公开(公告)号：US20110279139A1

公开(公告)日：2011-11-17

申请号：US13105321

申请日：2011-05-11

申请人： CHOON LEONG LOU ,  CHIH KUN CHEN

发明人： CHOON LEONG LOU ,  CHIH KUN CHEN

IPC分类号： G01R31/00

CPC分类号： G01R1/06772 ,  G01R1/06727 ,  G01R1/07342

摘要： A probe card includes a circuit board, a flexible substrate, and a plurality of probes. The flexible substrate includes a plurality of arrayed conductive strips. The plurality of conductive strips is electrically connected to the printed circuit board. The plurality of probes is fixed to the printed circuit board, and the end of each probe is attached to one corresponding conductive strip.

摘要翻译： 探针卡包括电路板，柔性基板和多个探针。 柔性基板包括多个排列的导电条。 多个导电带电连接到印刷电路板。 多个探针固定在印刷电路板上，每个探针的端部连接到一个对应的导电条上。

公开(公告)号：US20100134130A1

公开(公告)日：2010-06-03

申请号：US12697508

申请日：2010-02-01

申请人： CHOON LEONG LOU ,  LI MIN WANG

发明人： CHOON LEONG LOU ,  LI MIN WANG

IPC分类号： G01R31/02

CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2874

摘要： A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card.

摘要翻译： 用于集成电路装置的探测装置包括探针卡，用于保持探针卡的探针支架，测试头和温度调节机构。 探针卡包括至少一个能够与集成电路装置形成与探针卡的第一表面电连接的探针，并且温度调节机构可位于探针卡的第二表面上/上。 温度调节机构可位于探针卡内，探头支架内或探头支架上。 测试头包括多个引脚，其被配置为与探针卡的连接部位和测试和测量单元和设备形成电连接。 温度调节机构可以位于测试头的内部或内部。 温度调节机构包括具有至少一个入口和多个出口的流动管线，并且出口可以定位在探针卡的第二表面上。

公开(公告)号：US20080150567A1

公开(公告)日：2008-06-26

申请号：US12046818

申请日：2008-03-12

申请人： CHOON LEONG LOU ,  LI MIN WANG

发明人： CHOON LEONG LOU ,  LI MIN WANG

IPC分类号： G01R31/02

CPC分类号： G01R31/2891 ,  G01R1/07342 ,  G01R1/44 ,  G01R31/2874

摘要： A probing apparatus for integrated circuit devices comprises a probe card, a probe holder for holding the probe card, a test head and a temperature-adjusting mechanism. The probe card comprises at least one probe capable of forming an electrical connection with the integrated circuit device facing a first surface of the probe card, and the temperature-adjusting mechanism can be positioned on/above a second surface of the probe card. The temperature-adjusting mechanism can be positioned inside the probe card, inside the probe holder or on the probe holder. The test head comprises a plurality of pins configured to form electrical connections with connecting sites of the probe card and test and measurement units and apparatus. The temperature-adjusting mechanism can be positioned on or inside the test head. The temperature-adjusting mechanism comprises a flow line having at least one inlet and a plurality of outlets, and the outlets can be positioned on the second surface of the probe card.

公开(公告)号：US20230314475A1

公开(公告)日：2023-10-05

申请号：US17889143

申请日：2022-08-16

申请人： CHOON LEONG LOU

发明人： CHOON LEONG LOU

IPC分类号： G01R1/067 ,  G01R31/28

CPC分类号： G01R1/06738 ,  G01R31/2886

摘要： The present disclosure provides a probe structure. The probe structure includes a plurality of bodies and a plurality of protrusions. Each body includes an end portion. Each end portion has a surface. The plurality of protrusions are formed on the surfaces and extend toward a same direction. At least one protrusion is formed on each surface.

公开(公告)号：US20130082731A1

公开(公告)日：2013-04-04

申请号：US13425987

申请日：2012-03-21

申请人： CHOON LEONG LOU ,  LI MIN WANG

发明人： CHOON LEONG LOU ,  LI MIN WANG

IPC分类号： G01R31/26

CPC分类号： G01R31/2844

摘要： A switching matrix includes a plurality of input ports, a plurality of output ports, a plurality of switching devices configured to open and close, an electrical connection between the input ports and the output ports, and an electrical sensor configured to generate a signal by measuring a predetermined electrical property of the electrical connection, the open and close of switching devices is pre-determined by status read from the electrical sensor.

摘要翻译： 开关矩阵包括多个输入端口，多个输出端口，多个开关装置，其被配置为打开和关闭输入端口和输出端口之间的电连接;以及电传感器，被配置为通过测量产生信号 通过从电传感器读取的状态来预先确定电气连接的预定电气特性，开关装置的打开和关闭。

公开(公告)号：US20110156244A1

公开(公告)日：2011-06-30

申请号：US12651006

申请日：2009-12-31

申请人： CHOON LEONG LOU

发明人： CHOON LEONG LOU

IPC分类号： H01L23/34 ,  F28F7/00

CPC分类号： H01L23/367 ,  H01L23/13 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An integrated circuit assembly includes a heat sink and a substrate coupled to the heat sink. The heat sink includes a base and a plurality of fins disposed on the base, the base has an intermediate portion and two side portions connected to the intermediate portion, the intermediate portion has a first width and the side portions has a second width smaller than the first width, and the fins are disposed on the side portions of the base. The substrate is made of ceramic material and has an upper surface with an opening and a lower surface with a groove, the groove matches the intermediate portion of the heat sink, and the opening is configured to expose a portion of the intermediate portion to receive an integrated circuits package.

摘要翻译： 集成电路组件包括耦合到散热器的散热器和衬底。 所述散热片包括基部和设置在所述基座上的多个翅片，所述基座具有连接到所述中间部分的中间部分和两个侧部，所述中间部分具有第一宽度，并且所述侧部具有小于所述中间部分的第二宽度 第一宽度，并且翅片设置在基部的侧部。 衬底由陶瓷材料制成，并且具有开口的上表面和具有凹槽的下表面，凹槽与散热器的中间部分匹配，并且开口构造成暴露中间部分的一部分以接收 集成电路封装。

公开(公告)号：US20100301890A1

公开(公告)日：2010-12-02

申请号：US12552102

申请日：2009-09-01

申请人： CHOON LEONG LOU

发明人： CHOON LEONG LOU

IPC分类号： G01R1/06

CPC分类号： G01R31/2891

摘要： A probing apparatus for testing semiconductor devices comprises a housing configured to define a testing chamber, a device carrier positioned in the housing and configured to receive the semiconductor device, a platen positioned on the housing, an alignment module positioned on the platen, a planarity-adjusting module positioned on the alignment module, an angular adjusting module positioned on the planarity-adjusting module, and a card holder positioned on the angular adjusting module and configured to receive a probe card having a plurality of probes.

摘要翻译： 用于测试半导体器件的探测装置包括被配置为限定测试室的壳体，位于壳体中并被配置为接收半导体器件的器件载体，位于壳体上的压板，定位在压板上的对准模块， 位于对准模块上的调整模块，位于平面度调节模块上的角度调节模块，以及位于角度调节模块上并被配置为接收具有多个探针的探针卡的卡夹。

公开(公告)号：US20100182013A1

公开(公告)日：2010-07-22

申请号：US12418021

申请日：2009-04-03

申请人： CHOON LEONG LOU

发明人： CHOON LEONG LOU

IPC分类号： G01R31/02

CPC分类号： G01R31/2874

摘要： A probing apparatus for testing semiconductor devices comprises an upper guiding plate having a plurality of upper guiding holes, a bottom guiding plate having a plurality of bottom guiding holes, a plurality of vertical probes disposed between the upper guiding holes of the upper guiding plate and the bottom guiding holes of the bottom guiding plate, and a temperature-adjusting module including at least one flow line configured to direct a fluid into a space between the upper guiding plate and the bottom guiding plate.

摘要翻译： 用于测试半导体器件的探测装置包括具有多个上引导孔的上引导板，具有多个底引导孔的底引导板，设置在上引导板的上引导孔之间的多个垂直探针和 底部引导板的底部引导孔，以及温度调节模块，其包括至少一个流动管线，该流动线路构造成将流体引导到上部引导板和底部引导板之间的空间中。

公开(公告)号：US20230314473A1

公开(公告)日：2023-10-05

申请号：US17889034

申请日：2022-08-16

申请人： CHOON LEONG LOU

发明人： CHOON LEONG LOU

IPC分类号： G01R1/067

CPC分类号： G01R1/06716 ,  G01R1/0675

摘要： The present disclosure provides a probe and an elastic structure thereof. The probe includes: a first end portion, a second end portion and a plurality of elastic units. The elastic units are disposed between the first end portion and the second portion. Each elastic unit includes a first supporting element and a second supporting element, wherein the first supporting element and the second supporting element are at opposite sides of an axis, and the axis extends along a length of the probe.

公开(公告)号：US20130249584A1

公开(公告)日：2013-09-26

申请号：US13425170

申请日：2012-03-20

申请人： CHOON LEONG LOU ,  HO YEH CHEN ,  HSIAO TING TSENG

发明人： CHOON LEONG LOU ,  HO YEH CHEN ,  HSIAO TING TSENG

IPC分类号： G01R1/067

CPC分类号： G01R1/07342 ,  G01R1/06727 ,  G01R1/07357 ,  G01R31/2891

摘要： A high precision semiconductor probing system includes a probe head, a circuit board positioned above the probe head, and an optical microscope, wherein the probe head has a plurality of vertical probes and at least one cantilever probe having a vertical body positioned therein. The cantilever probe is disposed close to an edge of the probe head and extends laterally out from the probe head, in order to facilitate the visual alignment viewing from top of the probing apparatus. The optical microscope is positioned on top of the probing apparatus and is configured to have a line of sight directed to the tip of the cantilever probe.

摘要翻译： 高精度半导体探测系统包括探针头，位于探针头上方的电路板和光学显微镜，其中探头具有多个垂直探针和至少一个垂直体定位在其中的悬臂探头。 悬臂探头靠近探头的边缘设置，并从探针头侧向伸出，以便于从探测装置的顶部观察视觉对准。 光学显微镜位于探测装置的顶部，并被配置成具有指向悬臂探针的尖端的视线。