摘要:
An LED lamp construction with integral appearance includes an outer shell unit, a conductive retaining unit, a light-emitting module, a circuit unit and a heat-dissipating unit. The outer shell unit has an integral shell body and a receiving space formed in the shell body. The conductive retaining unit is disposed on a bottom side of the shell body. The light-emitting module is disposed on a top side of the shell body. The circuit unit is received in the receiving space and electrically connected between the light-emitting module and the conductive retaining unit. The heat-dissipating unit is disposed on a bottom side of the light-emitting module. Hence, the manufacturing cost is decreased and the manufacturing method is simple in the present invention due to the integral appearance of the present invention.
摘要:
An LED package structure with concave area for positioning heat-conducting substance includes a substrate unit, a heat-conducting adhesive unit, a light-emitting unit, a conductive unit and a package unit. The substrate unit has a substrate body, a concave space formed on the substrate body, and a plurality of positive and negative pads exposed on the substrate body. The heat-conducting adhesive unit has a heat-conducting adhesive layer positioned in the concave space. The light-emitting unit has a plurality of LED chips disposed on the heat-conducting adhesive layer and received in the concave space. The conductive unit has a plurality of wires. Each LED chip is electrically connected between each positive pad and each negative pad. The package unit has a translucent package resin body disposed on the substrate body in order to cover the LED chips and the wires.
摘要:
An LED package structure for increasing light-emitting efficiency and controlling light-projecting angle includes a substrate unit, a light-emitting unit, a light-reflecting unit and a package unit. The substrate unit has a substrate body and a chip-placing area disposed on a top surface of the substrate body. The light-emitting unit has a plurality of LED chips electrically disposed on the chip-placing area. The light-reflecting unit has an annular reflecting resin body surroundingly formed on the top surface of the substrate body by coating. The annular reflecting resin body surrounds the LED chips that are disposed on the chip-placing area to form a resin position limiting space above the chip-placing area. The package unit has a translucent package resin body disposed on the top surface of the substrate body in order to cover the LED chips. The position of the translucent package resin body is limited in the resin position limiting space.
摘要:
An illuminating apparatus adapted to receive an input power which is a pulse DC includes a lighting unit, a detecting unit and a controlling unit. The lighting unit includes a plurality of lighting sets and a switching unit. The switching unit may be used to cause the lighting sets interconnected in a serial fashion and/or in a parallel manner. The detecting unit detects a state of the input power. The control unit couples the detecting unit and the lighting unit, and controls the switching unit according to the detecting unit detecting the state of the input power. As such, the turn-on voltages of the lighting unit may adjust at different stages of the input power.
摘要:
An illuminating apparatus is disclosed. The illuminating apparatus includes a detecting unit, an illuminating unit, and a control unit. The illuminating unit includes multiple illuminating sets and a switching unit for adjusting a connection relationship among the illuminating sets to ensure a conducting voltage of the illuminating set to swing between a minimum conducting voltage and a maximum conducting voltage. The detecting unit is for detecting an inputted power source received by the illuminating unit. The control unit based on a detected inputted power source controls an operation of the switching unit for extending a conducting time in a single period of the inputted power source.
摘要:
A light-emitting module includes a heat-dissipating structure, a multichip package structure and a protection cover structure. The multichip package structure is disposed on the heat-dissipating structure, and the multichip package structure includes a substrate unit, a light-emitting unit, a frame unit and a package unit. The protection cover structure is disposed on the heat-dissipating structure to cover and protect the multichip package structure, and the protection cover structure has an opening for exposing the package unit.
摘要:
A method of manufacturing a multichip package structure includes: providing a substrate body; placing a plurality of light-emitting chips on the substrate body, where the light-emitting chips are electrically connected to the substrate body; surroundingly forming surrounding liquid colloid on the substrate body to surround the light-emitting chips; naturally drying an outer layer of the surrounding liquid colloid at a predetermined room temperature to form a semidrying surrounding light-reflecting frame, where the semidrying surrounding light-reflecting frame has a non-drying surrounding colloid body disposed on the substrate body and a dried surrounding colloid body totally covering the non-drying surrounding colloid body; and then forming a package colloid body on the substrate body to cover the light-emitting chips, where the semidrying surrounding light-reflecting frame contacts and surrounds the package colloid body.
摘要:
A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a package unit, and a frame unit. The substrate unit includes a substrate body. The light-emitting unit includes a plurality of first and second light-emitting groups. The first and the second light-emitting groups are disposed on the substrate body and electrically connected to the substrate body in series. Each first light-emitting group includes a plurality of first parallel connection units electrically connected in parallel, and each first parallel connection unit includes at least one blue LED chip, and each second light-emitting group includes at least one red LED chip. The package unit includes a phosphor resin body disposed on the substrate body to cover the first and the second light-emitting groups. The frame unit includes a surrounding light-reflecting frame surrounding the first and the second light-emitting groups and the phosphor resin body.
摘要:
An illuminating apparatus is disclosed. The illuminating apparatus includes a detecting unit, an illuminating unit, and a control unit. The illuminating unit includes multiple illuminating sets and a switching unit for adjusting a connection relationship among the illuminating sets. The detecting unit is for detecting an inputted power supply received by the illuminating unit while the control unit is coupled to the detecting unit and the switching unit. The control unit based on a detected inputted power supply controls the switching unit according to a predetermined setting parameter, so as to ensure a conducting voltage of the illuminating unit to vary according to a variation in the inputted power supply.
摘要:
An illumination device for enhancing plant growth includes a substrate unit, a light-emitting unit, a current-limiting unit, and a control unit. The substrate unit includes a substrate body. The light-emitting unit, the current-limiting unit, and the control unit are disposed on the substrate body. The light-emitting unit includes a first light-emitting module, a second light-emitting module, and a third light-emitting module. The current-limiting unit includes a first current-limiting chip electrically connected to the first light-emitting module, a second current-limiting chip electrically connected to the second light-emitting module, and a third current-limiting chip electrically connected to the third light-emitting module. The control unit includes a first PWM control module electrically connected to the first current-limiting chip, a second PWM control module electrically connected to the second current-limiting chip, and a third PWM control module electrically connected to the third current-limiting chip.