公开(公告)号：US5823250A

公开(公告)日：1998-10-20

申请号：US927123

申请日：1997-09-05

申请人： Brian Leslie Barten ,  John Kenneth Spoth

发明人： Brian Leslie Barten ,  John Kenneth Spoth

IPC分类号： F01P11/08 ,  F28F9/02 ,  F28D7/10

CPC分类号： F01P11/08 ,  F28F9/0234 ,  F28F2255/16 ,  Y10S165/916

摘要： A radiator tank is co extruded with an interior chamber, which is subdivided into at least two subchambers by at least one integral dividing web. The web is recessed from one end cap of the tank by a clearance space, but brazed to the other end cap of the tank. An oil inlet opens into one subchamber, remote from the clearance space, and an oil outlet opens into the other subchamber, also remote from the clearance space. Radiator coolant is conventionally fed into the remainder of the tank, sealed from the subchambers, but thermally exposed thereto across a common inner wall. Oil fed into one of the subchambers is forced to follow an efficient, serpentine path that is an integer multiple of the total end to end length of the basic tank, enhancing conduction.

摘要翻译： 散热器箱与内部室共挤出，其通过至少一个整体分隔的网被细分成至少两个子室。 纸幅从罐的一个端盖凹下一个间隙，但钎焊到罐的另一个端盖。 进油口通入一个子舱，远离间隙空间，出油口通向另一个子室，也远离间隙。 散热器冷却剂通常被送入罐的其余部分，与子室密封，但是通过共同的内壁热暴露于其中。 供给到一个子室中的油被迫遵循有效的蛇形路径，其是基本罐的总端到端长度的整数倍，增强了传导。

公开(公告)号：US06749009B2

公开(公告)日：2004-06-15

申请号：US10079197

申请日：2002-02-20

申请人： Brian Leslie Barten

发明人： Brian Leslie Barten

IPC分类号： H05K720

CPC分类号： H01L23/3672 ,  F28F3/025 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for cooling electrical or electronic devices comprises a spreader plate having a top surface and having a bottom surface for attaching to the electronic device. A folded fin formed from a strip of heat conducting material comprising alternating planar portions and curved portions has one edge abutted to the top surface such that the curved portions extend upwardly from the top surface substantially at a right angle.

摘要翻译： 用于冷却电气或电子设备的散热器包括具有顶表面并且具有用于附接到电子设备的底表面的扩展板。 由包括交替的平面部分和弯曲部分的导热材料条形成的折叠翅片具有与顶表面邻接的一个边缘，使得弯曲部分从顶表面基本上以直角向上延伸。

公开(公告)号：US20080301941A1

公开(公告)日：2008-12-11

申请号：US11810662

申请日：2007-06-06

申请人： Russell Charles Anderson, JR. ,  Brian Leslie Barten ,  John Benoit ,  Stephan Michael Vetter

发明人： Russell Charles Anderson, JR. ,  Brian Leslie Barten ,  John Benoit ,  Stephan Michael Vetter

IPC分类号： B21D53/02

CPC分类号： B23P15/26 ,  B23K26/123 ,  B23K26/142 ,  B23K26/144 ,  B23K26/32 ,  B23K26/34 ,  B23K26/364 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K35/007 ,  B23K2101/14 ,  B23K2103/12 ,  B23K2103/50 ,  B23P2700/10 ,  F28F3/048 ,  F28F3/12 ,  H01L21/4878 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： The subject invention provides a method of manufacturing an all-metal cold plate heat exchanger assembly for removing excess heat from a heat generating electronic component. The cold plate assembly includes a base plate having micro-channels and associated micro-fins, a manifold plate having alternating channels, and a manifold cover, wherein the manifold plate cooperates with the micro-channels to form an engineered pathway for coolant flow. This method assures a tight interface sealing between the contact surfaces of the alternating channels of the manifold plate and the coplanar surfaces of the micro-fins that would prevent coolant by-pass flow, but without clogging or jeopardizing the flow through the micro-channels. This method utilizes a layer of recast metallic particulates, which is a natural by-product of laser machining, as a compliant gasket material between the coplanar edges of the alternating channels and the coplanar edges of the micro-fins.

摘要翻译： 本发明提供了制造用于从发热电子部件去除多余热量的全金属冷板式热交换器组件的方法。 冷板组件包括具有微通道和相关联的微型翅片的基板，具有交替通道的歧管板和歧管盖，其中歧管板与微通道协作以形成用于冷却剂流动的工程化路径。 该方法确保在歧管板的交替通道的接触表面与微型翅片的共面表面之间的紧密界面密封，这将阻止冷却剂旁路流动，但是不堵塞或危及通过微通道的流动。 该方法利用重复金属颗粒层，其是激光加工的天然副产物，作为交替通道的共面边缘与微翅片的共面边缘之间的柔性衬垫材料。

公开(公告)号：US20080229580A1

公开(公告)日：2008-09-25

申请号：US11728071

申请日：2007-03-23

申请人： Russell Charles Anderson ,  Brian Leslie Barten ,  John Benoit ,  Stephan Michael Vetter

发明人： Russell Charles Anderson ,  Brian Leslie Barten ,  John Benoit ,  Stephan Michael Vetter

IPC分类号： B21D53/02

CPC分类号： B23K1/0012 ,  B23K2101/14 ,  B23K2101/40 ,  F28F3/025 ,  F28F3/12 ,  F28F9/0246 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

摘要： The invention relates to a method of making a brazed micro-channel cold plate assembly for cooling a heat producing electronic component. The primary components of a cold plate assembly are a base plate, a manifold cover, and inlet/outlet pipes; wherein the individual components are assembled and brazed into an integral unit. The joining surfaces of the individual components have novel features that provide for permanent bonding of the joints by brazing and a hermetic seal along the joint seams. The novel features also forestall excess braze alloy from contaminating the interior surfaces of the assembled cold plate and obstructing the engineered flow channels.

摘要翻译： 本发明涉及一种制造用于冷却发热电子部件的钎焊微通道冷板组件的方法。 冷板组件的主要部件是基板，歧管盖和入口/出口管; 其中各个组件被组装并钎焊成整体单元。 单个部件的接合表面具有新颖的特征，其通过钎焊提供接头的永久粘接和沿着接缝的密封。 新颖的功能还防止过剩的钎焊合金污染组装冷板的内表面并阻塞工程流通道。