Thin film transistor and method for fabricating the same
    7.
    发明授权
    Thin film transistor and method for fabricating the same 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US07935586B2

    公开(公告)日:2011-05-03

    申请号:US12853263

    申请日:2010-08-09

    IPC分类号: H01L21/84

    摘要: A thin film transistor that has improved characteristics and uniformity is developed by uniformly controlling low concentration of crystallization catalyst and controlling crystallization position so that no seed exists and no grain boundary exists, or one grain boundary exists in a channel layer of the thin film transistor. The thin film transistor includes a substrate; a semiconductor layer pattern which is formed on the substrate, the semiconductor layer pattern having a channel layer of which no seed exists and no gram boundary exists; a gate insulating film formed on the semiconductor layer pattern; and a gate electrode formed on the gate insulating film. A method for fabricating the thin film transistor includes forming an amorphous silicon layer on a substrate; forming a semiconductor layer pattern having a channel layer in which no seed exists and no grain boundary exists by crystallizing and patterning the amorphous silicon layer; forming a gate insulating film on the semiconductor layer pattern; and forming a gate electrode on the gate insulating film.

    摘要翻译: 通过均匀控制结晶催化剂的低浓度和控制结晶位置,使得不存在晶种并且不存在晶界,或者在薄膜晶体管的沟道层中存在一个晶界,开发出具有改善的特性和均匀性的薄膜晶体管。 薄膜晶体管包括基板; 形成在所述基板上的半导体层图案,所述半导体层图案具有不存在种子的沟道层,并且不存在晶界; 形成在半导体层图案上的栅极绝缘膜; 以及形成在栅极绝缘膜上的栅电极。 一种薄膜晶体管的制造方法,包括在基板上形成非晶硅层; 形成具有不存在种子的沟道层的半导体层图案,并且通过对非晶硅层进行结晶和图案化而不存在晶界; 在半导体层图案上形成栅极绝缘膜; 以及在所述栅极绝缘膜上形成栅电极。

    THIN FILM TRANSISTOR AND METHOD FOR FABRICATING THE SAME
    8.
    发明申请
    THIN FILM TRANSISTOR AND METHOD FOR FABRICATING THE SAME 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US20110020990A1

    公开(公告)日:2011-01-27

    申请号:US12853263

    申请日:2010-08-09

    IPC分类号: H01L21/336

    摘要: A thin film transistor that has improved characteristics and uniformity is developed by uniformly controlling low concentration of crystallization catalyst and controlling crystallization position so that no seed exists and no grain boundary exists, or one grain boundary exists in a channel layer of the thin film transistor. The thin film transistor includes a substrate; a semiconductor layer pattern which is formed on the substrate, the semiconductor layer pattern having a channel layer of which no seed exists and no gram boundary exists; a gate insulating film formed on the semiconductor layer pattern; and a gate electrode formed on the gate insulating film. A method for fabricating the thin film transistor includes forming an amorphous silicon layer on a substrate; forming a semiconductor layer pattern having a channel layer in which no seed exists and no grain boundary exists by crystallizing and patterning the amorphous silicon layer; forming a gate insulating film on the semiconductor layer pattern; and forming a gate electrode on the gate insulating film.

    摘要翻译: 通过均匀控制结晶催化剂的低浓度和控制结晶位置,使得不存在晶种并且不存在晶界,或者在薄膜晶体管的沟道层中存在一个晶界,开发出具有改善的特性和均匀性的薄膜晶体管。 薄膜晶体管包括基板; 形成在所述基板上的半导体层图案,所述半导体层图案具有不存在种子的沟道层,并且不存在晶界; 形成在半导体层图案上的栅极绝缘膜; 以及形成在栅极绝缘膜上的栅电极。 一种薄膜晶体管的制造方法,包括在基板上形成非晶硅层; 形成具有不存在种子的沟道层的半导体层图案,并且通过对非晶硅层进行结晶和图案化而不存在晶界; 在半导体层图案上形成栅极绝缘膜; 以及在所述栅极绝缘膜上形成栅电极。

    Thin film transistor and method of fabricating the same
    9.
    发明授权
    Thin film transistor and method of fabricating the same 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US07815734B2

    公开(公告)日:2010-10-19

    申请号:US11457491

    申请日:2006-07-14

    IPC分类号: H01L21/04 C30B25/12

    摘要: Provided are a thin film transistor and method of fabricating the same, in which an amorphous silicon layer is formed on a substrate, a capping layer containing a metal catalyst having a different concentration according to its thickness is formed on the amorphous silicon layer, the capping layer is patterned to form a capping layer pattern, and the amorphous silicon layer is crystallized, such that the density and position of seeds formed at an interface between the amorphous silicon layer and the capping layer pattern is controlled, thereby improving the size and uniformity of grains, and in which polycrystalline silicon of desired size and uniformity is selectively formed at a desired position by one crystallization process, resulting in a thin film transistor having excellent and desired properties.

    摘要翻译: 本发明提供一种薄膜晶体管及其制造方法,其中在基板上形成非晶硅层,在非晶硅层上形成包含不同浓度的金属催化剂的覆盖层 图案化以形成覆盖层图案,并且使非晶硅层结晶化,使得在非晶硅层和覆盖层图案之间的界面处形成的晶种的密度和位置受到控制,从而提高了非晶硅层的尺寸和均匀性 晶粒,并且其中通过一次结晶工艺在期望的位置选择性地形成所需尺寸和均匀性的多晶硅,导致具有优异和期望性能的薄膜晶体管。

    Method of fabricating thin film transistor
    10.
    发明授权
    Method of fabricating thin film transistor 有权
    制造薄膜晶体管的方法

    公开(公告)号:US07795082B2

    公开(公告)日:2010-09-14

    申请号:US11741273

    申请日:2007-04-27

    IPC分类号: H01L21/00

    摘要: A method of fabricating a CMOS thin film transistor includes: providing a substrate; forming an amorphous silicon layer on the substrate; performing a first annealing process on the substrate and crystallizing the amorphous silicon layer into a polysilicon layer; patterning the polysilicon layer to form first and second semiconductor layers; implanting first impurities into the first and second semiconductor layers; implanting second impurities into the first or second semiconductor layer; and performing a second annealing process on the semiconductor layers to remove the metal catalyst remaining in the first or second semiconductor layer, on which the second impurities are implanted, wherein the first impurities are implanted at a dose of 6×1013/cm2 to 5×1015/cm2, and the second impurities are implanted at a dose of 1×1011/cm2 to 3×1015/cm2.

    摘要翻译: 制造CMOS薄膜晶体管的方法包括:提供衬底; 在所述基板上形成非晶硅层; 在所述衬底上进行第一退火处理并将所述非晶硅层结晶成多晶硅层; 图案化多晶硅层以形成第一和第二半导体层; 将第一杂质注入到第一和第二半导体层中; 将第二杂质注入第一或第二半导体层; 以及对所述半导体层进行第二退火处理,以去除留在其中注入所述第二杂质的所述第一或第二半导体层中的金属催化剂,其中所述第一杂质以6×10 13 / cm 2至5× 1015 / cm2,第1杂质以1×10 11 / cm 2的剂量注入3×1015 / cm 2。