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公开(公告)号：US11214491B2
公开(公告)日：2022-01-04
申请号：US16763479
申请日：2018-11-16
Applicant: CORNING INCORPORATED , INSTITUTE OF PHOTONICS SCIENCES
Inventor： Therese Francoise Arliguie , Theresa Chang , Miriam Marchena Martín-Francés , Prantik Mazumder , Valerio Pruneri , Frederic Christian Wagner
IPC: C01B32/194 , B05D1/00 , B05D3/12
Abstract: A method of forming a functionalized device substrate is provided that includes the steps of: forming a graphene layer on a growth substrate; applying a polyimide layer to a glass, glass-ceramic or ceramic substrate, wherein a coupling agent couples the polyimide layer to the said substrate; coupling the polyimide layer to the graphene layer on the growth substrate; and peeling the growth substrate from the graphene layer.
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公开(公告)号：US20200308005A1
公开(公告)日：2020-10-01
申请号：US16763479
申请日：2018-11-16
Applicant: CORNING INCORPORATED , INSTITUTE OF PHOTONICS SCIENCES
Inventor： Therese Francoise Arliguie , Theresa Chang , Miriam Marchena Martín-Francés , Prantik Mazumder , Valerio Pruneri , Frederic Christian Wagner
IPC: C01B32/194 , B05D1/00 , B05D3/12
Abstract: A method of forming a functionalized device substrate is provided that includes the steps of: forming a graphene layer on a growth substrate; applying a polyimide layer to a glass, glass-ceramic or ceramic substrate, wherein a coupling agent couples the polyimide layer to the said substrate; coupling the polyimide layer to the graphene layer on the growth substrate; and peeling the growth substrate from the graphene layer.
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公开(公告)号：US20220380882A1
公开(公告)日：2022-12-01
申请号：US17752958
申请日：2022-05-25
Applicant: CORNING INCORPORATED , Fundació Institut de Ciències Fotòniques (ICFO) , Institució Catalana de Recerca i Estudis Avançats
Inventor： Rinu Abraham Maniyara , Daniel Martínez Cercós , Prantik Mazumder , Bruno Paulillo , Valerio Pruneri
Abstract: An article comprising: (i) a body, the body comprising a material and a transmittance greater than or equal to 90% throughout an electromagnetic radiation wavelength range of 250 nm to 800 nm; and (ii) cupric oxide (CuO) in direct contact with the material of the body, the cupric oxide (CuO) comprising a thickness that is less than or equal to 1.3 nm. Also disclosed is the article further comprising: an ultra-thin metal film disposed directly on the cupric oxide (CuO). The article demonstrates a transmittance greater than or equal to 65% throughout an electromagnetic radiation wavelength range of 300 nm to 1400 nm. The ultra-thin metal film can be silver (Ag), gold (Au), copper (Cu), or platinum (Pt). The ultra-thin metal film comprises a thickness within a range of 1 nm to 5 nm. The article at the ultra-thin metal film has a sheet resistance of less than or equal to 2100 Ω/□. Additionally, a method of forming the article.
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公开(公告)号：US20220098043A1
公开(公告)日：2022-03-31
申请号：US17546488
申请日：2021-12-09
Applicant: CORNING INCORPORATED , Fundació Institut de Ciències Fotòniques (ICFO) , Institució Catalana de Recerca i Estudis Avançats
Inventor： Therese Francoise Arliguie , Theresa Chang , Miriam Marchena Martín-Francés , Prantik Mazumder , Valerio Pruneri , Frederic Christian Wagner
IPC: C01B32/194 , B05D1/00 , B05D3/12
Abstract: A method of forming a functionalized device substrate is provided that includes the steps of: forming a conductive layer on a growth substrate; applying a polymeric layer to a device substrate, wherein a coupling agent couples the polymeric layer to the device substrate; coupling the polymeric layer to the conductive layer on the growth substrate; and peeling the growth substrate from the conductive layer.
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公开(公告)号：US11171094B2
公开(公告)日：2021-11-09
申请号：US16744776
申请日：2020-01-16
Applicant: CORNING INCORPORATED
Inventor： Prantik Mazumder , Chukwudi Azubuike Okoro , Ah-Young Park , Scott Christopher Pollard , Navaneetha Krishnan Subbaiyan
IPC: H01L23/495 , H01L23/00 , H01L23/15 , H01L21/48 , H01L23/498
Abstract: According to various embodiments, an article including a glass or glass-ceramic substrate having a first major surface and a second major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length, L, the via defining a first axial portion, a third axial portion, and a second axial portion disposed between the first and third axial portions. The article further includes a helium hermetic adhesion layer disposed on the interior surface in the first and/or third axial portions and a metal connector disposed within the via, the metal connector being adhered to the helium hermetic adhesion layer. The metal connector fully fills the via over the axial length, L, the via has a maximum diameter, Φmax, of less than or equal to 30 μm, and the axial length, L, and the maximum diameter, Φmax, satisfy an equation: L Φ max > 20 micron 1 / 2 .
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Patent Agency Ranking
公开(公告)号：US20210210359A1
公开(公告)日：2021-07-08
申请号：US17123576
申请日：2020-12-16
Applicant: CORNING INCORPORATED
Inventor： Philip Simon Brown , Mandakini Kanungo , Prantik Mazumder
IPC: H01L21/48 , H01L23/15 , H01L23/498
Abstract: A method of manufacturing a glass article comprising: forming a first layer of a first metal on a glass substrate, the glass substrate comprising silicon dioxide and aluminum oxide; subjecting the glass substrate with the first layer of the first metal to a first thermal treatment; forming a second layer of a second metal over the first layer of the first metal; and subjecting the second layer of the second metal to a second thermal treatment, the first thermal treatment and the second thermal treatment inducing intermixing of the first metal, the second metal, and at least one of aluminum, aluminum oxide, silicon, and silicon dioxide of the glass substrate to form a metallic region comprising the first metal, the second metal, aluminum oxide, and silicon dioxide. The first metal can be silver. The second metal can be copper.
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公开(公告)号：US10564157B2
公开(公告)日：2020-02-18
申请号：US15905011
申请日：2018-02-26
Applicant: Corning Incorporated
Inventor： Jeffrey Stapleton King , Prantik Mazumder , Elaine Victoria Seraya
IPC: G01N33/552 , G01N33/543 , G01N33/549
Abstract: An analyte capture device and related systems and methods are provided. The analyte capture device includes a glass material, an outer surface defined by the glass material, and a plurality of pores formed in the glass material along at least a portion of the outer surface. The analyte capture device is exposed to an environment containing an analyte for a period of time such that the analyte is captured within the plurality of pores of the glass material. The concentration of the analyte within the glass material is greater than a concentration of the analyte within the environment. The analyte capture device is then removed from the environment, and a property of the analyte within the analyte capture device is detected via an analyte detection system.
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公开(公告)号：US20200039872A1
公开(公告)日：2020-02-06
申请号：US15739321
申请日：2016-06-22
Applicant: CORNING INCORPORATED
Inventor： Robert Alan Bellman , Robert George Manley , Prantik Mazumder
Abstract: An article includes a carrier including a carrier bonding surface, a sheet including a sheet bonding surface, and a surface modification layer disposed on at least one of the carrier bonding surface and the sheet bonding surface. The surface modification layer includes a plasma polymerized material. The plasma polymerized material planarizes the at least one of the carrier bonding surface and the sheet bonding surface. The carrier bonding surface and the sheet bonding surface are bonded with the surface modification layer so that the carrier is temporarily bonded with the sheet. A method of making an article includes depositing a surface modification layer on at least one of a carrier bonding surface and a sheet bonding surface. The method further includes bonding the carrier bonding surface and the sheet bonding surface with the surface modification layer to temporarily bond the carrier with the sheet.
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公开(公告)号：US20180297324A1
公开(公告)日：2018-10-18
申请号：US15921034
申请日：2018-03-14
Applicant: Corning Incorporated
Inventor： Kaveh Adib , Robert Alan Bellman , Dana Craig Bookbinder , Theresa Chang , Shiwen Liu , Robert George Manley , Prantik Mazumder
Abstract: A method of controllably bonding a thin sheet having a thin sheet bonding surface with a carrier having a carrier bonding surface, by depositing a carbonaceous surface modification layer onto at least one of the thin sheet bonding surface and the carrier bonding surface, incorporating polar groups with the surface modification layer, and then bonding the thin sheet bonding surface to the carrier bonding surface via the surface modification layer. The surface modification layer may include a bulk carbonaceous layer having a first polar group concentration and a surface layer having a second polar group concentration, wherein the second polar group concentration is higher than the first polar group concentration. The surface modification layer deposition and the treatment thereof may be performed by plasma polymerization techniques.
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公开(公告)号：US20180246091A1
公开(公告)日：2018-08-30
申请号：US15905011
申请日：2018-02-26
Applicant: Corning Incorporated
Inventor： Jeffrey Stapleton King , Prantik Mazumder , Elaine Victoria Seraya
IPC: G01N33/552 , G01N33/543
Abstract: An analyte capture device and related systems and methods are provided. The analyte capture device includes a glass material, an outer surface defined by the glass material, and a plurality of pores formed in the glass material along at least a portion of the outer surface. The analyte capture device is exposed to an environment containing an analyte for a period of time such that the analyte is captured within the plurality of pores of the glass material. The concentration of the analyte within the glass material is greater than a concentration of the analyte within the environment. The analyte capture device is then removed from the environment, and a property of the analyte within the analyte capture device is detected via an analyte detection system.
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