公开(公告)号：US20240376328A1

公开(公告)日：2024-11-14

申请号：US18315249

申请日：2023-05-10

Applicant: CANON KABUSHIKI KAISHA

Inventor： Fen WAN ,  Weijun LIU

IPC: C09D11/101 ,  C07C69/604 ,  C07D239/04 ,  C07D249/16

Abstract: A photocurable composition can comprising a polymerizable material, a hindered stabilizer, and a photoinitiator, wherein the polymerizable material comprises at least one multi-functional aromatic vinyl monomer; and the hindered stabilizer is a hindered amine of formula (1) or a hindered phenol of formula (2) wherein X is H, CH3, or Y—Z; Y is CH2, O, S, or N; Z is an organic substituent; R1 is H, CH3, OH, OR5, CO—CH3, or C(═O)R5; R2, R3, R4, R5 is an organic substituent.

公开(公告)号：US20250043138A1

公开(公告)日：2025-02-06

申请号：US18911782

申请日：2024-10-10

Applicant: CANON KABUSHIKI KAISHA

Inventor： YUTO ITO ,  TOSHIKI ITO ,  ISAO KAWATA ,  Fen WAN ,  Timothy STACHOWIAK ,  Weijun LIU

IPC: C09D11/30 ,  B29C59/00 ,  B29C59/02 ,  B29K25/00 ,  B41J3/407 ,  C08F112/32 ,  C08F112/34 ,  C09D11/108 ,  C09D125/02

Abstract: A curable composition containing a polymerizable compound (a), a photopolymerization initiator (b), and a solvent (c), wherein the curable composition has viscosity of not less than 2 mPas and not more than 60 mPa·s at 23° C., a content of the solvent (d) with respect to the whole curable composition is not less than 5 vol % and not more than 95 vol %, a boiling point of the solvent (d) at normal pressure is less than 250° C., and the polymerizable compound (a) contains a compound (a-1) containing not less than one aromatic ring or aromatic heterocycle, and not less than four vinyl groups directly bonding to the aromatic ring or the aromatic heterocycle.

公开(公告)号：US20240191088A1

公开(公告)日：2024-06-13

申请号：US17991098

申请日：2022-11-21

Applicant: CANON KABUSHIKI KAISHA

Inventor： Yuto ITO ,  Toshiki ITO ,  Isao KAWATA ,  Fen WAN ,  Timothy STACHOWIAK ,  Weijun LIU

IPC: C09D11/30 ,  B29C59/00 ,  B29C59/02 ,  B41J3/407 ,  C08F112/34 ,  C09D11/108

CPC classification number: C09D11/30 ,  B29C59/005 ,  B29C59/026 ,  B41J3/407 ,  C08F112/34 ,  C09D11/108 ,  B29K2025/00

Abstract: A curable composition containing a polymerizable compound (a), a photopolymerization initiator (b), and a solvent (c), wherein the curable composition has viscosity of not less than 2 mPa·s and not more than 60 mPa·s at 23° C., a content of the solvent (d) with respect to the whole curable composition is not less than 5 vol % and not more than 95 vol %, a boiling point of the solvent (d) at normal pressure is less than 250° C., and the polymerizable compound (a) contains a compound (a-1) containing not less than one aromatic ring or aromatic heterocycle, and not less than four vinyl groups directly bonding to the aromatic ring or the aromatic heterocycle.

公开(公告)号：US20230257496A1

公开(公告)日：2023-08-17

申请号：US17650676

申请日：2022-02-11

Applicant: CANON KABUSHIKI KAISHA

Inventor： Timothy Brian STACHOWIAK ,  Fen WAN ,  Weijun LIU

IPC: C08F120/18 ,  G03F7/028 ,  C09D11/101 ,  C09D11/38

CPC classification number: C08F120/18 ,  G03F7/028 ,  C09D11/101 ,  C09D11/38

Abstract: A photocurable composition can comprise a polymerizable material, at least one non-reactive polymer, and a photoinitiator, wherein the non-reactive polymer can have a carbon content of at least 80% based on the total weight of the non-reactive polymer; a molecular weight of the at least one non-reactive polymer can be at least 750 g/mol and not greater than 20,000 g/mol; an amount of the non-reactive polymer may be at least 10 wt % and not greater than 30 wt %; and a viscosity of the photocurable composition may be not greater than 110 mPa·s. The photocurable composition may have a low linear shrinkage after curing, a high carbon content and high etch resistance and being suitable for AIP or NIL processing.

公开(公告)号：US20220185914A1

公开(公告)日：2022-06-16

申请号：US17122056

申请日：2020-12-15

Applicant: CANON KABUSHIKI KAISHA

Inventor： Fen WAN ,  Weijun LIU ,  Fei LI ,  Timothy Brian STACHOWIAK

IPC: C08F2/50 ,  C08F212/08 ,  B05D3/06 ,  C08F222/10 ,  B32B27/26 ,  B32B27/30

Abstract: A photocurable composition can comprise a polymerizable material and a photo-initiator, wherein the polymerizable material can comprise at least one multi-functional vinylbenzene in an amount of 15 wt % to 85 wt % and at least one multi-functional acrylate monomer in an amount of 15 wt % to 85 wt % based on the total weight of the photocurable composition. A photo-cured layer of the photocurable composition can have a high heat stability up to 400° C. and a glass transition temperature of at least 135° C.

公开(公告)号：US20240199816A1

公开(公告)日：2024-06-20

申请号：US18062374

申请日：2022-12-06

Applicant: CANON KABUSHIKI KAISHA

Inventor： Fen WAN ,  Weijun Liu

IPC: C08G77/22 ,  C08G77/18 ,  C09D183/08

CPC classification number: C08G77/22 ,  C08G77/18 ,  C09D183/08

Abstract: A photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material may comprise at least one silicon-containing monomer having a structure of formula (1)




with R1, R2: —O—Si(CH3)3, alkyl, aryl, or alkylaryl; R3, R4: —O—Si(CH3)3, alkyl, aryl, or alkylaryl; R5: C1-C5-alkyl, aryl, alkylaryl; R6: -R5-X, or X, or —O—Si(CH3)3, or alkyl, or aryl, or alkylaryl; X: acrylate or methacrylate; and n: 0-4. The amount of silicon (Si) in the photocurable composition can be at least 15 wt % based on the total weight of the photocurable composition.

公开(公告)号：US20230257617A1

公开(公告)日：2023-08-17

申请号：US17651544

申请日：2022-02-17

Applicant: CANON KABUSHIKI KAISHA

Inventor： Fen WAN ,  Timothy Brian STACHOWIAK ,  Weijun LIU

IPC: C09D133/08 ,  C09D11/00 ,  G03F7/20 ,  G03F7/004

CPC classification number: C09D133/08 ,  C09D11/00 ,  G03F7/2004 ,  G03F7/0045

Abstract: A photocurable composition can comprise a polymerizable material, and a photoinitiator, wherein the polymerizable material can comprise at least one polymerizable monomer and at least one reactive polymer. The reactive polymer can have a carbon content of at least 75% based on the total weight of the reactive polymer; a molecular weight of the at least one reactive polymer can be at least 400 g/mol and not greater than 50,000 g/mol; an amount of the reactive polymer may be at least 5 wt %; and a viscosity of the photocurable composition may be not greater than 100 mPa·s. The photocurable composition may have a low linear shrinkage after curing, a high carbon content and high etch resistance and being suitable for AIP or NIL processing.

公开(公告)号：US20220363807A1

公开(公告)日：2022-11-17

申请号：US17244508

申请日：2021-04-29

Applicant: CANON KABUSHIKI KAISHA

Inventor： Fen WAN ,  Weijun LIU

IPC: C08G18/71 ,  C08G18/67 ,  C08K5/5397 ,  G03F7/028 ,  G03F7/20

Abstract: In one embodiment, a photocurable composition can comprise a polymerizable material and a photoinitiator, wherein the polymerizable material includes an isocyanate group containing compound of formula (1): R1-R2-N═C═O (1), with R1 including a carbon-carbon double bond, and R2 being substituted or unsubstituted alkyl, aryl, or alkylaryl. An amount of 1 wt % to 10 wt % of the isocyanate group containing compound can cause a strong adhesion strength of the photocurable composition to a silicon substrate after curing, and may allow the omission of an adhesion layer between substrate and the photo-cured layer.

公开(公告)号：US20220098345A1

公开(公告)日：2022-03-31

申请号：US17038491

申请日：2020-09-30

Applicant: CANON KABUSHIKI KAISHA

Inventor： Fen WAN ,  Weijun LIU ,  Gary F. DOYLE

IPC: C08F222/10 ,  C08F220/18 ,  C08F236/20 ,  C08F236/22 ,  C08F2/50 ,  G03F7/00

Abstract: A curable composition can comprise a polymerizable material including a monomer of Formula (1), with R being H or alkyl or alkylaryl, n being 1-4, m being 0-6, X1 being C1-C6 substituted or unsubstituted alkyl, X2 being CH3 or H, After forming a cured layer of the curable composition, the cured layer can have an excellent etch resistance.

公开(公告)号：US20210305082A1

公开(公告)日：2021-09-30

申请号：US16834465

申请日：2020-03-30

Applicant: CANON KABUSHIKI KAISHA

Inventor： Fen WAN ,  Weijun LIU

IPC: H01L21/687 ,  H01L21/768 ,  H01L21/02

Abstract: A superstrate can comprise a superstrate blank and a coating overlying an outer surface of the superstrate blank. The superstrate blank can comprises a central region and a tapered edge region, wherein the tapered edge region has an average taper angle of not greater than 20 degrees relative to a length direction of the superstrate blank. In one embodiment, the coating of the superstrate can be applied by spin coating and may have an edge bead below a plane of the coating surface within the central region.