公开(公告)号：US11699871B2

公开(公告)日：2023-07-11

申请号：US17485722

申请日：2021-09-27

Applicant: CHUNGHWA PRECISION TEST TECH. CO., LTD.

Inventor： Kai-Chieh Hsieh ,  Chao-Chiang Liu ,  Meng-Chieh Cheng ,  Wei-Jhih Su

IPC: H01R13/24 ,  H01L21/66 ,  H05K1/18 ,  G01R31/26

CPC classification number: H01R13/2457 ,  G01R31/2601 ,  H01L22/34 ,  H05K1/181 ,  H05K2201/10409

Abstract: A board-like connector, a dual-arm bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of dual-arm bridges spaced apart from each other and an insulating layer. Each of the dual-arm bridges includes a carrier, a first cantilever, a second cantilever, a first abutting column, and a second abutting column, the latter two of which extend from the first and second cantilevers along two opposite directions. The first cantilever and the second cantilever extend from and are coplanar with the carrier. The insulating layer connects the carriers of the dual-arm bridges. The first abutting column and second abutting column of each of the dual-arm bridges respectively protrude from two opposite sides of the insulating layer, and are configured to abut against two boards, respectively.

公开(公告)号：US11933817B2

公开(公告)日：2024-03-19

申请号：US17574694

申请日：2022-01-13

Applicant: CHUNGHWA PRECISION TEST TECH. CO., LTD.

Inventor： Wen-Tsung Lee ,  Hsun-Tai Wei ,  Pang-Chi Huang ,  Meng-Chieh Cheng

IPC: G01R1/073

CPC classification number: G01R1/07342 ,  G01R1/07357

Abstract: A probe card device and a transmission structure are provided. The transmission structure includes a supporting layer, a plurality of metal conductors spaced apart from each other and slantingly inserted into the supporting layer, and an insulating resilient layer formed on the supporting layer. Each of the metal conductors includes a positioning segment held in the supporting layer, a connecting segment and an embedded segment respectively extending from two ends of the positioning segment, and an exposed segment extending from the embedded segment. Each of the embedded segments is embedded and fixed in the insulating resilient layer, and each of the exposed segments protrudes from the insulating resilient layer. When any one of the exposed segments is pressed by an external force, the insulating resilient layer is configured to absorb the external force through the corresponding embedded segment so as to have a deformation providing a stroke distance.

公开(公告)号：US11747395B2

公开(公告)日：2023-09-05

申请号：US17485268

申请日：2021-09-24

Applicant: CHUNGHWA PRECISION TEST TECH. CO., LTD.

Inventor： Kai-Chieh Hsieh ,  Chao-Chiang Liu ,  Meng-Chieh Cheng ,  Wei-Jhih Su

IPC: G01R31/28 ,  H01R12/71

CPC classification number: G01R31/2889 ,  H01R12/714

Abstract: A board-like connector, a single-arm bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of single-arm bridges spaced apart from each other and an insulating layer. Each of the single-arm bridges includes a carrier, a cantilever extending from and being coplanar with the carrier, an abutting column, and an abutting end portion, the latter two of which extend from the cantilever and are respectively arranged at two opposite sides of the cantilever. The insulating layer connects the carriers of the single-arm bridges, and the abutting column of each of the single-arm bridges protrudes from the insulating layer. The abutting column and the abutting end portion of each of the single-arm bridges are configured to abut against two boards, respectively.

公开(公告)号：US11561244B2

公开(公告)日：2023-01-24

申请号：US17485288

申请日：2021-09-24

Applicant: CHUNGHWA PRECISION TEST TECH. CO., LTD.

Inventor： Kai-Chieh Hsieh ,  Chao-Chiang Liu ,  Meng-Chieh Cheng ,  Wei-Jhih Su

IPC: G01R1/073 ,  G01R31/28

Abstract: A board-like connector, a dual-ring bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of dual-ring bridges spaced apart from each other and an insulating layer. Each of the dual-ring bridges includes two carrying rings, two cantilevers respectively extending from and being coplanar with the two carrying rings, two abutting columns respectively extending from the two cantilevers along two opposite directions, and a bridging segment that connects the two carrying rings. The insulating layer connects the two carrying rings of the dual-ring bridges, and the two abutting columns of the dual-ring bridges respectively protrude from two opposite sides of the insulating layer. The two abutting columns of each of the dual-ring bridges are configured to be respectively abutted against two boards.