公开(公告)号：US20230400478A1

公开(公告)日：2023-12-14

申请号：US18327148

申请日：2023-06-01

申请人： CHROMA ATE INC.

发明人： I-Shih TSENG ,  Chin-Yi OUYANG ,  I-Ching TSAI ,  Xin-Yi WU ,  Yan-Lin WU

IPC分类号： G01R1/04

CPC分类号： G01R1/0458

摘要： A liquid cooling system, a liquid cooling method, and an electronic device-testing apparatus having the system are disclosed. When an electronic device is accommodated in a chip slot of a test socket, a cooling liquid supply device supplies a cooling liquid to the chip slot through a fluid inlet portion, and the cooling liquid at least flows over parts of the upper and lower surfaces of the electronic device and then flows out from a fluid outlet portion. The chip slot of the test socket serves as the flow space for the cooling liquid so that the cooling liquid can flow over the upper and lower surfaces of the electronic device, and the electronic device can be immersed in the continuously flowing cooling liquid. The flowing cooling liquid can also take away foreign matter, avoiding the influence of the foreign matter on the test.

公开(公告)号：US20230098042A1

公开(公告)日：2023-03-30

申请号：US17931148

申请日：2022-09-12

申请人： CHROMA ATE INC.

发明人： Chin-Yi OUYANG ,  Chin-Yuan KUO ,  Chang-Jyun HE ,  Yung-Fan CHU

IPC分类号： G01R31/28

摘要： The present invention relates to a temperature control system, a temperature control method and an image sensor-testing apparatus having the system. The temperature control method mainly comprises the steps of regulating the temperatures of a plurality of devices under test (DUTs) to a specific temperature in a temperature control zone; transferring the plurality of devices under test to a test plate and placing them into a plurality of test slots respectively; and measuring the temperatures of the device under test by the temperature-sensing elements in the test slots, wherein when at least one temperature-sensing element of the temperature-sensing elements detects that the device under test in the test slot corresponding to said at least one temperature-sensing element fails to meet the specific temperature, a temperature control element corresponding to the test slot regulates the temperature of the device under test.

公开(公告)号：US20230086266A1

公开(公告)日：2023-03-23

申请号：US17822816

申请日：2022-08-29

申请人： CHROMA ATE INC.

发明人： Chin-Yi OUYANG ,  Chien-Ming CHEN

IPC分类号： G01R31/28

摘要： The present invention relates to an electronic device testing apparatus and a testing method thereof. When the test is completed, a pressing head picks up a tested electronic device from a test socket and places the tested electronic device on an output carrier, the output carrier moves out of a test zone, and an input carrier follows immediately after the output carrier and successively moves into the test zone at the same speed; after the pressing head picks up an electronic device to be tested from the input carrier, the input carrier moves out of the test zone, and the pressing head places the electronic device to be tested in the test socket. Accordingly, in the present invention, the operation of the pressing head is simplified, and the overall test efficiency is improved.

公开(公告)号：US20240151746A1

公开(公告)日：2024-05-09

申请号：US18307866

申请日：2023-04-27

申请人： CHROMA ATE INC.

发明人： I-Shih TSENG ,  I-Ching TSAI ,  Xin-Yi WU ,  Chin-Yi OUYANG

IPC分类号： G01R1/44 ,  G01R1/04 ,  G01R1/067 ,  H01R13/24 ,  H05K7/20

CPC分类号： G01R1/44 ,  G01R1/0458 ,  G01R1/06722 ,  H01R13/2421 ,  H05K7/202 ,  H05K7/20272 ,  H01R2201/20

摘要： The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system uses a cooling fluid supply module for the cooling of the pogo pin, and the cooling fluid may be either a coolant or a cooling gas. When an electronic device is accommodated in the chip socket, the cooling fluid supply module supplies a cooling fluid into the chip socket through the cooling fluid supply channel and the inlet, and the cooling fluid passes through the pogo pins and then flows into the cooling fluid discharge channel through the outlet. In the present invention, the cooling fluid is mainly used to cool not only the pogo pins in the chip socket but also the bottom surface of the electronic device and the solder ball contacts on the bottom surface.

公开(公告)号：US20240142492A1

公开(公告)日：2024-05-02

申请号：US18050500

申请日：2022-10-28

申请人： CHROMA ATE INC.

发明人： I-Shih TSENG ,  Xin-Yi WU ,  I-Ching TSAI ,  Chin-Yi OUYANG

IPC分类号： G01R1/04 ,  G01R31/28

CPC分类号： G01R1/0466 ,  G01R31/2877

摘要： The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.

公开(公告)号：US20230349968A1

公开(公告)日：2023-11-02

申请号：US18299173

申请日：2023-04-12

申请人： CHROMA ATE INC.

发明人： Chin-Yi OUYANG ,  Xin-Yi WU ,  Chien-Ming CHEN ,  Meng-Kung LU ,  Chia-Hung CHIEN

IPC分类号： G01R31/28

CPC分类号： G01R31/2896 ,  G01R31/2887 ,  G01R31/2893

摘要： The present invention relates to an apparatus for testing a package-on-package semiconductor device, mainly comprising a pick-and-place device, a test socket, an upper chip holder, and a main controller. When a first package device is to be tested, the main controller controls the pick-and-place device to load the first package device into the test socket and then controls the pick-and-place device to transfer the upper chip holder and bring the upper chip holder into electrical contact with the first package device on the test socket so that a second package device in the upper chip holder is electrically connected to the first package device for testing. Accordingly, the upper chip holder is an independent component. Only when a test is executed, the pick-and-place device transfers the upper chip holder onto the test socket so that the second package device is electrically connected to the first package device.

公开(公告)号：US20230400506A1

公开(公告)日：2023-12-14

申请号：US18316691

申请日：2023-05-12

申请人： CHROMA ATE INC.

发明人： Chin-Yi OUYANG ,  I-Ching TSAI ,  Xin-Yi WU ,  Yan-Lin WU

IPC分类号： G01R31/28

CPC分类号： G01R31/2877 ,  G01R31/2863

摘要： The present invention relates to a temperature control system and a temperature control method for an electronic device-testing apparatus. The temperature control system mainly includes a test socket, a temperature-controlling fluid supply device and a temperature-controlling fluid recovery device. A temperature-controlling fluid is supplied to a chip slot of the test socket by the temperature-controlling fluid supply device and drawn from the chip slot by the temperature-controlling fluid recovery device. In the present invention, the temperature-controlling fluid is forced to flow through the chip slot loaded with an electronic device so as to forcibly exchange heat with the electronic device and components in the chip slot, thereby achieving the constant temperature test. After the test is completed, the temperature-controlling fluid can be effectively recovered so that the contamination of the electronic device or the testing apparatus can be avoided.

公开(公告)号：US20230375615A1

公开(公告)日：2023-11-23

申请号：US18054197

申请日：2022-11-10

申请人： CHROMA ATE INC.

发明人： I-Shih TSENG ,  Xin-Yi WU ,  Chin-Yi OUYANG

IPC分类号： G01R31/28 ,  G01R1/44 ,  G01R35/00

CPC分类号： G01R31/2891 ,  G01R1/44 ,  G01R35/00

摘要： The present invention relates to an aging test system and an aging test method for a thermal interface material and an electronic device testing apparatus having the system, wherein a controller controls a movable carrier to move to a high temperature generating device so that the thermal interface material on the movable carrier is brought into contact with the high temperature generating device; the controller further controls a temperature sensor to detect the temperature of the thermal interface material; the controller compares an output temperature datum of the high temperature generating device with a temperature measurement datum detected by the temperature sensor. Accordingly, the thermal conductivity of the thermal interface material can be obtained for immediately determining the quality and the performance degradation of the thermal interface material, which can be used as a reference for selection or replacement of the thermal interface material.

公开(公告)号：US20230022501A1

公开(公告)日：2023-01-26

申请号：US17834035

申请日：2022-06-07

申请人： CHROMA ATE INC.

发明人： Chin-Yi OUYANG ,  Chien-Ming CHEN ,  Wei-Cheng KUO ,  Xin-Yi WU ,  Iching TSAI

IPC分类号： G01R31/28 ,  G01R1/04

摘要： The present invention relates to a multistory electronic device testing apparatus, which mainly comprises a feeding and binning device, a multi-axis transfer device, a chip-testing device and a main controller. The feeding and binning device includes an upper module and a lower module. The chip-testing device includes a plurality of testing units arranged vertically. The main controller not only controls the feeding, binning and testing operations, but also controls the multi-axis transfer device to transfer an electronic device to be tested or a tested electronic device between the feeding and binning device and the chip-testing device. Accordingly, the three-dimensional arrangement of the feeding and binning module and the testing device is realized, and the accommodating capacity and the testing capacity for the electronic devices to be tested and the tested electronic devices can be increased.

公开(公告)号：US20210199690A1

公开(公告)日：2021-07-01

申请号：US17023445

申请日：2020-09-17

申请人： Chroma Ate Inc.

发明人： Chin-Yi OUYANG ,  Chien-Ming CHEN ,  Bo-An SU ,  Yu-Hsuen WANG

IPC分类号： G01R1/04

摘要： The present invention relates to a locking mechanism for a press head, and an electronic device testing apparatus comprising the same, wherein a slider and a locking pin are disposed on the press head and a test socket substrate, respectively. When the press head is moved and engaged with the test socket substrate, an actuator drives the slider to secure the locking pin, so as to secure the press head and the test socket substrate and prevent the press head and the test socket substrate from being separated from each other. The mechanism is simple in construction, easy to install and maintain, reliable, and can be integrated into the support arms, and occupies a relatively small space. Energy is consumed only when the actuator is actuated to effect locking or unlocking. That is, only when the slider is driven and moved, energy is consumed. No extra energy is needed to persistently press down or drive the locking mechanism.