LIQUID EJECTION HEAD AND LIQUID EJECTION APPARATUS

    公开(公告)号:US20220339935A1

    公开(公告)日:2022-10-27

    申请号:US17726849

    申请日:2022-04-22

    IPC分类号: B41J2/14 B41J2/165

    摘要: A liquid ejection head 3 includes: a liquid ejection part 3a configured to eject a liquid; and a guide part 20b provided upstream of the liquid ejection part 3a with respect to a conveying direction A of a recording medium 2 and configured to guide the front end of a recording medium 2 conveyed to the liquid ejection part 3a. The guide part 20b has an inclined surface 20c inclined so as to be more spaced apart from a conveyance path for the recording medium 2 as the inclined surface 20c is more distant from the liquid ejection part 3a.

    Inkjet printing apparatus
    2.
    发明授权

    公开(公告)号:US10994542B2

    公开(公告)日:2021-05-04

    申请号:US16531765

    申请日:2019-08-05

    IPC分类号: B41J2/165

    摘要: An inkjet printing apparatus includes a print head, to which a protective member configured to protect an ejection opening surface is attachable, and a head holder configured to hold the print head detachably. The inkjet printing apparatus further includes a guide portion provided in the head holder and configured to guide, in a width direction, the print head with the ejection opening surface protected by the protective member. The guide portion guides the print head with the protective member attached up to a predetermined position in the width direction and guides only the print head ahead of the predetermined position to prevent the protective member from exceeding the predetermined position.

    Liquid ejection head
    3.
    发明授权

    公开(公告)号:US10654269B2

    公开(公告)日:2020-05-19

    申请号:US16006297

    申请日:2018-06-12

    IPC分类号: B41J2/14 B41J2/155

    摘要: A liquid ejection head includes an element substrate including an energy-generating element that applies ejection energy to liquid, a first electric wiring board electrically connected to the element substrate, and a second electric wiring board on which an integrated circuit element is mounted and which is electrically connected to the first electric wiring board. An electric signal is supplied to the integrated circuit element mounted on the second electric wiring board through the first electric wiring board, processed by the integrated circuit element, and supplied to the energy-generating element through the second electric wiring board and the first electric wiring board.

    Liquid ejection head
    4.
    发明授权

    公开(公告)号:US10391767B2

    公开(公告)日:2019-08-27

    申请号:US16027694

    申请日:2018-07-05

    IPC分类号: B41J2/14

    摘要: A page-wide type liquid ejection head includes a plurality of recording element substrates, each having an ejection port array including a plurality of ejection ports, each ejection port communicating with a pressure chamber including therein a recording element, and a liquid supply path for supplying a liquid to the pressure chamber. The liquid ejection head also includes a flow path member mounting the recording element substrates arranged thereon. The flow path member includes common supply flow paths and individual supply flow paths that connect the liquid supply path to the common supply flow paths, and the individual supply flow paths include portions running obliquely to the direction orthogonal to the longitudinal direction of the liquid ejection head.

    LIQUID EJECTING HEAD
    6.
    发明申请

    公开(公告)号:US20180304620A1

    公开(公告)日:2018-10-25

    申请号:US15957593

    申请日:2018-04-19

    IPC分类号: B41J2/045 B41J2/155

    摘要: A liquid ejecting head including a print element substrate including an ejection opening for ejecting a liquid, a wiring member including wiring electrically connected to the print element substrate, a connection electrically connecting the print element substrate to the wiring member, a support member supporting the wiring member, a sealing material sealing the connection, and a cover member provided on the support member. In the liquid ejecting head, the wiring member is a strip-shaped member, and a portion of the wiring member provided on a surface of the support member that supports the wiring member is covered by the sealing material and the cover member.