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公开(公告)号：US20200224315A1
公开(公告)日：2020-07-16
申请号：US16727390
申请日：2019-12-26
发明人： Masayuki UTSUMI , Masaharu TAKEUCHI
摘要： In a flow down type surface treating apparatus, a scattering amount of a processing solution is reduced.A film forming mechanism 110 is provided on an inlet side and an outlet side of each treatment chamber.The film forming mechanism 110 ejects a continuous laminar liquid under pressure of about 0.01 MPa at a flow rate of 5 to 10 L/min. Such a liquid film prevents droplets reflected on a surface of an antiscattering member 60 from splashing and entering the adjacent treatment chamber. When a plate-like work 10 is shaken to collide with the liquid film, the film flows down along the plate-like work 10 since the film formed by the film forming mechanism 110 is liquid. Thereby, a shake of the plate-like work 10 is converged. An amount of air flowing in toward a transport direction in each treatment chamber is reduced.
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公开(公告)号：US20200224314A1
公开(公告)日：2020-07-16
申请号：US16727302
申请日：2019-12-26
发明人： Masayuki UTSUMI , Masaharu TAKEUCHI
摘要： In a flow down type surface treating apparatus, a scattering amount of a processing solution Q is reduced.A honeycomb member 60 is provided vertically below a transport hanger 16. The honeycomb member 60 consists of a plurality of tubular members with hexagonal holes connected together. When the processing solution Q falls in a vertical direction (in the direction of an arrow α), the processing solution Q passes through through-holes of the honeycomb member 60. When the processing solution Q hits liquid level H, a part of it is reflected. Since a part of the reflected processing solution Q is reflected obliquely, it collides with an inner wall of the through-hole of the honeycomb member 60. As a result, the amount of the treatment liquid Q that emerges again on an upper surface of the through-holes is reduced. Thereby, the honeycomb member 60 exhibits a scattering prevention function.
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公开(公告)号：US20170253975A1
公开(公告)日：2017-09-07
申请号：US15511063
申请日：2015-09-14
CPC分类号： C23C18/52 , C23C2/003 , C23C2/02 , C23C2/04 , C23C18/1603 , C23C18/1605 , C23C18/1619 , C23C18/1633 , C23C18/208 , C23C18/31 , C23C18/36 , C23C18/405 , H05K3/107 , H05K3/187 , H05K3/422
摘要： Disclosed herein is a method for fabricating a wiring board in which a target substrate having via holes and/or trenches is subjected to an electroless plating process while being immersed in an electroless plating solution to fill the via holes and/or the trenches with a plating metal. The method includes the steps of: supplying the electroless plating solution to under the target substrate; diffusing an oxygen-containing gas into the electroless plating solution supplied under the target substrate; and allowing the electroless plating solution to overflow from over the target substrate.
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