公开(公告)号：US09865480B2

公开(公告)日：2018-01-09

申请号：US13699275

申请日：2011-05-11

申请人： Byung-Ju Choi ,  Woo-Jae Jeong ,  Bo-Yun Choi ,  Kwang-Joo Lee ,  Min-Su Jeong

发明人： Byung-Ju Choi ,  Woo-Jae Jeong ,  Bo-Yun Choi ,  Kwang-Joo Lee ,  Min-Su Jeong

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/00 ,  H05K3/34

CPC分类号： H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2924/01012 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09909 ,  H05K2201/10977 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention relates to an under-fill dam with high detection probability that is composed of a dry film solder resist and provided in the form of a fence around a chip device in order to prevent leaks of an under-fill material filled in a gap between a substrate and the chip device.

公开(公告)号：US08334092B2

公开(公告)日：2012-12-18

申请号：US13164302

申请日：2011-06-20

申请人： Bo-Yun Choi ,  Byung-Ju Choi ,  Woo-Jae Jeong ,  Kwang-Joo Lee ,  Min-Su Jeong

发明人： Bo-Yun Choi ,  Byung-Ju Choi ,  Woo-Jae Jeong ,  Kwang-Joo Lee ,  Min-Su Jeong

IPC分类号： C08L63/00 ,  C08G59/00 ,  G03C1/00 ,  G03F7/00

CPC分类号： C08L63/00 ,  C08G59/4021 ,  C08G59/68 ,  G03F7/027

摘要： The present invention relates to a photo-sensitive resin composition having superior heat-resistant and mechanical property, and a protective film for printed circuit board, and particularly provides a photo-sensitive resin composition including an acid-modified oligomer, a photo-polymerizable monomer, a photo-initiator, an epoxy resin, and a butadiene-modified epoxy resin including epoxy group and at least one double bond in the main chain, and a protective film for printed circuit board prepared by using the composition.

摘要翻译： 本发明涉及耐热性和机械性优异的感光性树脂组合物和印刷电路板用保护膜，特别是提供一种感光性树脂组合物，其含有酸改性低聚物，光聚合性单体 ，光引发剂，环氧树脂和主链中包含环氧基和至少一个双键的丁二烯改性环氧树脂，以及通过使用该组合物制备的印刷电路板用保护膜。

公开(公告)号：US20130063917A1

公开(公告)日：2013-03-14

申请号：US13699275

申请日：2011-05-11

申请人： Byung-Ju Choi ,  Woo-Jae Jeong ,  Bo-Yun Choi ,  Kwang-Joo Lee ,  Min-Su Jeong

发明人： Byung-Ju Choi ,  Woo-Jae Jeong ,  Bo-Yun Choi ,  Kwang-Joo Lee ,  Min-Su Jeong

IPC分类号： H05K7/00 ,  H05K7/02 ,  H01L21/56

CPC分类号： H01L21/563 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83104 ,  H01L2224/92125 ,  H01L2924/01012 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/09909 ,  H05K2201/10977 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention relates to an under-fill dam with high detection probability that is composed of a dry film solder resist and provided in the form of a fence around a chip device in order to prevent leaks of an under-fill material filled in a gap between a substrate and the chip device.

摘要翻译： 本发明涉及一种具有高检测概率的欠补水坝，其由干膜阻焊剂组成，并以围绕芯片装置的栅栏形式提供，以防止填充在间隙中的填充不足材料的泄漏 在衬底和芯片器件之间。

公开(公告)号：US08349538B2

公开(公告)日：2013-01-08

申请号：US13180213

申请日：2011-07-11

申请人： Woo-Jae Jeong ,  Byung-Ju Choi ,  Bo-Yun Choi ,  Kwang-Joo Lee ,  Min-Su Jeong

发明人： Woo-Jae Jeong ,  Byung-Ju Choi ,  Bo-Yun Choi ,  Kwang-Joo Lee ,  Min-Su Jeong

IPC分类号： G03F7/00 ,  G03F7/032

CPC分类号： G03F7/027 ,  C08F222/1006 ,  C09D133/14 ,  G03F7/038

摘要： The present invention relates to a photo-curable and thermo-curable resin composition and a dry film solder resist making it possible to provide the dry film solder resist having superior heat-resistance and dimensional stability while exhibiting improved alkali developing properties. The resin composition may comprise an acid-modified oligomer having carboxyl group (—COOH) and photo-curable functional group; a photo-polymerizable monomer comprising a compound having a structure that three or more functional epoxy-acrylate groups are bonded to a heterocyclic structure containing nitrogen, and a functional group having carboxyl group is bonded to at least one epoxy-acrylate group; a thermo-curable binder having thermo-curable functional group; and a photo-initiator.

摘要翻译： 本发明涉及可光固化和热固化的树脂组合物和干膜阻焊剂，使得可以提供具有优异的耐热性和尺寸稳定性的干膜阻焊剂，同时显示出改进的碱显影性能。 树脂组合物可以包含具有羧基（-COOH）和可光固化官能团的酸改性低聚物; 包含具有三个以上官能环氧 - 丙烯酸酯基团与含氮杂环结构键合的化合物的化合物和具有羧基的官能团的光聚合性单体与至少一个环氧丙烯酸酯基团键合; 具有可热固化官能团的热固性粘合剂; 和光引发剂。