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1.发明申请公开(公告)号：US20080283222A1
公开(公告)日：2008-11-20
申请号：US11762996
申请日：2007-06-14
IPC分类号： F28D15/04
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation apparatus includes a heat sink (30) and a heat spreader (10). The heat spreader includes a heating area (11) and a cooling area (13), and defines a vapor chamber (16) therein. A plurality of artery meshes (151) are arranged in the vapor chamber and extend from the heating area towards the cooling area. A working medium is contained in the artery meshes. The artery meshes are located between wick structures (15a, 15b) attached to a top cover (14) and a base plate (12) of the heat spreader, respectively, and contact therewith.
摘要翻译： 散热装置包括散热器（30）和散热器（10）。 散热器包括加热区域（11）和冷却区域（13），并在其中限定蒸气室（16）。 多个动脉网（151）布置在蒸气室中并且从加热区域延伸到冷却区域。 工作介质包含在动脉网中。 动脉网分别位于附接到散热器的顶盖（14）和底板（12）的芯结构（15a，15b）之间，并与之接触。
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公开(公告)号：US20090020268A1
公开(公告)日：2009-01-22
申请号：US11857407
申请日：2007-09-18
CPC分类号： F28D15/046 , B23P15/26 , B23P2700/09 , Y10T29/49
摘要： A heat pipe (10) includes a casing (11) and a composite wick structure (14). The casing includes an evaporator section (15) and a condenser section (16). The wick structure includes a plurality of grooves (142, 143) and an artery mesh (145). The grooves at the evaporator section each have a smaller groove width and a smaller apex angle (A1) than those of each of the grooves at the condenser section. A method for manufacturing the heat pipe includes: providing a casing with a plurality of grooves axially defined therein; shrinking a diameter of one portion of the casing to obtain an evaporator section of the heat pipe; placing an artery mesh to contact with an inner wall of the casing; vacuuming the casing and placing a working fluid in the casing; sealing the casing to obtain the heat pipe.
摘要翻译： 热管（10）包括壳体（11）和复合芯模结构（14）。 壳体包括蒸发器部分（15）和冷凝器部分（16）。 芯结构包括多个凹槽（142,143）和动脉网（145）。 蒸发器部分的凹槽各自具有比冷凝器部分的每个凹槽更小的凹槽宽度和更小的顶角（A1）。 一种用于制造热管的方法包括：为壳体提供轴向限定的多个槽; 收缩壳体的一部分的直径以获得热管的蒸发器部分; 放置动脉网与壳体的内壁接触; 抽吸套管并将工作流体放置在套管中; 密封套管获得热管。
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公开(公告)号：US20080117637A1
公开(公告)日：2008-05-22
申请号：US11684461
申请日：2007-03-09
IPC分类号： F28F1/10
CPC分类号： F28D15/0266 , F21K9/00 , F21V7/22 , F21V29/505 , F21V29/51 , F21V29/717 , F21V29/74 , F21V29/763 , F21V29/773 , F21Y2105/10 , F21Y2115/10 , F28D15/0275 , Y10S362/80
摘要： An LED lamp cooling apparatus (10) includes a substrate (11), a plurality of LEDs (13) electrically connected with the substrate, a heat sink (19) for dissipation of heat generated by the LEDs and a pulsating heat pipe (15) thermally connected with the heat sink. The pulsating heat pipe includes a plurality of heat receiving portions (154) and a plurality of heat radiating portions (155), and contains a working fluid (153) therein. The substrate is attached to the heat receiving portions of the pulsating heat pipe and the heat sink is attached to the heat radiating portions of the pulsating heat pipe. The heat generated by the LEDs is transferred from the heat receiving portions to the heat radiating portions of the pulsating heat pipe through pulsation or oscillation of the working fluid in the pulsating heat pipe.
摘要翻译： 一种LED灯冷却装置（10），包括基板（11），与基板电连接的多个LED（13），散热器（19），用于散发由LED产生的热量和脉动热管（15） 与散热片热连接。 脉动热管包括多个热接收部分（154）和多个热辐射部分（155），并且其中包含工作流体（153）。 衬底附接到脉动热管的受热部分，并且散热器附接到脉动热管的散热部分。 LED产生的热量通过脉动热管中的工作流体的脉动或振荡从受热部转移到脉动热管的散热部。
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公开(公告)号：US20090020269A1
公开(公告)日：2009-01-22
申请号：US11858080
申请日：2007-09-19
IPC分类号： F28D15/00
CPC分类号： F28D15/046
摘要： A heat pipe (10) includes a metal casing (12) having an evaporator section (121) and a condenser section (122). A major wick structure (14) is disposed on an inner wall of the casing. At least one assistant wick structure (16) is disposed in and contacts with the major wick structure, and working medium fills in the casing and saturates the major wick structure and the at least one assistant wick structure. An average pore size of the major wick structure corresponding to the evaporator section is smaller than that of the major wick structure corresponding to the condenser section. A diameter of a cross section of the at least one assistant wick structure is smaller than a diameter of a cross section of the major wick structure, and thus the at least one assistant wick structure has a linear contact with the major wick structure.
摘要翻译： 热管（10）包括具有蒸发器部分（121）和冷凝器部分（122）的金属壳体（12）。 主油芯结构（14）设置在壳体的内壁上。 至少一个辅助灯芯结构（16）设置在主芯结构中并与主芯结构接触，工作介质填充壳体并使主芯结构和至少一个辅助灯芯结构饱和。 对应于蒸发器部分的主要油芯结构的平均孔径小于对应于冷凝段的主油芯结构的平均孔径。 所述至少一个辅助灯芯结构的横截面的直径小于所述主芯结构的横截面的直径，因此所述至少一个辅助灯芯结构与所述主灯芯结构具有线性接触。
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公开(公告)号：US20080078530A1
公开(公告)日：2008-04-03
申请号：US11309808
申请日：2006-10-02
CPC分类号： F28D15/043 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A loop heat pipe (10) includes an evaporator (11) thermally connected with a heat generating electronic component and including a wick structure (112) disposed therein, a condenser (12) thermally connected with a heat dissipating component, a vapor line (13) and a liquid line (14) connecting the evaporator with the condenser to form a closed loop, a predetermined quantity of bi-phase working medium contained in the closed loop, and an artery mesh (15) located within the liquid line.
摘要翻译： 回路热管（10）包括与发热电子部件热连接且包括设置在其中的芯结构（112）的蒸发器（11），与散热部件热连接的冷凝器（12），蒸汽管线 ）和将蒸发器与冷凝器连接以形成闭环的液体管线（14），包含在闭环中的预定量的双相工作介质和位于液体管线内的动脉网（15）。
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公开(公告)号：US20110048683A1
公开(公告)日：2011-03-03
申请号：US12940043
申请日：2010-11-04
IPC分类号： F28D15/04
CPC分类号： F28D15/046 , H01L2924/0002 , H01L2924/00
摘要： An exemplary heat pipe includes an elongated casing, a wick, an artery mesh, and working medium filled in the casing. The casing includes an evaporating section and a condensing section. The wick is disposed within an inner wall of the evaporating section of the casing. The artery mesh includes a large portion, and a small portion with an outer diameter smaller than that of the large portion. The small portion is located within and in direct physical contact with an inner surface of the wick. The large portion is in direct physical contact with an inner wall of the condensing section of the casing. The working medium saturates the wick and the artery mesh.
摘要翻译： 示例性的热管包括细长的壳体，芯，动脉网和填充在壳体中的工作介质。 壳体包括蒸发部分和冷凝部分。 灯芯设置在壳体的蒸发部分的内壁内。 动脉网包括大部分，外径小于大部分的小部分。 小部分位于与芯的内表面直接物理接触处。 大部分与壳体的冷凝部分的内壁直接物理接触。 工作介质饱和灯芯和动脉网。
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公开(公告)号：US20090084526A1
公开(公告)日：2009-04-02
申请号：US11959291
申请日：2007-12-18
IPC分类号： F28D15/04
CPC分类号： F28D15/046 , H01L2924/0002 , H01L2924/00
摘要： A heat pipe includes an elongated casing (10), a wick (13), at least one artery mesh (12), and working medium filling in the casing. The casing has an evaporating section (101) and a condensing section (102). The wick is disposed on an inner wall of the evaporating section. The at least one artery mesh includes a large portion (121) and a small portion (122) with an outer diameter smaller than that of the large portion. The small portion is located within and contacts with the wick, and the large portion contacts with the inner wall of the condensing section of the casing. The working medium saturates the wick and the at least one artery mesh.
摘要翻译： 热管包括细长的壳体（10），芯（13），至少一个动脉网（12）和填充在壳体中的工作介质。 壳体具有蒸发部（101）和冷凝部（102）。 灯芯设置在蒸发部分的内壁上。 所述至少一个动脉网包括外径小于大部分的大部分（121）和小部分（122）。 小部分位于油缸内并与油缸接触，大部分与壳体的冷凝部分的内壁接触。 工作介质使油绳和至少一个动脉网络饱和。
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8.发明申请HEAT PIPE WITH VARIABLE GROOVED-WICK STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 审中-公开具有可变的瓦砾结构的热管及其制造方法公开(公告)号：US20080105406A1
公开(公告)日：2008-05-08
申请号：US11556613
申请日：2006-11-03
IPC分类号： F28D15/00
CPC分类号： F28D15/046 , B23P15/26 , B23P2700/09 , F28D15/0283
摘要： A heat pipe (10) includes a casing (11), a plurality of grooves (12, 13) defined in the casing, and working fluid contained in the casing. The casing includes a first portion (14) and a second portion (15) having a smaller diameter than the first portion. The grooves (12) at the first portion of the casing have greater apex angles and smaller groove width than those of the grooves (13) at the second portion. A method for manufacturing the heat pipe includes the steps of: providing a casing with a plurality of grooves defined in an inner wall thereof; shrinking a diameter of one portion of the casing to enable the portion to function as an evaporator section of the heat pipe; vacuuming and placing a predetermined quantity of working fluid in the casing; sealing the casing to obtain the heat pipe.
摘要翻译： 热管（10）包括壳体（11），限定在壳体中的多个凹槽（12,13）和容纳在壳体中的工作流体。 壳体包括具有比第一部分更小的直径的第一部分（14）和第二部分（15）。 在壳体的第一部分处的凹槽（12）具有比第二部分处的凹槽（13）更大的顶角和更小的凹槽宽度。 制造该热管的方法包括以下步骤：为壳体提供限定在其内壁上的多个凹槽; 收缩壳体的一部分的直径以使得该部分能够用作热管的蒸发器部分; 将预定量的工作流体抽吸并放置在壳体中; 密封套管获得热管。
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公开(公告)号：US20080174963A1
公开(公告)日：2008-07-24
申请号：US11752909
申请日：2007-05-23
IPC分类号： H05K7/20
CPC分类号： F28D15/0233 , F28D15/046 , H01L23/373 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat spreader includes a bottom wall (12) and a cover (14) hermetically connected to the bottom wall. Cooperatively the bottom wall and the cover define a space (11) therebetween for receiving a working fluid therein. A wick structure (15) is received in the space and thermally interconnects the bottom wall and the cover. The wick structure includes at least a carbon nanotube array, which can conduct heat from the bottom wall to the cover and draw condensed liquid of the working fluid from the cover toward the bottom wall.
摘要翻译： 散热器包括底壁（12）和与底壁密封连接的盖（14）。 合体地，底壁和盖在其间限定了用于在其中接收工作流体的空间（11）。 芯结构（15）被容纳在该空间中并使底壁和盖互相热连接。 芯结构至少包括碳纳米管阵列，其可以将热量从底壁传导到盖子，并将工作流体的冷凝液体从盖子向底壁拉出。
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公开(公告)号：US20080144319A1
公开(公告)日：2008-06-19
申请号：US11627601
申请日：2007-01-26
IPC分类号： F21V29/02
CPC分类号： F21V29/51 , B82Y10/00 , F21V29/004 , F21V29/74 , F21V29/75 , F21V29/763 , F21V29/767 , F21V29/773 , F21V29/777 , F21V29/89 , F21Y2115/10 , F28D15/0233 , F28D15/0275 , F28D15/046 , H01L2924/0002 , H05K1/0206 , H05K2201/0257 , H05K2201/026 , H05K2201/0323 , H05K2201/10106 , H01L2924/00
摘要： A light-emitting diode (LED) assembly includes a circuit board (10), at least one LED (20) being electrically connected with and being arranged on a side of the circuit board, and a heat dissipation apparatus (40) being arranged on an opposite side of the circuit board. The circuit board defines at least one through hole (102) corresponding to a position of the at least one LED. Thermal interface material (140) is filled in the at least one hole of the circuit board to thermally interconnect the at least one LED and the heat dissipation apparatus. The thermal interface material is a composition of nano-material and macromolecular material.
摘要翻译： 发光二极管（LED）组件包括电路板（10），至少一个LED（20）与电路板的一侧电连接并布置在电路板的一侧;散热装置（40） 电路板的相对侧。 电路板限定对应于至少一个LED的位置的至少一个通孔（102）。 热界面材料（140）填充在电路板的至少一个孔中，以热连接至少一个LED和散热装置。 热界面材料是纳米材料和大分子材料的组成。
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