公开(公告)号：US06791198B2

公开(公告)日：2004-09-14

申请号：US10328896

申请日：2002-12-24

申请人： Bret K. Street ,  Casey L. Prindiville ,  Cary Baerlocher

发明人： Bret K. Street ,  Casey L. Prindiville ,  Cary Baerlocher

IPC分类号： H01L2348

CPC分类号： H01L21/565 ,  H01L2924/0002 ,  Y10T29/49121 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T29/5137 ,  Y10T29/53178 ,  H01L2924/00

摘要： A method and device for providing a gate blocking material. Specifically, a method for molding a substrate having known good and bad sites thereon, by blocking the gate area of the bad sites during the molding process. A blocking material or an injection pin are used to interrupt the flow of molding compound through an injection molding system, and thereby prevent molding compound from flowing onto the known bad substrate sites.

摘要翻译： 一种用于提供栅极阻挡材料的方法和装置。 具体而言，通过在成型工序中阻挡不良部位的浇口面积，对其上具有已知良好和不良位置的基板成型的方法。 使用阻挡材料或注射针来通过注塑系统中断模塑料的流动，从而防止模塑料流入已知的不良基底部位。

公开(公告)号：US06776599B2

公开(公告)日：2004-08-17

申请号：US10328503

申请日：2002-12-24

申请人： Bret K. Street ,  Casey L. Prindiville ,  Cary Baerlocher

发明人： Bret K. Street ,  Casey L. Prindiville ,  Cary Baerlocher

IPC分类号： B29C4514

CPC分类号： H01L21/565 ,  H01L2924/0002 ,  Y10T29/49121 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T29/5137 ,  Y10T29/53178 ,  H01L2924/00

摘要： A method and device for providing a gate blocking material. Specifically, a method for molding a substrate having known good and bad sites thereon, by blocking the gate area of the bad sites during the molding process. A blocking material or an injection pin are used to interrupt the flow of molding compound through an injection molding system, and thereby prevent molding compound from flowing onto the known bad substrate sites.

公开(公告)号：US06523254B1

公开(公告)日：2003-02-25

申请号：US09552409

申请日：2000-04-19

申请人： Bret K. Street ,  Casey L. Prindiville ,  Cary Baerlocher

发明人： Bret K. Street ,  Casey L. Prindiville ,  Cary Baerlocher

IPC分类号： H05K330

CPC分类号： H01L21/565 ,  H01L2924/0002 ,  Y10T29/49121 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T29/5137 ,  Y10T29/53178 ,  H01L2924/00

摘要： A method and device for providing a gate blocking material. Specifically, a method for molding a substrate having known good and bad sites thereon, by blocking the gate area of the bad sites during the molding process. A blocking material or an injection pin are used to interrupt the flow of molding compound through an injection molding system, and thereby prevent molding compound from flowing onto the known bad substrate sites.

摘要翻译： 一种用于提供栅极阻挡材料的方法和装置。 具体而言，通过在成型工序中阻挡不良部位的浇口面积，对其上具有已知良好和不良位置的基板成型的方法。 使用阻挡材料或注射针来通过注模系统中断模塑料的流动，从而防止模塑料流入已知的不良基底部位。

公开(公告)号：US20050023653A1

公开(公告)日：2005-02-03

申请号：US10931369

申请日：2004-08-31

申请人： William Tandy ,  Matt Schwab ,  Cary Baerlocher

发明人： William Tandy ,  Matt Schwab ,  Cary Baerlocher

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L23/495

CPC分类号： H01L23/495 ,  H01L23/3107 ,  H01L23/49805 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/00

摘要： An integrated circuit device includes a semiconductor component coupled with a lead frame, and an integrated circuit package encompassing at least a portion of the semiconductor component. The package has a first surface and a second surface, and side surfaces, where the first surface is opposite the second surface. A parting line of the integrated circuit package is offset toward the second surface of the package, where the first surface optionally comprises the bottom surface of the package. The first surface of the package has one or more recessed areas.

摘要翻译： 集成电路器件包括与引线框架耦合的半导体部件和包含半导体部件的至少一部分的集成电路封装。 包装具有第一表面和第二表面以及侧表面，其中第一表面与第二表面相对。 集成电路封装的分型线朝向封装的第二表面偏移，其中第一表面任选地包括封装的底表面。 包装的第一表面具有一个或多个凹陷区域。

公开(公告)号：US20060237845A1

公开(公告)日：2006-10-26

申请号：US11428625

申请日：2006-07-05

申请人： Frank Hall ,  Cary Baerlocher

发明人： Frank Hall ,  Cary Baerlocher

IPC分类号： H01L23/48

CPC分类号： H01L24/73 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48644 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85138 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.

公开(公告)号：US20050026327A1

公开(公告)日：2005-02-03

申请号：US10929283

申请日：2004-08-30

申请人： Frank Hall ,  Cary Baerlocher

发明人： Frank Hall ,  Cary Baerlocher

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/34

CPC分类号： H01L24/73 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48644 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85138 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.

摘要翻译： 集成电路封装，其将焊料球焊接在管芯的焊球焊盘和印刷电路板（PCB）的衬底焊盘之间。 焊料球与模具的任何电路（即“虚拟”）焊球电气断开，并且用于临时将模具保持在相对于PCB的位置，直到电路被引线接合，并且底部填充材料在 模具和PCB更加永久地连接在一起。 选择底部填充材料具有基本上等于焊球的CTE的热膨胀系数（CTE），以防止热失配问题。 围绕模具和底部填充材料设置包覆成型化合物并且围绕引线键合以完成包装。 模具上的焊球垫的各种布置包括柱状和行，角，对角，交叉和外围布置。

公开(公告)号：US20060068527A1

公开(公告)日：2006-03-30

申请号：US11280648

申请日：2005-11-16

申请人： Chad Cobbley ,  Cary Baerlocher

发明人： Chad Cobbley ,  Cary Baerlocher

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L23/16 ,  H01L21/565 ,  H01L23/24 ,  H01L23/5387 ,  H01L2924/0002 ,  H01L2924/00

摘要： A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate by a molding technique such as transfer molding, injection molding, and spray molding, or using an encapsulating material. One or more dies, chips, or other semiconductor or microelectronic devices can be disposed on the substrate to form a die assembly. The stiffener can be molded to a substrate comprising one or more dies, over which an encapsulating material can be applied to produce a semiconductor die package.

公开(公告)号：US20050263312A1

公开(公告)日：2005-12-01

申请号：US11180493

申请日：2005-07-13

申请人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

发明人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

IPC分类号： H01G4/00 ,  H01L21/48 ,  H01L23/055 ,  H01L23/28 ,  H01L27/146 ,  H05K5/06

CPC分类号： H01L23/28 ,  B33Y80/00 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/48 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00

摘要： Various embodiments for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.

摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的壳体结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。

公开(公告)号：US20060237844A1

公开(公告)日：2006-10-26

申请号：US11428620

申请日：2006-07-05

申请人： Frank Hall ,  Cary Baerlocher

发明人： Frank Hall ,  Cary Baerlocher

IPC分类号： H01L23/48

CPC分类号： H01L24/73 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/0558 ,  H01L2224/05644 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48644 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85138 ,  H01L2224/92125 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.

摘要翻译： 集成电路封装，其将焊料球焊接在管芯的焊球焊盘和印刷电路板（PCB）的衬底焊盘之间。 焊料球与模具的任何电路（即“虚拟”）焊球电气断开，并且用于临时将模具保持在相对于PCB的位置，直到电路被引线接合，并且底部填充材料在 模具和PCB更加永久地连接在一起。 选择底部填充材料具有基本上等于焊球的CTE的热膨胀系数（CTE），以防止热失配问题。 围绕模具和底部填充材料设置包覆成型化合物并且围绕引线键合以完成包装。 模具上的焊球垫的各种布置包括柱状和行，角，对角，交叉和外围布置。

公开(公告)号：US20060169490A1

公开(公告)日：2006-08-03

申请号：US11366793

申请日：2006-03-02

申请人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

发明人： Todd Bolken ,  Cary Baerlocher ,  Steven Heppler ,  Chad Cobbley

IPC分类号： H01L23/28

CPC分类号： H01L23/28 ,  B33Y80/00 ,  H01L21/4803 ,  H01L21/481 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/48 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00011 ,  H01L2224/45099 ,  H01L2924/00

摘要： Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover.

摘要翻译： 公开了用于防潮图像传感器封装结构和组装方法的模制工具的各种实施例。 本发明的图像传感器封装包括插入件，形成在用于包围图像传感器芯片的插入件上的外壳结构和透明盖。 壳体结构可以覆盖基本上所有的插入器芯片表面。 在另一个实施例中，壳体结构还覆盖基本上所有插入器边缘表面。 壳体结构还可以覆盖基本上所有的插入件附接表面。 图像传感器芯片通过密封的引线接合连接或密封的倒装芯片连接电连接到插入器。 壳体结构可以包括能够同时密封图像传感器封装和透明盖的内部的流道。