公开(公告)号：US08975746B1

公开(公告)日：2015-03-10

申请号：US14031001

申请日：2013-09-18

Applicant: Broadcom Corporation

Inventor： Arun Ramakrishnan ,  Hongyu Li

IPC: H01L23/488 ,  H01L23/50 ,  H01L23/00

CPC classification number: H01L24/14 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/131 ,  H01L2224/14133 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/014 ,  H01L2924/00

Abstract: An integrated circuit package includes a ball arrangement that includes transmitter contact pairs arranged in a first portion of a ball grid array disposed in the integrated circuit package. Each of the transmitter contact pairs include transmitter differential signal contacts. Pairs of the transmitter contact pairs located adjacent to one another are in a staggered arrangement. The ball arrangement also includes receiver contact pairs arranged in a second portion of the ball grid array. Each of the receiver contact pairs include receiver differential signal contacts. Pairs of the receiver contact pairs located adjacent to one another are in a staggered arrangement. The ball arrangement also includes voltage supply contacts arranged at least between every two pairs of the transmitter contact pairs and the receiver contact pairs.

Abstract translation: 集成电路封装包括球装置，其包括布置在设置在集成电路封装中的球栅阵列的第一部分中的发射器触点对。 每个发射器触点对包括发射机差分信号触点。 彼此相邻的发射器触点对的对是交错排列的。 球装置还包括布置在球栅阵列的第二部分中的接收器接触对。 每个接收器触点对包括接收器差分信号触点。 彼此相邻的接收器触点对的对是交错排列的。 球装置还包括至少在每两对发射器触点对和接收器触点对之间布置的电压供应触点。

公开(公告)号：US20170033054A1

公开(公告)日：2017-02-02

申请号：US14820195

申请日：2015-08-06

Applicant: Broadcom Corporation

Inventor： Arun Ramakrishnan

IPC: H01L23/552 ,  H01L23/498

CPC classification number: H01L23/552 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/15311 ,  H01L2924/16251

Abstract: Connection patterns for device packaging allow high density circuitry dies to be assembled into packages of manufacturable size. The connection patterns may be patterns for solder ball arrays or other types of connection mechanisms under a semiconductor package. Despite the increased density of the connection patterns, the connection patterns meet the demanding crosstalk specifications for high speed operation of the high density circuitry.

Abstract translation: 设备封装的连接模式允许将高密度电路管芯组装成可制造尺寸的封装。 连接图案可以是在半导体封装下的焊球阵列或其他类型的连接机构的图案。 尽管连接模式的密度增加，连接模式满足高密度电路的高速操作的苛刻的串扰规范。

公开(公告)号：US09431361B2

公开(公告)日：2016-08-30

申请号：US14611601

申请日：2015-02-02

Applicant: BROADCOM CORPORATION

Inventor： Arun Ramakrishnan ,  Hongyu Li

IPC: H01L23/488 ,  H01L23/50 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L24/14 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/131 ,  H01L2224/14133 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/014 ,  H01L2924/00

Abstract: An integrated circuit package includes a ball arrangement that includes transmitter contact pairs arranged in a first portion of a ball grid array disposed in the integrated circuit package. Each of the transmitter contact pairs include transmitter differential signal contacts. Pairs of the transmitter contact pairs located adjacent to one another are in a staggered arrangement. The ball arrangement also includes receiver contact pairs arranged in a second portion of the ball grid array. Each of the receiver contact pairs include receiver differential signal contacts. Pairs of the receiver contact pairs located adjacent to one another are in a staggered arrangement. The ball arrangement also includes voltage supply contacts arranged at least between every two pairs of the transmitter contact pairs and the receiver contact pairs.