公开(公告)号：US20090079447A1

公开(公告)日：2009-03-26

申请号：US11858401

申请日：2007-09-20

申请人： CHUNG-ER HUANG ,  SHENG-WEN CHEN

发明人： CHUNG-ER HUANG ,  SHENG-WEN CHEN

IPC分类号： G01R31/28

CPC分类号： G01R29/0821 ,  G01R31/2822

摘要： A testing system for a RF module includes a metal casing formed a testing space therein, a RF testing socket disposed inside the testing module, and a pressing manipulator penetrating through the metal casing. A shielding material layer is disposed on the internal surface of the metal casing so that the RF signal is isolated inside the metal casing. An end of the pressing manipulator extends into the testing space. The pressing manipulator is controlled automatically and provides for a pressure on a RF module disposed on the testing module so as to execute a testing process. As mentioned above, the testing set for a RF module can prevent from RF testing interference and the testing manufacture efficiency is improved.

摘要翻译： RF模块的测试系统包括在其中形成测试空间的金属外壳，设置在测试模块内部的RF测试插座和穿过金属外壳的按压操作器。 屏蔽材料层设置在金属外壳的内表面上，使得RF信号在金属外壳内隔离。 按压操纵器的一端延伸到测试空间。 自动控制按压操纵器，并且对设置在测试模块上的RF模块施加压力，以执行测试过程。 如上所述，RF模块的测试装置可以防止RF测试干扰，提高测试制造效率。

公开(公告)号：US20090039479A1

公开(公告)日：2009-02-12

申请号：US11861773

申请日：2007-09-26

申请人： CHUNG-ER HUANG ,  YUEH-CHENG LEE

发明人： CHUNG-ER HUANG ,  YUEH-CHENG LEE

IPC分类号： H01L23/66 ,  H01L21/60

CPC分类号： H01L25/16 ,  H01L2924/0002 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/3011 ,  H01L2924/00

摘要： A module for integrating peripheral circuit includes a silicon chip substrate, at least one peripheral circuit unit, and at least one main circuit unit. The peripheral circuit unit is integrated in the silicon chip substrate via a semiconductor manufacturing process. The main circuit unit is mounted on the surface of the silicon chip substrate and is electrically connected with the peripheral circuit unit for transmitting the signal. Thereby, the dimension of the module is reduced.

摘要翻译： 用于集成外围电路的模块包括硅芯片基板，至少一个外围电路单元和至少一个主电路单元。 外围电路单元通过半导体制造工艺集成在硅芯片基板中。 主电路单元安装在硅芯片基板的表面上，并与外围电路单元电连接，用于发送信号。 因此，模块的尺寸减小。

公开(公告)号：US20120139089A1

公开(公告)日：2012-06-07

申请号：US13005084

申请日：2011-01-12

申请人： CHUNG-ER HUANG ,  MING-TAI KUO

发明人： CHUNG-ER HUANG ,  MING-TAI KUO

IPC分类号： H01L23/552 ,  H01L21/50

CPC分类号： H01L21/561 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00

摘要： A module IC package structure includes a substrate unit, an electronic unit, a conductive unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate having at least one grounding pad. The electronic unit includes a plurality of electronic elements electrically connected to the circuit substrate. The conductive unit includes at least one elastic conductive element disposed on the circuit substrate, and the elastic conductive element has a first end portion electrically connected to the grounding pad. The package unit includes a package resin body disposed on the circuit substrate to cover the electronic elements and one part of the elastic conductive element, and the elastic conductive element has a second end portion is exposed from the package resin body. The shielding unit includes a metal shielding layer formed on the outer surface of the package resin body to electrically contact the second end portion.

摘要翻译： 模块IC封装结构包括基板单元，电子单元，导电单元，封装单元和屏蔽单元。 基板单元包括具有至少一个接地垫的电路基板。 电子单元包括电连接到电路基板的多个电子元件。 导电单元包括设置在电路基板上的至少一个弹性导电元件，弹性导电元件具有电连接到接地垫的第一端部。 封装单元包括设置在电路基板上以覆盖电子元件和弹性导电元件的一部分的封装树脂体，并且具有第二端部的弹性导电元件从封装树脂体露出。 屏蔽单元包括形成在封装树脂体的外表面上以电接触第二端部的金属屏蔽层。

公开(公告)号：US20100009501A1

公开(公告)日：2010-01-14

申请号：US12585465

申请日：2009-09-16

申请人： CHUNG-ER HUANG ,  CHIH-HAO LIAO

发明人： CHUNG-ER HUANG ,  CHIH-HAO LIAO

IPC分类号： H01L21/50

CPC分类号： H01L21/563 ,  H01L24/27 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/14

摘要： A packaging structure applied for a surface mounting process, comprising: a chip module having a packaging surface; and a pre-cured layer formed on the packaging surface of the chip module. As above-mentioned, the structure is employed for protecting the external surface of the wafer. The pre-cured layer is formed on pre-curing a gluing material and the gluing material is uniformly filled with the space between the connecting protrusions on the packaging surface. The pre-cured later is post-curing in a connecting process for mounting the connecting protrusions to the substrate so that the connecting strength is improved. Moreover, the rate of the packaging process is increasing.

摘要翻译： 一种应用于表面安装工艺的包装结构，包括：具有包装表面的芯片模块; 以及形成在芯片模块的封装表面上的预固化层。 如上所述，该结构用于保护晶片的外表面。 预固化层通过对胶合材料进行预固化而形成，并且胶合材料均匀地填充在包装表面上的连接突起之间的空间。 预固化后的是在将连接突起安装到基板上的连接过程中后固化，从而提高连接强度。 此外，包装过程的速度也在增加。

公开(公告)号：US20120162930A1

公开(公告)日：2012-06-28

申请号：US12977796

申请日：2010-12-23

申请人： CHUNG-ER HUANG ,  YUEH-CHENG LEE

发明人： CHUNG-ER HUANG ,  YUEH-CHENG LEE

IPC分类号： H05K7/00 ,  H05K3/30

CPC分类号： H05K9/0045 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/552 ,  H01L24/97 ,  H01L2924/14 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/10371 ,  Y10T29/49146 ,  H01L2924/00

摘要： A module IC package structure with electrical shield function includes a substrate unit, an electronic unit, a conductive unit, a package unit and a shielding unit. The substrate unit includes a circuit substrate having at least one grounding pad. The electronic unit includes a plurality of electronic elements electrically connected to the circuit substrate. The conductive unit includes at least one conductive element disposed on the circuit substrate, and the conductive element has a first end portion electrically connected to the grounding pad. The package unit includes a package resin body disposed on the circuit substrate to cover the electronic elements and one part of the conductive element, and the conductive element has a second end portion is exposed from the package resin body. The shielding unit includes a metal shielding layer formed on the outer surface of the package resin body to electrically contact the second end portion.

摘要翻译： 具有电屏蔽功能的模块IC封装结构包括基板单元，电子单元，导电单元，封装单元和屏蔽单元。 基板单元包括具有至少一个接地垫的电路基板。 电子单元包括电连接到电路基板的多个电子元件。 导电单元包括设置在电路基板上的至少一个导电元件，并且导电元件具有电连接到接地垫的第一端部。 封装单元包括设置在电路基板上以覆盖电子元件和导电元件的一部分的封装树脂体，并且具有第二端部的导电元件从封装树脂体露出。 屏蔽单元包括形成在封装树脂体的外表面上以电接触第二端部的金属屏蔽层。

公开(公告)号：US20090051461A1

公开(公告)日：2009-02-26

申请号：US11842529

申请日：2007-08-21

申请人： CHUNG-ER HUANG ,  HUANG-CHAN CHIEN

发明人： CHUNG-ER HUANG ,  HUANG-CHAN CHIEN

IPC分类号： H01P5/18 ,  G01R21/00

CPC分类号： G01R21/01

摘要： A output power detecting system with a directional coupler has a directional coupler at the output terminal of the output power detecting system. The directional coupler includes a main line, a first sub line, and a second sub line. The output of the power amplifying unit is fully coupled to a power detecting unit via the coupling between the main line and the first sub line, and the external noise is coupled to the ground via the coupling between the first sub line and the second sub line. Therefore, the power detecting unit accurately detects the output power of the output power detecting system.

摘要翻译： 具有定向耦合器的输出功率检测系统在输出功率检测系统的输出端具有定向耦合器。 定向耦合器包括主线，第一子线和第二子线。 功率放大单元的输出经由主线和第一子线之间的耦合完全耦合到功率检测单元，并且外部噪声通过第一子线与第二子线之间的耦合耦合到地 。 因此，功率检测单元精确地检测输出功率检测系统的输出功率。

公开(公告)号：US20090021329A1

公开(公告)日：2009-01-22

申请号：US11856223

申请日：2007-09-17

申请人： CHUNG-ER HUANG ,  CHIEN-YU HUANG

发明人： CHUNG-ER HUANG ,  CHIEN-YU HUANG

IPC分类号： H01P5/00

CPC分类号： H01L23/66 ,  H01L2924/0002 ,  H01L2924/00

摘要： A through-hole structure for a wafer level packaging includes a wafer, a RF passage penetrating through the wafer, and a through-hole structure disposed around the RF passage. The through-hole structure has three types of structure. The through hole structure includes a plurality of holes filled with metal material thereinside. On the other hand, the through hole structure can be a plurality of holes coated with a metal layer on the internal surface thereof. Alternatively, the through hole structure has both of the two above hole structure. Depending on the structure, the through hole structure performs an electric reference for preventing the RF signal from decay or interference.

摘要翻译： 用于晶片级封装的通孔结构包括晶片，穿透晶片的RF通道和设置在RF通道周围的通孔结构。 通孔结构有三种结构。 通孔结构包括多个填充有金属材料的孔。 另一方面，通孔结构可以是在其内表面上涂覆有金属层的多个孔。 或者，通孔结构具有上述两个孔结构。 根据结构，通孔结构执行用于防止RF信号衰减或干扰的电参考。

公开(公告)号：US20130158933A1

公开(公告)日：2013-06-20

申请号：US13423215

申请日：2012-03-17

申请人： SHIH-FENG HUANG ,  YUEH-CHENG LEE ,  CHUNG-ER HUANG

发明人： SHIH-FENG HUANG ,  YUEH-CHENG LEE ,  CHUNG-ER HUANG

IPC分类号： G06F19/00

CPC分类号： G01R31/2822 ,  H04B17/20 ,  H04B17/29

摘要： This invention provides a system of testing multiple RF modules. The system includes a RF signal analyzer, a RF switch, a control module, and a plurality of testing modules. The RF switch is electrically coupled to the RF signal analyzer, and operational bands of the RF switch includes operational bands of the RF modules for transmitting and receiving RF signals. The controller module controls the RF signal analyzer and the RF switch. The testing modules are electrically coupled to the controller module and controlled by the controller module. Each testing module has a memorizing unit for storing testing results for the RF modules transmitting and receiving the RF signals. The RF switch and the testing modules are used to electrically couple each RF module.

摘要翻译： 本发明提供一种测试多个RF模块的系统。 该系统包括RF信号分析器，RF开关，控制模块和多个测试模块。 RF开关电耦合到RF信号分析器，并且RF开关的操作频带包括用于发送和接收RF信号的RF模块的操作频带。 控制器模块控制RF信号分析仪和RF开关。 测试模块电耦合到控制器模块并由控制器模块控制。 每个测试模块都有一个存储单元，用于存储RF模块发送和接收RF信号的测试结果。 RF开关和测试模块用于电耦合每个RF模块。

公开(公告)号：US20130113089A1

公开(公告)日：2013-05-09

申请号：US13326478

申请日：2011-12-15

申请人： CHUNG-ER HUANG ,  YUEH-CHENG LEE

发明人： CHUNG-ER HUANG ,  YUEH-CHENG LEE

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L2924/0002 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/00

摘要： A module IC package structure having a metal shielding function includes a substrate unit, an electronic unit, a shielding unit, and an insulative unit. The substrate unit includes a substrate body and at least one grounding pad disposed on the substrate body. The electronic unit includes at least one electronic module disposed on the circuit substrate and electrically connected to the circuit substrate. The shielding unit includes a metal shielding layer formed on an external surface of the at least one electronic module, and the metal shielding layer contacts the at least one grounding pad. The insulative unit includes an insulative layer formed on an external surface of the metal shielding layer. Hence, the module IC package structure can be used to prevent electrical malfunction induced by short-circuit due to the design of forming the insulative layer formed on the external surface of the metal shielding layer.

摘要翻译： 具有金属屏蔽功能的模块IC封装结构包括基板单元，电子单元，屏蔽单元和绝缘单元。 基板单元包括基板主体和布置在基板主体上的至少一个接地焊盘。 电子单元包括设置在电路基板上并电连接到电路基板的至少一个电子模块。 屏蔽单元包括形成在至少一个电子模块的外表面上的金属屏蔽层，金属屏蔽层接触至少一个接地焊盘。 绝缘单元包括形成在金属屏蔽层的外表面上的绝缘层。 因此，由于形成在金属屏蔽层的外表面上的绝缘层的设计，可以使用模块IC封装结构来防止由短路引起的电气故障。

公开(公告)号：US20120211876A1

公开(公告)日：2012-08-23

申请号：US13092938

申请日：2011-04-23

申请人： CHUNG-ER HUANG ,  Yueh-Cheng Lee

发明人： CHUNG-ER HUANG ,  Yueh-Cheng Lee

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L23/3121 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/00

摘要： A module IC package structure includes a substrate unit, a radio frequency unit, an inner shielding unit, an insulative package unit, and an outer shielding unit. The substrate unit includes a circuit substrate. The radio frequency unit includes at least one radio frequency element disposed on and electrically connected to the circuit substrate. The inner shielding unit includes an inner metal shielding layer formed on a predetermined surface of the radio frequency element. The insulative package unit includes an insulative package resin body disposed on the circuit substrate to cover the radio frequency element. The outer shielding unit is formed on the outer surface of the insulative package resin body and electrically connected to the circuit substrate. The inner metal shielding layer is a radio frequency property maintaining layer disposed between the radio frequency element and one part of the outer shielding unit for shielding the radio frequency element.

摘要翻译： 模块IC封装结构包括基板单元，射频单元，内屏蔽单元，绝缘封装单元和外屏蔽单元。 基板单元包括电路基板。 射频单元包括设置在电路基板上并与其电连接的至少一个射频元件。 内屏蔽单元包括形成在射频元件的预定表面上的内金属屏蔽层。 绝缘封装单元包括设置在电路基板上以覆盖射频元件的绝缘封装树脂体。 外屏蔽单元形成在绝缘封装树脂体的外表面上并与电路基板电连接。 内金属屏蔽层是设置在射频元件与外屏蔽单元的一部分之间的用于屏蔽射频元件的射频特性保持层。