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公开(公告)号：US20110220147A1
公开(公告)日：2011-09-15
申请号：US13130183
申请日：2009-11-16
IPC分类号： B08B1/02
摘要： A method of web cleaning, particularly relatively soft polymeric webs, without using dipping baths or ultrasonic energy. The method includes conveying the web against a backup roller and spraying the web with a high pressure liquid while the web is supported by the backup roller. Thereafter, residual fluid from the high pressure stream is stripped from the web by a gas curtain while the web is supported by the backup roller. In many convenient embodiments, the web is contacted with a cleaning roller while the web is in contact with the backup roller.
摘要翻译： 纸幅清洗方法，特别是相对柔软的聚合物网，不使用浸渍浴或超声能量。 该方法包括将纤维网相对于支撑辊输送并且在幅材由支撑辊支撑的同时用高压液体喷涂纸幅。 此后，通过气帘从纸幅中除去来自高压流的残余流体，同时纸幅由支撑辊支撑。 在许多方便的实施例中，当幅材与支撑辊接触时，幅材与清洁辊接触。
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公开(公告)号：US08585826B2
公开(公告)日：2013-11-19
申请号：US13130183
申请日：2009-11-16
摘要： A method of web cleaning, particularly relatively soft polymeric webs, without using dipping baths or ultrasonic energy. The method includes conveying the web against a backup roller and spraying the web with a high pressure liquid while the web is supported by the backup roller. Thereafter, residual fluid from the high pressure stream is stripped from the web by a gas curtain while the web is supported by the backup roller. In many convenient embodiments, the web is contacted with a cleaning roller while the web is in contact with the backup roller.
摘要翻译： 纸幅清洗方法，特别是相对柔软的聚合物网，不使用浸渍浴或超声能量。 该方法包括将纤维网相对于支撑辊输送并且在幅材由支撑辊支撑的同时用高压液体喷涂纸幅。 此后，通过气帘从纸幅中除去来自高压流的残余流体，同时纸幅由支撑辊支撑。 在许多方便的实施例中，当幅材与支撑辊接触时，幅材与清洁辊接触。
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公开(公告)号：US06791036B1
公开(公告)日：2004-09-14
申请号：US09531285
申请日：2000-03-20
申请人： Yu Chen , Joel A. Gerber , Brian E. Schreiber , Joshua W. Smith
发明人： Yu Chen , Joel A. Gerber , Brian E. Schreiber , Joshua W. Smith
IPC分类号： H05K109
CPC分类号： H01L24/12 , H01L23/49827 , H01L2224/1184 , H01L2224/13021 , H01L2224/13022 , H01L2224/13099 , H01L2224/16 , H01L2224/73104 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H05K3/28 , H05K3/4038 , H05K3/4617 , H05K3/4647 , H05K2201/0195 , H05K2201/0305 , H05K2201/0394 , H05K2203/025 , H05K2203/0769 , Y10T29/49126 , Y10T29/49155 , H01L2224/29099 , H01L2924/00
摘要： Methods for producing circuit elements the resultant circuit elements, and methods for making circuits therefrom are disclosed. A precursor circuit element includes a first insulating layer with conductor thereon and an electrically conducting member or bump, protruding from the conductor, that provide a shape to one surface of the precursor circuit element. A second insulating layer, including an adhesive, is placed onto the precursor circuit element and assumes the shape of the aforementioned surface of the precursor circuit element. A portion of the insulating layer is removed proximate the apex of the bump to expose at least a portion of the bump, for a sufficient electrical connection with a subsequent circuit element, while maintaining a sufficient amount of the insulating layer on the first initiating layer and bump to facilitate the mechanical connection (bond) between this resultant circuit element and a second circuit element, that may or may not have been produced by the method of the present invention.
摘要翻译： 公开了用于制造电路元件的方法，所得到的电路元件，以及用于制造电路元件的方法。 前体电路元件包括其上具有导体的第一绝缘层和从导体突出的导电构件或凸块，其向前体电路元件的一个表面提供形状。 包含粘合剂的第二绝缘层被放置在前体电路元件上并呈现前体电路元件的上述表面的形状。 绝缘层的一部分在凸点的顶点附近被去除以暴露凸起的至少一部分，以便与后续电路元件充分的电连接，同时在第一起始层上保持足够量的绝缘层， 碰撞以促进该结果电路元件和第二电路元件之间的机械连接（接合），其可以或可能不是通过本发明的方法产生的。
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公开(公告)号：US6063647A
公开(公告)日：2000-05-16
申请号：US986882
申请日：1997-12-08
申请人： Yu Chen , Joel A. Gerber , Brian E. Schreiber , Joshua W. Smith
发明人： Yu Chen , Joel A. Gerber , Brian E. Schreiber , Joshua W. Smith
IPC分类号： H05K3/32 , H01L21/60 , H01L23/498 , H01L23/52 , H05K3/28 , H05K3/40 , H05K3/46 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/12 , H01L23/49827 , H05K3/4617 , H01L2224/1184 , H01L2224/13021 , H01L2224/13022 , H01L2224/13099 , H01L2224/16 , H01L2224/73104 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H05K2201/0195 , H05K2201/0305 , H05K2201/0394 , H05K2203/025 , H05K2203/0769 , H05K3/28 , H05K3/4038 , H05K3/4647 , Y10T29/49126 , Y10T29/49155
摘要： Methods for producing circuit elements the resultant circuit elements, and methods for making circuits therefrom are disclosed. A precursor circuit element includes a first insulating layer with conductor thereon and an electrically conducting member or bump, protruding from the conductor, that provide a shape to one surface of the precursor circuit element. A second insulating layer, including an adhesive, is placed onto the precursor circuit element and assumes the shape of the aforementioned surface of the precursor circuit element. A portion of the insulating layer is removed proximate the apex of the bump to expose at least a portion of the bump, for a sufficient electrical connection with a subsequent circuit element, while maintaining a sufficient amount of the insulating layer on the first initiating layer and bump to facilitate the mechanical connection (bond) between this resultant circuit element and a second circuit element, that may or may not have been produced by the method of the present invention.
摘要翻译： 公开了用于制造电路元件的方法，所得到的电路元件，以及用于制造电路元件的方法。 前体电路元件包括其上具有导体的第一绝缘层和从导体突出的导电构件或凸块，其向前体电路元件的一个表面提供形状。 包含粘合剂的第二绝缘层被放置在前体电路元件上并呈现前体电路元件的上述表面的形状。 绝缘层的一部分在凸块的顶点附近被去除以露出凸块的至少一部分，以便与后续电路元件充分的电连接，同时在第一起始层上保持足够量的绝缘层， 碰撞以促进该结果电路元件和第二电路元件之间的机械连接（接合），其可以或可能不是通过本发明的方法产生的。
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