-
1.发明申请公开(公告)号：US20170283299A1
公开(公告)日：2017-10-05
申请号：US15629251
申请日：2017-06-21
Applicant: Corning Incorporated
Inventor： Dana Craig Bookbinder , Lewis Kirk Klingensmith , Stephan Lvovich Logunov , Albert Roth Nieber , Helmut Schillinger , Pushkar Tandon , Sergio Tsuda
CPC classification number: C03B33/06 , B23K2103/54 , C03B9/12 , C03B33/0222 , C03B33/095 , C03B33/0955
Abstract: Embodiments of the present method of laser cutting a laser wavelength transparent glass article comprises feeding at least one glass article to a pulsed laser assembly having at least one pulsed laser, wherein the pulsed laser defines a laser beam focal line with a length of 0.1-100 mm, the glass article being comprised of two end sections, and at least one lateral surface disposed lengthwise between the end sections. The method further comprises laser cutting at least one perforation line onto the lateral surface of the glass article while there is relative motion between the glass article and the pulsed laser and separating the glass article along the at least one perforation line to yield a laser cut glass article.
-
公开(公告)号：US20170001900A1
公开(公告)日：2017-01-05
申请号：US15114236
申请日：2015-01-27
Applicant: CORNING INCORPORATED
Inventor： Sasha Marjanovic , David Andrew Pastel , Garrett Andrew Piech , Jose Mario Quintal , Helmut Schillinger , Sergio Tsuda , Robert Stephen Wagner , Andrea Nicole Yeary
IPC: C03B33/02 , C03C21/00 , B23K26/402 , B23K26/08 , B23K26/0622 , B23K26/362
Abstract: Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.
Abstract translation: 本文描述了使用激光器对任意形状的玻璃基板的边缘进行倒角和/或斜切的工艺。 在玻璃基板上生产倒角的两种一般方法是首先采用超短脉冲激光切割具有期望的倒角形状的边缘，以在玻璃内产生穿孔; 然后进行离子交换。
-
公开(公告)号：US20180044219A1
公开(公告)日：2018-02-15
申请号：US15660009
申请日：2017-07-26
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Helmut Schillinger , Sergio Tsuda , Robert Stephen Wagner
IPC: C03B33/02 , C03B33/09 , B23K26/035 , B23K26/0622 , B23K26/361 , C03B33/08 , B23K26/402 , B23K26/362 , B23K26/08 , B23K26/04 , B23K26/02 , C03C21/00 , B23K26/00 , B23K103/00
Abstract: Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a CO2 laser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or CO2 lasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.
-
公开(公告)号：US10597321B2
公开(公告)日：2020-03-24
申请号：US15114236
申请日：2015-01-27
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , David Andrew Pastel , Garrett Andrew Piech , Jose Mario Quintal , Helmut Schillinger , Sergio Tsuda , Robert Stephen Wagner , Andrea Nichole Yeary
IPC: B23K26/40 , C03B33/02 , B23K26/08 , C03B33/09 , C03B33/08 , B23K26/53 , B24B9/10 , B23K26/02 , B23K26/04 , B23K26/035 , B23K26/361 , B23K26/0622 , B23K26/362 , B23K26/402 , C03C21/00 , B23K103/00
Abstract: Processes of chamfering and/or beveling an edge of a glass substrate of arbitrary shape using lasers are described herein. Two general methods to produce chamfers on glass substrates are the first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser to create perforations within the glass; followed by an ion exchange.
-
公开(公告)号：US10442719B2
公开(公告)日：2019-10-15
申请号：US14530410
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Helmut Schillinger , Sergio Tsuda , Robert Stephen Wagner
IPC: B23K26/02 , B23K26/08 , C03B33/02 , C03B33/08 , C03B33/09 , B23K26/53 , B24B9/10 , B23K26/04 , B23K26/035 , B23K26/361 , B23K26/0622 , B23K26/362 , B23K26/402 , C03C21/00 , B23K103/00
Abstract: Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a CO2 laser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or CO2 lasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.
-
Patent Agency Ranking
公开(公告)号：US20150165548A1
公开(公告)日：2015-06-18
申请号：US14530410
申请日：2014-10-31
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Helmut Schillinger , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: C03B33/0222 , B23K26/02 , B23K26/037 , B23K26/04 , B23K26/0624 , B23K26/083 , B23K26/0869 , B23K26/361 , B23K26/362 , B23K26/402 , B23K26/53 , B23K2103/50 , B23K2103/54 , B24B9/10 , C03B33/082 , C03B33/091 , C03C21/002 , Y02P40/57 , Y10T428/15 , Y10T428/24777
Abstract: Processes of chamfering and/or beveling an edge of a glass or other substrate of arbitrary shape using lasers are described herein. Three general methods to produce chamfers on glass substrates are disclosed. The first method involves cutting the edge with the desired chamfer shape utilizing an ultra-short pulse laser. Treatment with the ultra-short laser may be optionally followed by a CO2 laser for fully automated separation. The second method is based on thermal stress peeling of a sharp edge corner, and it has been demonstrated to work with different combination of an ultrashort pulse and/or CO2 lasers. A third method relies on stresses induced by ion exchange to effect separation of material along a fault line produced by an ultra-short laser to form a chamfered edge of desired shape.
Abstract translation: 本文描述了使用激光器对任意形状的玻璃或其它衬底的边缘进行倒角和/或斜切的工艺。 公开了在玻璃基板上制造倒角的三种一般方法。 第一种方法包括利用超短脉冲激光切割具有期望的倒角形状的边缘。 用超短激光治疗可以任选地跟随一个CO2激光器进行全自动分离。 第二种方法是基于锋利边缘角的热应力剥离，并且已经证明可以与超短脉冲和/或CO2激光器的不同组合一起工作。 第三种方法依赖于由离子交换引起的应力，以沿着由超短激光产生的断层线材料分离以形成所需形状的倒角边缘。
-
公开(公告)号：US10377658B2
公开(公告)日：2019-08-13
申请号：US15657320
申请日：2017-07-24
Applicant: Corning Incorporated
Inventor： Daniel Schnitzler , Helmut Schillinger
IPC: C03B33/02 , B23K26/00 , B23K26/53 , B23K26/073 , B23K26/08 , C03B33/09 , B23K26/0622 , B23K103/00 , B23K101/40
Abstract: A workpiece may be laser processed by a method that may include forming a contour line in the workpiece, and directing an infrared laser beam onto the workpiece along or near the contour line to separate the workpiece along the contour line. The contour line may include defects in the workpiece. The infrared laser beam may have a beam profile such that a greater distribution of cumulated energy from the infrared laser beam is located in areas adjacent to the contour line than directly on the contour line.
-
公开(公告)号：US20180179100A1
公开(公告)日：2018-06-28
申请号：US15812156
申请日：2017-11-14
Applicant: Corning Incorporated
Inventor： Sasha Marjanovic , Albert Roth Nieber , Garrett Andrew Piech , Helmut Schillinger , Sergio Tsuda , Robert Stephen Wagner
CPC classification number: C03B33/0222 , B23K26/0622 , B23K26/40 , B23K26/53 , B23K26/57 , B23K2103/172 , B23K2103/50 , C03B17/064 , C03B25/087 , C03B29/10 , C03B33/0215 , C03B33/07 , C03B33/091 , Y02P40/57 , Y10T428/24777 , Y10T428/249921
Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >1 m/sec, to cut sharp radii outer corners (
-
公开(公告)号：US20180029919A1
公开(公告)日：2018-02-01
申请号：US15657320
申请日：2017-07-24
Applicant: Corning Incorporated
Inventor： Daniel Schnitzler , Helmut Schillinger
IPC: C03B33/02 , B23K26/00 , B23K26/53 , B23K26/073
CPC classification number: C03B33/0222 , B23K26/0006 , B23K26/0624 , B23K26/0734 , B23K26/0738 , B23K26/08 , B23K26/53 , B23K2101/40 , B23K2103/54 , C03B33/091
Abstract: A workpiece may be laser processed by a method that may include forming a contour line in the workpiece, and directing an infrared laser beam onto the workpiece along or near the contour line to separate the workpiece along the contour line. The contour line may include defects in the workpiece. The infrared laser beam may have a beam profile such that a greater distribution of cumulated energy from the infrared laser beam is located in areas adjacent to the contour line than directly on the contour line.
-
公开(公告)号：US11904410B2
公开(公告)日：2024-02-20
申请号：US15285773
申请日：2016-10-05
Applicant: CORNING INCORPORATED
Inventor： Alejandro Antonio Becker , Tobias Christian Roeder , Helmut Schillinger , Ralf J Terbrueggen
IPC: B23K26/402 , C03B33/09 , B23K26/142 , B23K26/364 , B26F3/06 , B23K26/18 , C03C17/32 , B23K26/073 , B23K26/082 , C03B33/07 , B23K26/40 , B23K26/0622 , B26F3/00 , B23K103/00 , B23K103/16 , B23K101/34
CPC classification number: B23K26/402 , B23K26/0624 , B23K26/0738 , B23K26/082 , B23K26/142 , B23K26/18 , B23K26/364 , B23K26/40 , B26F3/002 , B26F3/06 , C03B33/074 , C03B33/091 , C03C17/32 , B23K2101/34 , B23K2103/172 , B23K2103/42 , B23K2103/54 , C03C2218/328
Abstract: A method for laser preparation of a coated substrate to be laser cut is provided. The method includes substantially removing a target portion of a polymer coating from a coated substrate by directing an ablative laser beam to the target portion, wherein the target portion of the polymer coating has a width of between about 10 μm and about 6.0 mm.
-
-
-
-
-
-
-
-
-
Search Results
15
records
(took 0.023 seconds)
