiville ,  Cary Baerlocher

IPC分类号： B29C4514

CPC分类号： H01L21/565 ,  H01L2924/0002 ,  Y10T29/49121 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T29/5137 ,  Y10T29/53178 ,  H01L2924/00

摘要： A method and device for providing a gate blocking material. Specifically, a method for molding a substrate having known good and bad sites thereon, by blocking the gate area of the bad sites during the molding process. A blocking material or an injection pin are used to interrupt the flow of molding compound through an injection molding system, and thereby prevent molding compound from flowing onto the known bad substrate sites.

公开(公告)号：US06523254B1

公开(公告)日：2003-02-25

申请号：US09552409

申请日：2000-04-19

申请人： Bret K. Street ,  Casey L. Prindiville ,  Cary Baerlocher

发明人： Bret K. Street ,  Casey L. Prindiville ,  Cary Baerlocher

IPC分类号： H05K330

CPC分类号： H01L21/565 ,  H01L2924/0002 ,  Y10T29/49121 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T29/5137 ,  Y10T29/53178 ,  H01L2924/00

摘要： A method and device for providing a gate blocking material. Specifically, a method for molding a substrate having known good and bad sites thereon, by blocking the gate area of the bad sites during the molding process. A blocking material or an injection pin are used to interrupt the flow of molding compound through an injection molding system, and thereby prevent molding compound from flowing onto the known bad substrate sites.

摘要翻译： 一种用于提供栅极阻挡材料的方法和装置。 具体而言，通过在成型工序中阻挡不良部位的浇口面积，对其上具有已知良好和不良位置的基板成型的方法。 使用阻挡材料或注射针来通过注模系统中断模塑料的流动，从而防止模塑料流入已知的不良基底部位。

公开(公告)号：US07163845B2

公开(公告)日：2007-01-16

申请号：US11198580

申请日：2005-08-05

申请人： Casey L. Prindiville

发明人： Casey L. Prindiville

IPC分类号： H01L21/44

CPC分类号： H01L23/3107 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/48 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A technique is provided for dissipating heat from an integrated circuit within a package. A thermally conductive strip may be disposed adjacent to an integrated circuit die before packaging. The package is formed around the integrated circuit and the thermally conductive strip such that a portion of the thermally conductive strip extends through the package. Heat is conducted from the integrated circuit through the thermally conductive strip to the environment surrounding the package. A thermally conductive strip may be installed within a package by an adhesive or other mechanical means. A thermally conductive strip may be comprised of a metallic foil or other thermally conductive material.

摘要翻译： 提供了用于从封装内的集成电路散热的技术。 在封装之前，导热条可以与集成电路管芯相邻设置。 封装形成在集成电路和导热条周围，使得导热条的一部分延伸穿过封装。 热量从集成电路通过导热带传导到包装周围的环境。 导热带可以通过粘合剂或其它机械方式安装在封装内。 导热带可以由金属箔或其它导热材料构成。

公开(公告)号：US06949824B1

公开(公告)日：2005-09-27

申请号：US09547640

申请日：2000-04-12

申请人： Casey L. Prindiville

发明人： Casey L. Prindiville

IPC分类号： H01L23/31 ,  H01L23/34 ,  H01L23/433 ,  H01L23/48 ,  H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/3128 ,  H01L23/4334 ,  H01L24/48 ,  H01L2224/4824 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A technique is provided for dissipating heat from an integrated circuit within a package. A thermally conductive strip may be installed between an integrated circuit and a substrate before packaging. The package is formed from molded epoxy formed around the integrated circuit and substrate with a portion of the thermally conductive strip extending beyond the confines of the package. Heat is conducted from the integrated circuit through the thermally conductive strip to the environment surrounding the package. A thermally conductive strip may be installed within a package by an adhesive or other mechanically means. A thermally conductive strip may be comprised of a metallic foil or other thermally conductive material.

摘要翻译： 提供了用于从封装内的集成电路散热的技术。 在包装之前，导热条可以安装在集成电路和基板之间。 封装由形成在集成电路和基板周围的模制环氧树脂形成，导热条的一部分延伸超过封装的范围。 热量从集成电路通过导热带传导到包装周围的环境。 导热条可以通过粘合剂或其它机械方式安装在封装内。 导热带可以由金属箔或其它导热材料构成。