公开(公告)号：US11904410B2

公开(公告)日：2024-02-20

申请号：US15285773

申请日：2016-10-05

Applicant: CORNING INCORPORATED

Inventor： Alejandro Antonio Becker ,  Tobias Christian Roeder ,  Helmut Schillinger ,  Ralf J Terbrueggen

IPC: B23K26/402 ,  C03B33/09 ,  B23K26/142 ,  B23K26/364 ,  B26F3/06 ,  B23K26/18 ,  C03C17/32 ,  B23K26/073 ,  B23K26/082 ,  C03B33/07 ,  B23K26/40 ,  B23K26/0622 ,  B26F3/00 ,  B23K103/00 ,  B23K103/16 ,  B23K101/34

CPC classification number: B23K26/402 ,  B23K26/0624 ,  B23K26/0738 ,  B23K26/082 ,  B23K26/142 ,  B23K26/18 ,  B23K26/364 ,  B23K26/40 ,  B26F3/002 ,  B26F3/06 ,  C03B33/074 ,  C03B33/091 ,  C03C17/32 ,  B23K2101/34 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/54 ,  C03C2218/328

Abstract: A method for laser preparation of a coated substrate to be laser cut is provided. The method includes substantially removing a target portion of a polymer coating from a coated substrate by directing an ablative laser beam to the target portion, wherein the target portion of the polymer coating has a width of between about 10 μm and about 6.0 mm.