Thin-film probe card and test module thereof

    公开(公告)号:US11175313B1

    公开(公告)日:2021-11-16

    申请号:US17020833

    申请日:2020-09-15

    Abstract: A thin-film probe card and a test module thereof are provided. The test module includes a carrying unit, a plurality of vertical probes fixed in position by the carrying unit, an elastic cushion disposed on the carrying unit, and a thin sheet. The thin sheet includes a carrier partially disposed on the elastic cushion, a plurality of signal circuits disposed on the carrier, and a plurality of electrically conductive protrusions that are respectively formed on the signal circuits. An end of the vertical probes is arranged at an inner side of the electrically conductive protrusions and is coplanar with free ends of the electrically conductive protrusions.

    Board-like connector, single-arm bridge of board-like connector, and wafer testing assembly

    公开(公告)号:US11747395B2

    公开(公告)日:2023-09-05

    申请号:US17485268

    申请日:2021-09-24

    CPC classification number: G01R31/2889 H01R12/714

    Abstract: A board-like connector, a single-arm bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of single-arm bridges spaced apart from each other and an insulating layer. Each of the single-arm bridges includes a carrier, a cantilever extending from and being coplanar with the carrier, an abutting column, and an abutting end portion, the latter two of which extend from the cantilever and are respectively arranged at two opposite sides of the cantilever. The insulating layer connects the carriers of the single-arm bridges, and the abutting column of each of the single-arm bridges protrudes from the insulating layer. The abutting column and the abutting end portion of each of the single-arm bridges are configured to abut against two boards, respectively.

    Board-like connector, dual-ring bridge of board-like connector, and wafer testing assembly

    公开(公告)号:US11561244B2

    公开(公告)日:2023-01-24

    申请号:US17485288

    申请日:2021-09-24

    Abstract: A board-like connector, a dual-ring bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of dual-ring bridges spaced apart from each other and an insulating layer. Each of the dual-ring bridges includes two carrying rings, two cantilevers respectively extending from and being coplanar with the two carrying rings, two abutting columns respectively extending from the two cantilevers along two opposite directions, and a bridging segment that connects the two carrying rings. The insulating layer connects the two carrying rings of the dual-ring bridges, and the two abutting columns of the dual-ring bridges respectively protrude from two opposite sides of the insulating layer. The two abutting columns of each of the dual-ring bridges are configured to be respectively abutted against two boards.

    Split thin-film probe card
    5.
    发明授权

    公开(公告)号:US11287446B2

    公开(公告)日:2022-03-29

    申请号:US17022094

    申请日:2020-09-16

    Abstract: A split thin-film probe card and an elastic module thereof are provided. The elastic module includes an elastic cushion and a thin-film sheet. The elastic cushion has a plurality of partition slots so as to define a plurality of independent elastic segments. The thin-film sheet includes a carrier, a plurality of signal circuits disposed on the carrier, and a plurality of conductive protrusions that are respectively formed on the signal circuits. The carrier has a plurality of grooves so as to divide the carrier into a plurality of action segments respectively disposed on the independent elastic segments. The signal circuits are respectively disposed on the action segments. When any one of the conductive protrusions is pressed, only the corresponding independent elastic segment is deformed through the corresponding signal circuit and the corresponding action segment.

    Multilayer circuit board and manufacturing method thereof

    公开(公告)号:US10779407B1

    公开(公告)日:2020-09-15

    申请号:US16398317

    申请日:2019-04-30

    Abstract: A multilayer circuit board and a manufacturing method thereof are provided. The multilayer circuit board includes: a first board having a first conductive via hole; a first conductive layer formed on the first board and the first conductive via hole; a second board disposed on the first board and the first conductive layer and having a second conductive via hole; and a second conductive layer formed on the second board and the second conductive via hole. The first conductive layer and the second conductive layer contact with each other and cooperatively define a connecting part, and the connecting part of the first conductive layer and the second conductive layer includes concave-convex surfaces for engaging with each other.

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